Author: claimsbot

What is claimed is:

1. A moulded article comprising thermoplastic polyurethane (TPU), said article characterized in having condensate value of <2 mg10 g of TPU in the fogging test according to DIN 75201B at 120 C. over 16 hours, wherein TPU is the product of reacting, optionally in the presence of a catalyst,
A) an organic diisocyante, with
B) polyester polyol having number average molecular weight of 600 to 10 000 gmol and content of 1:1 ring esters of dicarboxylic acid and diol of <0.2% relative to the weight of said polyester polyol, and
C) at least one chain extender having average molecular weight of 60 to 500 gmol, selected from the group consisting of diol and diamine.
wherein the equivalence ratio of diisocyanate A) to polyol B) is between 1.5:1.0 and 10.0:1.0 and wherein the NCO index is 95 to 105.
2. The article of claim 1 wherein the content of the ring esters is <0.15%.
3. The article of claim 1 wherein B) further contains at least one member having a number average molecular weight of 600 to 10 000 gmol selected from the group consisting of polyether polyol and polycarbonate diol in an amount up to 80% relative to the weight of said polyester polyol.
4. The article of claim 1 wherein number average molecular weight of B) is 600 to 5 000 gmol.
5. The article of claim 1 wherein TPU contains conventional additives for their art-recognized function.
6. The article of claim 3 wherein the amount is up to 70%.
7. The article of claim 1 wherein the organic diisocyanate is at least one member selected from the group consisting of hexamethylene diisocyanate, dicyclohexylmethane diisocyanate and isophorone diisocyanate.
8. The article of claim 1 wherein the chain extender comprise 80 to 100 percent relative to its weight of 1,6-hexanediol and 0 to 20 wt. % of a chain extender which is different from 1,6-hexanediol.
9. The article of claim 1, wherein TPU is the product of reacting, optionally in the presence of a catalyst,
A) at least one organic diisocyanate selected from the group consisting of hexamethylene diisocyanate, dicyclohexylmethane diisocyanate, and isophorone diisocyanate,
B) a mixture of 20 to 80% relative to the weight of the mixture of polyester polyol having a number average molecular weight of 600 to 5000 gmol and 20 to 80% relative to the weight of the mixture of polytetrahydrofuran diol having a number average molecular weight of 600 to 1500 gmol, said mixture containing less than 0.2%, relative to the weight of polyester, of 1:1 ring esters of dicarboxylic acid and diol; and
C) chain extender in the form of a mixture of 80 to 100% relative to the weight of C) of 1,6-hexanediol and 0 to 20% relative to the weight of C) of a chain extender with a number average molecular weight of 60 to 500 gmol which is different from 1,6-hexanediol.
10. The article of claim 9, wherein the TPU further contains conventional additives for their art-recognized function.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A light-emitting diode illumination circuit comprising:
light-emitting diodes connected in series; and
compensating elements connected in parallel with the light-emitting diodes, wherein,
each of the compensating elements includes (a) positive and negative terminals and (b) at least one conductor having a predetermined melting point, the conductor melting in the event of open-circuit failure so that the terminals are connected,
each of the compensating elements further includes (a) a resistor between the two terminals and (b) an insulator between the two terminals, and

the conductor is disposed at or near each of joints between the two terminals and the insulator, receives heat transferred from the resistor through the insulator, and melts after reaching a predetermined temperature.
2. A light-emitting diode illumination circuit comprising:
light-emitting diodes connected in series; and
compensating elements connected in parallel with the light-emitting diodes, wherein,
each of the compensating elements includes (a) positive and negative terminals and (b) at least one conductor having a predetermined melting point, the conductor melting in the event of open-circuit failure so that the terminals are connected,
each of the compensating elements further includes (a) a casing, (b) a resistor having terminals at both ends thereof, (c) a low-resistance conductor having terminals at both ends thereof, and (d) an elastic member configured to push the low-resistance conductor against the resistor,
the conductor is provided as a support so as to support the low-resistance conductor with respect to the resistor, and
if the support melts after reaching a predetermined temperature, elastic force of the elastic member brings the low-resistance conductor into contact with the resistor to electrically connect the terminals of the low-resistance conductor to the corresponding terminals of the resistor.
