Author: claimsbot

1. An electroluminescence display device comprising:
a display panel having a display portion in which pixels are arranged in a matrix and a horizontal scan driver circuit and a vertical scan driver circuit each of which is formed at a periphery of the display portion and each of which drives the pixels, wherein
an external connection terminal is placed on a first side of the display panel,
one of the horizontal scan driver circuit and the vertical scan driver circuit is placed on a second side which opposes the first side and the other of the horizontal scan driver circuit and the vertical scan driver circuit is placed on a third side which is one of two sides connecting the first side and the second side, and
each of a power supply line for the horizontal scan driver circuit and a power supply line for the vertical scan driver circuit extends from the external connection terminal to a region of formation of a corresponding one of the horizontal scan driver circuit and the vertical scan driver circuit without passing through a side other than the first side, the second side, and the third side.
2. An electroluminescence display device according to claim 1, wherein
the vertical scan driver circuit is formed on the second side along the vertical scan direction.
3. An electroluminescence display device according to claim 2, wherein
the power supply line for the horizontal scan driver circuit and the power supply line for the vertical scan driver circuit are connected to a common external connection terminal.
4. An electroluminescence display device according to claim 2, wherein
the power supply line for the horizontal scan driver circuit and the power supply line for the vertical scan driver circuit are connected in series.
5. An electroluminescence display device according to claim 4, wherein
of the power supply line for the horizontal scan driver circuit and the power supply line for the vertical scan driver circuit, a power supply line having a longer line distance from the external connection terminal has a narrower width than a power supply line having a shorter line distance from the external connection terminal.
6. An electroluminescence display device according to claim 4, wherein
the power supply line for the horizontal scan driver circuit and the power supply line for the vertical scan driver circuit include a line for a higher voltage power supply and a line for a lower voltage power supply, at least one of which are provided in a plurality, and
the plurality of power supply lines are electrically connected to each other by a bypass line which is formed of a conductive layer different from a material for the power supply line at least at an end region of a driver circuit, of the horizontal scan driver circuit and the vertical scan driver circuit, having a shorter power supply line distance from the external connection terminal.
7. An electroluminescence display device according to claim 1, wherein
the power supply line for the horizontal scan driver circuit and the power supply line for the vertical scan driver circuit are connected to a common external connection terminal.
8. An electroluminescence display device according to claim 1, wherein
the power supply line for the horizontal scan driver circuit and the power supply line for the vertical scan driver circuit are connected in series.
9. An electroluminescence display device according to claim 8, wherein
of the power supply line for the horizontal scan driver circuit and the power supply line for the vertical scan driver circuit, a power supply line having a longer line distance from the external connection terminal has a narrower width than a power supply line having a shorter line distance from the external connection terminal.
10. An electroluminescence display device according to claim 8, wherein
the power supply line for the horizontal scan driver circuit and the power supply line for the vertical scan driver circuit include a line for a higher voltage power supply and a line for a lower voltage power supply, at least one of which are provided in a plurality, and
the plurality of power supply lines are electrically connected to each other by a bypass line which is formed of a conductive layer different from a material for the power supply line at least at an end region of a driver circuit, of the horizontal scan driver circuit and the vertical scan driver circuit, having a shorter power supply line distance from the external connection terminal.
11. An electroluminescence display device according to claim 1, wherein
the power supply line for the horizontal scan driver circuit and the power supply line for the vertical scan driver circuit are connected to a common external connection terminal, branch on a line route extending from the common external connection terminal, and are connected to the respective driver circuits.
12. An electroluminescence display device according to claim 1, wherein
each of a signal line for the horizontal scan driver circuit and a signal line for the vertical scan driver circuit extends from the external connection terminal to a region of formation of a corresponding one of the horizontal scan driver circuit and the vertical scan driver circuit without passing through a side other than the first side, the second side, and the third side.
13. An electroluminescence display device according to claim 1, wherein
the first side is a side along the vertical scan direction of the display panel.
