Author: claimsbot

1. An optical module, comprising:
at least one light-receiving element configured to convert an incident optical signal to an electric signal, the at least one light-receiving element including;
a mesa part configured to laminate at least a first semiconductor layer, a light absorption semiconductor layer that absorbs an optical signal entering from a light reception surface, and a second semiconductor layer,
an electrode part disposed on a top of the mesa part, and
a wiring part that covers a part of a side surface of the mesa part and that is disposed so as to extend from a part of an outer periphery of the electrode part toward an outside of the mesa part; and
a lens configured to condense an optical signal from an optical fiber onto the light reception surface of the at least one light-receiving element,
wherein the wiring part is disposed at a position based on an intensity distribution of the optical signal on the light reception surface.
2. The optical module according to claim 1, wherein the wiring part is disposed along a longitudinal direction of the intensity distribution.
3. The optical module according to claim 2, wherein the intensity distribution has an elliptical shape, and wherein the wiring part is disposed along a long axis direction of the elliptical shape.
4. The optical module according to claim 1, wherein a center of the light reception surface of the at least one light-receiving element is disposed so as to be deviated to a first direction perpendicular to an optical axis of the lens, and wherein the wiring part is disposed at a position along a second direction opposite to the first direction.
5. The optical module according to claim 4, wherein the at least one light-receiving element comprises a back-illuminated light-receiving element.
6. The optical module according to claim 1, wherein the at least one light-receiving element is disposed so as to incline a normal direction of the light reception surface with respect to an optical axis of the lens, and wherein the wiring part is disposed at a position along a direction of the inclination.
7. The optical module according to claim 6, wherein the at least one light-receiving element comprises one of a back-illuminated light-receiving element and a front-illuminated light-receiving element.
8. The optical module according to claim 1, further comprising: a plurality of band-pass filters aligned in line, through which the optical signal from the optical fiber enters; and
a total reflection mirror which reflects the optical signal reflected on surfaces of the plurality of band-pass filters and which is disposed in opposite to the plurality of band-pass filters;
wherein the at least one light-receiving element comprises a plurality of the light-receiving elements aligned in a predetermined interval, and
wherein the condenser lens condenses each of the optical signals exited from the plurality of band-pass filters onto each of the light reception surfaces of the plurality of the light-receiving elements.
9. The optical module according to claim 1,
wherein the mesa part further includes a reflection layer between the light absorption semiconductor layer and the first semiconductor layer,
wherein the electrode part has a ring shape, and
wherein the optical signal from the optical fiber enters via the lens to the mesa part and is absorbed in the light absorption semiconductor layer, and thereafter, at least apart of the optical signal is further reflected in the reflection layer.
10. An optical module, comprising:
a light-receiving element configured to convert an incident optical signal to an electric signal, the light-receiving element including:
a mesa part configured to laminate at least a first semiconductor layer, a light absorption semiconductor layer that absorbs an optical signal entering from a light reception surface to convert the optical signal to an electric signal, and a second semiconductor layer;
an electrode part formed on a top of the mesa part; and
a wiring part formed by elongating from a part of an outer periphery of the electrode part toward an outside of the mesa part so as to cover a part of side faces of the mesa part; and
a lens for condensing an optical signal from an optical fiber onto the light reception surface of the light-receiving element,
wherein a center axis of the light reception surface of the light-receiving element is disposed so as to be deviated to a first direction perpendicular to an optical axis of the lens, and
wherein the wiring part is disposed at a position along a second direction opposite to the first direction.
11. The optical module according to claim 10, wherein the light-receiving element comprises a back-illuminated light-receiving element.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A silicon solar cell having at least one contacting, comprising:
a pre-processed silicon substrate having a frontside and a backside;
an aluminum layer on the backside of the pre-processed silicon substrate comprising
an outer surface, and
aluminum-free regions arranged in the form of arrays; and

a silver-free layer suitable for soldering, the silver-free layer suitable for soldering covering the aluminum-free regions and substantially covering the entire outer surface of the aluminum layer on the backside.
2. The silicon solar cell of claim 1, a dielectric layer being provided on the backside of the pre-processed silicon substrate beneath the aluminum layer, the dielectric layer comprising at least one of the subsequent compounds: silicon nitride, silicon oxide, silicon carbide, amorphous silicon, aluminum oxide.
3. The silicon solar cell of claim 1, wherein spot-like electrical connections between the aluminum layer and the pre-processed silicon substrate are provided.
4. The silicon solar cell of claim 1, wherein aluminum contact points between the aluminum layer and the pre-processed silicon substrate are provided.
5. The silicon solar cell of claim 1, the aluminum layer comprising a thickness of 10 to 100 \u03bcm and the silver-free layer suitable for soldering having a thickness of 10 to 100 nm.