3. A light-emitting diode illumination circuit comprising:
light-emitting diodes connected in series; and
compensating elements connected in parallel with the light-emitting diodes, wherein,
each of the compensating elements includes (a) positive and negative terminals and (b) at least one conductor having a predetermined melting point, the conductor melting in the event of open-circuit failure so that the terminals are connected,
each of the compensating elements further includes (a) a resistor having terminals at both ends thereof, a first auxiliary terminal on one of the terminals, and a second auxiliary terminal on the other terminal and (b) a low-resistance conductor having terminals at both ends thereof, a third auxiliary terminal on one of the terminals, and a fourth auxiliary terminal on the other terminal,
the conductor is provided as a support between the second auxiliary terminal of the resistor and the fourth auxiliary terminal of the low-resistance conductor so as to maintain a predetermined distance between the first auxiliary terminal of the resistor and the third auxiliary terminal of the low-resistance conductor, and
if the support melts after reaching a predetermined temperature, the third auxiliary terminal of the low-resistance conductor comes into contact with the first auxiliary terminal of the resistor and the fourth auxiliary terminal of the low-resistance conductor is connected to the second auxiliary terminal of the resistor through the melted support.
4. A light-emitting diode illumination circuit comprising:
light-emitting diodes connected in series; and
compensating elements connected in parallel with the light-emitting diodes, wherein,
each of the compensating elements includes (a) positive and negative terminals and (b) at least one conductor having a predetermined melting point, the conductor melting in the event of open-circuit failure so that the terminals are connected,
each of the compensating elements further includes (a) a resistor having terminals at both ends thereof, a first auxiliary terminal on one of the terminals, and a second auxiliary terminal on the other terminal and (b) a low-resistance conductor having terminals at both ends thereof, a third auxiliary terminal on one of the terminals, and a fourth auxiliary terminal on the other terminal,
the conductor is provided as a support between the second auxiliary terminal of the resistor and the fourth auxiliary terminal of the low-resistance conductor so as to maintain a predetermined distance between the first auxiliary terminal of the resistor and the third auxiliary terminal of the low-resistance conductor, and
if the support melts after reaching a predetermined temperature, the third auxiliary terminal of the low-resistance conductor comes into contact with the first auxiliary terminal of the resistor and the fourth auxiliary terminal of the low-resistance conductor is connected to the second auxiliary terminal of the resistor through the melted support.
5. A light-emitting diode illumination circuit comprising:
light-emitting diodes connected in series; and
compensating elements connected in parallel with the light-emitting diodes, wherein,
each of the compensating elements includes (a) positive and negative terminals and (b) at least one conductor having a predetermined melting point, the conductor melting in the event of open-circuit failure so that the terminals are connected,
each of the compensating elements further includes (a) a first resistor having an inclined surface at an end thereof and a first terminal at the other end thereof and (b) a second resistor having an inclined surface at an end thereof and a second terminal at the other end thereof, the inclined surfaces of the first and second resistors facing each other,
the conductor is provided on a top portion of each of the inclined surfaces, and
if the conductors provided on the inclined surfaces melt after reaching a predetermined temperature, the conductors flow down the inclined surfaces to connect the first terminal of the first resistor and the second terminal of the second resistor.
6. A light-emitting diode illumination circuit comprising:
light-emitting diodes connected in series; and
compensating elements connected in parallel with the light-emitting diodes, wherein,
each of the compensating elements includes (a) positive and negative terminals and (b) at least one conductor having a predetermined melting point, the conductor melting in the event of open-circuit failure so that the terminals are connected,
each of the compensating elements further includes (a) a resistor between the two terminals and (b) a guide disposed so as to partially cover the resistor and the terminals with a predetermined gap,
the conductor is provided on one of the terminals near the guide, and
if the conductor melts after reaching a predetermined temperature, the melted conductor is made to flow through the gap between one of the terminals and the guide by the action of capillarity to reach the other terminal, thereby connecting the two terminals.