14. An electroluminescence display device according to claim 1, wherein
the third side is a side along the horizontal scan direction of the display panel and which opposes a side on which a common line for a drive power supply line for supplying drive power to an electroluminescence element in each pixel is placed.
15. An electroluminescence display device, comprising:
a display panel having a display portion in which pixels are arranged in a matrix and a horizontal scan direction driver circuit and a vertical scan direction driver circuit each of which is formed at a periphery of the display portion and each of which drives the pixels, wherein
an external connection terminal is placed on a first side of the display panel, and
the vertical scan driver circuit is placed on a second side which opposes the first side.
16. An electroluminescence display device according to claim 15, wherein
the horizontal scan driver circuit is placed on a third side which is one of two sides connecting the first side and the second side.
17. An electroluminescence display device according to claim 15, wherein
a contact region between a common electrode of an electroluminescence element in each pixel and a common electrode line extending from an external connection terminal corresponding to the common electrode is placed on the first side.
18. An electroluminescence display device, comprising:
a display panel having a display portion in which pixels are arranged in a matrix and a horizontal scan driver circuit and a vertical scan driver circuit each of which is formed at a periphery of the display portion and each of which drives the pixels, wherein
an external connection terminal is placed on a first side of the display panel and the horizontal scan driver circuit is placed on a third side which is one of two sides connecting the first side and a second side which opposes the first side.
19. An electroluminescence display device according to claim 18, wherein
a contact region between a common electrode of an electroluminescence element in each pixel and a common electrode line extending from an external connection terminal corresponding to the common electrode is placed on the first side.
20. An electroluminescence display device having, on a display panel, a display portion in which pixels are arranged in a matrix, wherein
external connection terminals are placed on a lateral side of the display panel along a vertical scan direction,
the external connection terminals include a terminal for a horizontal scan driver circuit, a terminal for a cathode power supply, and a terminal for a pixel drive power supply, and
an order of arrangement of these terminals is, from an upper side along the vertical scan direction of the display panel, the terminal for the horizontal scan driver circuit, the terminal for the cathode power supply, and the terminal for the pixel drive power supply.
21. An electroluminescence display device according to claim 20, wherein
the external connection terminals further includes a terminal for a vertical scan driver circuit, and
the terminal for the vertical scan driver circuit is provided at an upper position along the vertical scan direction than is the terminal for the horizontal scan driver circuit.
22. An electroluminescence display device according to claim 20, wherein
the horizontal scan driver circuit is provided adjacent to an upper side of the display portion of the display panel;
a cathode power supply connection portion is provided on a side adjacent to the lateral side of the display portion on which the external connection terminals are placed,
a vertical scan driver circuit is provided adjacent to another lateral side of the display portion, and
a pixel drive power supply line is provided adjacent to a lower side of the display portion.
23. An electroluminescence display device according to claim 22, wherein
a center of the group of external connection terminals which are provided is placed at a lower position than a center position of the display portion along the vertical scan direction.
24. An electroluminescence display device according to claim 22, wherein
a level shifter which shifts a signal level of at least one of a clock signal and a vertical start signal to be supplied to the vertical scan driver circuit is placed at a corner formed by a side on which the vertical driver circuit is provided and a side on which a line for the signal for which the signal level is to be shifted is placed.
25. An electroluminescence display device having, on a display panel, a display portion in which pixels are arranged in a matrix, wherein
external connection terminals are placed on a lateral side of the display panel along a vertical scan direction, and
of the external connection terminals, a terminal for a pixel drive power supply is placed at a position lower than a center position of the display panel along the vertical scan direction.
26. An electroluminescence display device according to claim 25, wherein
the vertical scan driver circuit is placed on a lateral side of the display panel which opposes the lateral side on which the external connection terminals are placed.
27. An electroluminescence display device according to claim 26, wherein
a level shifter which shifts a signal level of at least one of a clock signal and a vertical start signal to be supplied to the vertical scan driver circuit is placed at an end at which a side on which the vertical scan driver circuit is placed and a side on which a line for the signal for which the signal level is to be shifted is placed cross each other.