6. The silicon solar cell of claim 1, the arrays of aluminum-free regions being arranged in rows.
7. The silicon solar cell of claim 1, the arrays of aluminum-free regions having a width of less than 1 mm.
8. The silicon solar cell of claim 1, the arrays of aluminum-free regions having a width of less than 0.5 mm.
9. The silicon solar cell of claim 1, the silver-free layer suitable for soldering consisting of any of nickel-vanadium, nickel, copper, tin and zinc.
10. A silicon solar cell comprising:
a pre-processed silicon substrate having a frontside and a backside and contact regions for connecting to further solar cells;
an aluminum layer positioned on the backside of the silicon substrate and having an outer surface;
at least one first contact region for forming an electrical connection on the backside of the pre-processed silicon substrate, the first contact region comprising a silver-free layer suitable for soldering on the aluminum layer and substantially covering the entire outer surface of the aluminum layer, and
at least a second contact region for forming a mechanical connection on the backside of the pre-processed silicon substrate, the second contact region comprising a silver-free layer suitable for soldering in an aluminum-free region of the silicon substrate.
11. The silicon solar cell of claim 10, the pre-processed silicon substrate comprising a dielectric layer beneath the aluminum layer.
12. The silicon solar cell of claim 11, the area of the first contact region being at least ten times larger than the area of the second contact region.

1. A packaged light emitting device comprising:
a substrate having an upper surface;
a solid state light emitting device on the substrate;
a transparent dam on the substrate defining a cavity above the solid state light emitting device, the transparent dam; and
an encapsulant within the cavity.
2. The packaged light emitting device of claim 1, further comprising a die attach pad on the upper surface of the substrate, wherein the solid state lighting device is on the die attach pad.
3. The packaged light emitting device of claim 1, wherein the transparent dam has a first index of refraction and the encapsulant has a second index of refraction that is different from the first index of refraction.
4. The packaged light emitting device of claim 3, wherein the second index of refraction is higher than the first index of refraction.
5. The packaged light emitting device of claim 3, wherein the encapsulant comprises a first encapsulant, the method further comprising:
a meniscus control feature on the upper surface of the substrate and surrounding the transparent dam; and
a second encapsulant on the substrate within a region defined by the third meniscus control feature, the third encapsulant covering the transparent dam and the first encapsulant and having a third index of refraction that is different from the first index of refraction or the second index of refraction.
6. The packaged light emitting device of claim 5, wherein the third index of refraction is higher than the first index of refraction.
7. The packaged light emitting device of claim 5, wherein the third index of refraction is higher than the second index of refraction.
8. packaged light emitting device of claim 5, wherein the third index of refraction is higher than the first index of refraction and is the same as the second index of refraction.
9. The packaged light emitting device of claim 3, wherein the second encapsulant comprises silicone gel andor epoxy resin.
10. The packaged light emitting device of claim 3, wherein the second encapsulant comprises a second wavelength conversion material.
11. The packaged light emitting device of claim 1, wherein the transparent dam is toroidal.
12. The packaged light emitting device of claim 1, wherein the transparent dam comprises cured encapsulant material.
13. The packaged light emitting device of claim 1, wherein the transparent dam andor the encapsulant comprises silicone gel andor epoxy resin.
14. The packaged light emitting device of claim 1, wherein the encapsulant comprises a first wavelength conversion material and the transparent dam comprises a second wavelength conversion material.
15. A method of forming a packaged light emitting device, comprising:
forming a transparent dam on the upper surface of the substrate that defines a cavity above a die attach region on the upper surface of the substrate;
mounting a solid state light emitting device on the die attach region in the encapsulant region; and
dispensing an encapsulant material over the solid state lighting device within the cavity defined by the transparent dam.
16. The method of claim 15, further comprising a die attach pad in the die attach region, wherein the solid state lighting device is on the die attach pad.
17. The method of claim 15, wherein the transparent dam has a first index of refraction and the encapsulant has a second index of refraction that is different from the first index of refraction.
18. The method of claim 17, wherein the second index of refraction is higher than the first index of refraction.
19. The method of claim 17, further comprising:
forming a meniscus control feature on the substrate surrounding the transparent dam;
dispensing a second encapsulant material within a region defined by the third meniscus control feature, wherein the second encapsulant material has a third index of refraction that is different from the first index of refraction or the second index of refraction; and
curing the second encapsulant material.
20. The method of claim 19, wherein the third index of refraction is higher than the first index of refraction.
21. The method of claim 19, wherein the third index of refraction is higher than the second index of refraction.
22. The method of claim 19, wherein the third index of refraction is higher than the first index of refraction and is the same as the second index of refraction.