28. An electroluminescence display device having, on a display panel, a display portion in which pixels are arranged in a matrix, wherein
an external connection terminal is placed along a lateral side of the display panel, and
a vertical scan driver circuit is placed on a lateral side of the display panel which opposes the lateral side on which the external connection terminal is placed.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for providing an optimized audio quality communication session between a near end and at least a far end telecommunications terminals, each telecommunications terminal having a codec, while at least the codec of the near end telecommunications terminal being able to apply two alternative encoding techniques belonging to the same audio compression protocol, the telecommunications method comprising the steps of:
setting up a communication session between the two telecommunications terminals by fixing the audio compression protocol to be used between the two codecs;
sending from the near end telecommunications terminal towards the far end telecommunications terminal a data packet using the encoding technique based on the most technically demanding alternative;
receiving by the near end telecommunications terminal a data packet from the far end telecommunications terminal;
whereby the further steps of:
determining by the near end telecommunications terminal out of said received data packet the encoding technique used by the far end telecommunications terminal;
in case said determined encoding technique being based on a different alternative encoding technique of the audio compression protocol then adapting the encoding technique to be used by the near end telecommunications terminal to said determined encoding technique when proceeding said communication session,
wherein said codec of the near end telecommunications terminal is operable to apply the two alternative encoding techniques belonging to the same audio compression protocol.
2. The method according to claim 1 whereby adapting the encoding technique to be used by the near end telecommunications terminal to the less technically demanding encoding technique determined out of data packets received from some far end telecommunications terminal when proceeding said communication session with more than one far end telecommunications terminal.
3. The method according to claim 1 whereby adapting the encoding technique to be used by the near end telecommunications terminal to the initially used more technically demanding encoding technique when no more data packet using the less technically demanding alternative will be received.
4. The method according to claim 1 whereby the most technically demanding alternative encoding technique corresponding to a wide-band encoding technique.
5. The method according to claim 1 whereby the most technically demanding alternative encoding technique corresponding to an encoding technique comprising voice activity detection and possibly comfort noise generation.
6. A near end telecommunications terminal comprising a codec operable to apply two alternative encoding techniques belonging to the same audio compression protocol for a communication session with at least a far end telecommunications terminal while the codec of the near end telecommunications terminal to send a first data packet uses the encoding technique based on the most technically demanding alternative of the audio compression protocol fixed during a previous set up of a communication session between the two telecommunications terminals wherein the near end telecommunications terminal comprises reading means to determine the alternative encoding technique out of the data packet received from the far end telecommunications terminal such that the alternative encoding technique is used by the codec from the near end telecommunications terminal when proceeding with the communication session,
wherein said codec of the near end telecommunications terminal is operable to apply the two alternative encoding techniques belonging to the same audio compression protocol.
7. The near end telecommunications terminal according to claim 6 wherein the most technically demanding alternative encoding technique corresponds to a wide-band encoding technique.
8. The near end telecommunications terminal according to claim 6 wherein the most technically demanding alternative encoding technique corresponds to an encoding technique comprising voice activity detection and possibly comfort noise generation.
9. A computer readable medium having a computer program recorded thereon, the computer program comprising codes which perform the following steps when said computer program is run on a near end telecommunications terminal comprising a codec operable to apply two alternative encoding techniques belonging to the same audio compression protocol after a setting up of a communication session between this near end telecommunications terminal and a far end telecommunications terminal during which the audio compression protocol to be used between the codecs of the near end and the far end telecommunications terminals to be fixed:
sending from the near end telecommunications terminal towards the far end telecommunications terminal a data packet using the encoding technique based on the most technically demanding alternative;
receiving by the near end telecommunications terminal a data packet from the far end telecommunications terminal;
determining by the near end telecommunications terminal out of said received data packet the encoding technique used by the far end telecommunications terminal;
wherein said determined encoding technique is based on a different alternative encoding technique of the audio compression protocol then the encoding technique to be used by the near end telecommunications terminal when initiating said communication session,
wherein said codec of the near end telecommunications terminal is operable to apply the two alternative encoding techniques belonging to the same audio compression protocol.