23. A packaged light emitting device comprising:
a substrate having an upper surface;
a die attach pad on the upper surface of the substrate, the die attach pad configured to receive a solid state light emitting device;
a first meniscus control feature on the substrate, the first meniscus control feature surrounding the die attach pad and configured to limit the flow of a liquid encapsulant material, and
a second meniscus control feature on the substrate, the second meniscus control feature surrounding the first meniscus control feature and configured to limit the flow of a liquid encapsulant material;
wherein the first meniscus control feature and the second meniscus control feature define an encapsulant region of the upper surface of the substrate surrounding the first encapsulant region;
a solid state light emitting device on the die attach pad;
a first encapsulant on the substrate within the encapsulant region defined by the first meniscus control feature and the second meniscus control feature, the first encapsulant having a first index of refraction and comprising a wavelength conversion material and defining a cavity above the solid state light emitting device;
a second encapsulant within the cavity, the second encapsulant having a second index of refraction that is different from the first index of refraction.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for packaging an antenna in a communication device, comprising:
coupling an antenna to a printed circuit board such that said antenna is mechanically supported thereby;
positioning a hollow shaft of a control knob over said antenna and at least a portion of said printed circuit board such that said antenna is embedded within said control knob; and
mechanically securing said control knob to a housing of said communication device.
2. The method according to claim 1, further comprising providing a watertight seal between said control knob and said housing.
3. The method according to claim 1, wherein said control knob is mechanically secured to said housing such that it can move in a radial direction and a vertical direction relative to said housing.
4. The method according to claim 1, wherein said antenna is mechanically supported by said printed circuit board such that said hollow shaft is able to move freely thereover without coming in contact therewith.
5. The method according to claim 1, further comprising circumscribing said hollow shaft with a resilient member for returning said control knob to a rest position after being depressed.
6. The method according to claim 1, further comprising disposing a switch adjacent to an end portion of said hollow shaft such that said hollow shaft can actuate said switch in response to a radial movement or a vertical movement of said control knob.
7. A control knob assembly, comprising:
a printed circuit board;
an antenna mechanically supported by said printed circuit board; and
a hollow shaft disposed over said antenna and at least a portion of said printed circuit board such that said antenna is embedded within said control knob assembly.
8. The control knob assembly of claim 7, further comprising a support structure to which said control knob and said printed circuit board are mechanically secured.
9. The control knob assembly of claim 8, wherein said control knob is mechanically secured to said support structure such that it can move in a radial direction and a vertical direction relative to said support structure.
10. The control knob assembly of claim 8, further comprising a gasket circumscribing said hollow shaft for providing a watertight seal between said control knob and a support structure.
11. The control knob assembly of claim 7, wherein said antenna is mechanically supported by said printed circuit board such that said hollow shaft is able to move freely thereover without coming in contact therewith.
12. The control knob assembly of claim 7, further comprising a resilient member circumscribing said hollow shaft for returning said control knob assembly to a rest position after being depressed.
13. The control knob assembly of claim 7, further comprising a switch disposed adjacent to an end portion of said hollow shaft such that said hollow shaft can actuate said switch in response to a radial movement or a vertical movement of said control knob assembly.
14. A communication device, comprising:
a housing;
a printed circuit board coupled to said housing;
an antenna mechanically coupled to and supported by said printed circuit board; and
a control knob assembly having a hollow shaft disposed over said antenna and at least a portion of said printed circuit board such that said antenna is embedded within said control knob assembly.
15. The communication device of claim 14, wherein said control knob assembly is mechanically coupled to said housing such that it can move in a radial direction and a vertical direction relative to said support structure.
16. The communication device of claim 14, further comprising a gasket circumscribing said hollow shaft for providing a watertight seal between said control knob assembly and said housing.
17. The communication device of claim 14, wherein said antenna is mechanically supported by said printed circuit board such that said hollow shaft is able to move freely thereover without coming in contact therewith.
18. The communication device of claim 14, further comprising a resilient member circumscribing said hollow shaft for returning said control knob assembly to a rest position after being depressed.
19. The communication device of claim 14, further comprising a switch disposed adjacent to an end portion of said hollow shaft such that said hollow shaft can actuate said switch in response to a radial movement or a vertical movement of said control knob assembly.
20. A communication device, comprising:
a housing containing at least one of a radio transmitter and a radio receiver;
a control knob disposed on an exterior of said housing and configured to control at least one function of said communication device in response to at least one of a rotation movement and an axial movement of said control knob;
an antenna disposed within said control knob coupled to at least one of said radio transmitter and said radio receiver.
21. The communication device according to claim 20, wherein said control knob is coupled to at least one control shaft.
22. The communication device according to claim 21, wherein said control knob is configured to cause said control shaft to actuate at least one electronic component of said communication device in response to at least one of said rotation movement and said axial movement.
23. The communication device according to claim 22, wherein said electronic component is a switch.
24. The communication device according to claim 20 wherein said antenna is coupled to a GPS receiver.