What is claimed is:

1. A composite material comprising; a quartz glass phase; and a complex compound phase compounded with the quartz glass phase, which is made of one or more compounds selected from a group of silicon carbide, silicon nitride, silicon, titanium nitride and titanium carbide, as a main ingredient.
2. The composite material according to claim 1, wherein an amount of the quartz glass phase is 10-95 wt %.
3. The composite material according to claim 2, wherein an amount of the quartz glass phase is 80-95 wt %.
4. The composite material according to claim 1, wherein the compound is selected from a group of silicon carbide, silicon nitride and silicon.
5. The composite material according to claim 1, wherein the compound is selected from a group of silicon carbide, silicon, titanium nitride and titanium carbide.
6. The composite material according to claim 1, wherein an open porosity is lower than 15%.
7. The composite material according to claim 6, wherein a total amount of impurities other than quartz glass, elements constituting the compound and halogen is lower than 0.1 wt %, and an open porosity is lower than 5%.
8. A method of producing a composite material, comprising the steps of:
mixing a quartz glass powder and a compound powder made of one or more compounds selected from the group of silicon carbide, silicon nitride, silicon, titanium nitride and titanium carbide to obtain mixtures;
forming the mixtures to obtain a formed body; and
sintering the formed body at a temperature which is lower than the melting point of quartz glass and is lower than the melting point of the compound.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A high electrical performance semiconductor package, comprising:
a carrier having a first surface, a second surface opposite to the first surface, and a plurality of conductive vias for electrically connecting the first surface to the second surface;
at least one chip attached to the first surface of the carrier;
a plurality of via lands disposed on a peripheral area of the first surface of the carrier and electrically connected to the conductive vias;
a plurality of fingers disposed around the chip and electrically connected to the corresponding via lands by conductive traces formed on the first surface of the carrier;
a plurality of bonding wires for electrically connecting the chip to the fingers, wherein lengths of the bonding wires for transmitting differential pair signals are substantially equal, and lengths of the conductive traces for transmitting the differential pair signals are substantially equal; and
a plurality of conductive regions disposed on the second surface of the carrier and electrically connected to the conductive vias.
2. The high electrical performance semiconductor package of claim 1, wherein the carrier is a substrate.
3. The high electrical performance semiconductor package of claim 1, wherein the plurality of via lands are arranged in multiple rows on the peripheral area of the first surface of the carrier.
4. The high electrical performance semiconductor package of claim 1, wherein the plurality of via lands are located at edges of the conductive vias on the first surface of the carrier.
5. The high electrical performance semiconductor package of claim 1, wherein the plurality of conductive regions are arranged in multiple rows on a peripheral area of the second surface of the carrier.
6. The high electrical performance semiconductor package of claim 1, wherein the plurality of conductive regions are located close to the conductive vias on the second surface of the carrier.
7. The high electrical performance semiconductor package of claim 1, wherein a portion of the fingers are spaced apart from the chip by a substantially constant distance to make the lengths of the bonding wires for transmitting the differential pair signals substantially equal.
8. The high electrical performance semiconductor package of claim 1, wherein a portion of the conductive traces are curved to make the lengths of the conductive traces for transmitting the differential pair signals substantially equal.
9. The high electrical performance semiconductor package of claim 1, wherein all the fingers are spaced apart from the chip by a substantially constant distance.
10. The high electrical performance semiconductor package of claim 1, wherein all the bonding wires are substantially equal in length.
11. The high electrical performance semiconductor package of claim 1, wherein all the conductive traces for electrically connecting the fingers to the via lands are substantially equal in length.
12. The high electrical performance semiconductor package of claim 1, wherein the conductive regions are lands.
13. The high electrical performance semiconductor package of claim 1, wherein the conductive regions are ball pads.
14. The high electrical performance semiconductor package of claim 1, further comprising an encapsulant for encapsulating the chip and the bonding wires.