7. The light-emitting diode illumination circuit according to claims 1-6, wherein the melting point of the conductor is lower than that of a solder used for fixing the compensating elements to a light-emitting diode illumination circuit board.
8. The light-emitting diode illumination circuit according to claim 7, wherein the elastic member is disposed between the casing and the low-resistance conductor and is compressed before the support melts.
9. The light-emitting diode illumination circuit according to claim 7, wherein the elastic member is a clip-like elastic member configured to hold the resistor and the low-resistance conductor together.
10. A light-emitting diode illumination circuit comprising:
light-emitting diodes connected in series; and
compensating elements connected in parallel with the light-emitting diodes,
wherein each of the compensating elements includes
(a) a resistor,
(b) two terminals at both ends thereof,
(d) an insulator between the two terminals, and
(e) a conductive paste on the insulator between the two terminals, the insulator transferring heat from the resistor to the conductive paste in the event of open-circuit failure, the conductive paste electrically connecting the two terminals after reaching a predetermined temperature.
11. An illumination device comprising a light-emitting diode illumination circuit including:
light-emitting diodes connected in series; and
compensating elements connected in parallel with the light-emitting diodes,
wherein each of the compensating elements includes
(a) a resistor,
(b) two terminals at both ends thereof,
(c) an insulator between the two terminals, and
(d) a conductive paste on the insulator between the two terminals, the insulator transferring heat from the resistor to the conductive paste in the event of open-circuit failure, the conductive paste electrically connecting the two terminals after reaching a predetermined temperature.
12. A liquid crystal display apparatus comprising a backlight including a light-emitting diode illumination circuit including:
light-emitting diodes connected in series; and
compensating elements connected in parallel with the light-emitting diodes,
wherein each of the compensating elements includes
(a) a resistor,
two terminals at both ends thereof,
(b) an insulator between the two terminals, and
(c) a conductive paste on the insulator between the two terminals, the insulator transferring heat from the resistor to the conductive paste in the event of open-circuit failure, the conductive paste electrically connecting the two terminals after reaching a predetermined temperature.

1. A method of recording a re-writable optical disk for an optical disk drive having an optical pick-up head, the method comprising:
determining an optimum power;
adjusting a gain of a Sub Beam Adder (SBAD) signal for generating a calibrated SBAD signal such that the calibrated SBAD signal maintains at a same level during a write power phase and a read power phase substantially;
recording the re-writable optical disk using the optimum power;
detecting a defect of the re-writable optical disk according to the calibrated SBAD signal; and
jumping over the detected defect and preventing the detected defect from being data-recorded.
2. The method according to claim 1 wherein the optimum-power determining step comprises:
performing an optimum power calibration (OPC) procedure at a power calibration area (PCA) of the re-writable optical disk to determine the optimum power.
3. The method according to claim 1 wherein the adjusting step comprises:
testing to write at a non-data area of the re-writable optical disk by using the optimum power;
measuring a first level of the SBAD signal while the optical pick-up head operates at the write power phase;
measuring a second level of the SBAD signal while the optical pick-up head operates at the read power phase;
generating a level difference by comparing the first level with the second level; and
generating the calibrated SBAD signal according to the level difference such that the calibrated SBAD signal maintains at a same level at the write power phase and at the read power phase substantially.
4. The method according to claim 3 wherein the non-data area is a power calibration area.
5. The method according to claim 1 wherein in the adjusting step, the calibrated SBAD signal is generated by decreasing the gain of the SBAD signal at the write power phase such that the calibrated SBAD signal maintains at a same level during the write power phase and the read power phase substantially.
6. The method according to claim 1 wherein in the adjusting step, the calibrated SBAD signal is generated by increasing the gain of the SBAD signal at the read power phase such that the calibrated SBAD signal maintains at a same level during the write power phase and the read power phase substantially.
7. The method according to claim 1 wherein in the detecting step, the defect of the optical disk is determined when the calibrated SBAD signal decays at least a defect threshold.
8. A method for detecting a defect of a re-writable optical disk, comprising:
measuring a first level of a Sub Beam Adder (SBAD) signal when an optical pick-up head operates at a write power phase;
measuring a second level of the SBAD signal when the optical pick-up head operates at a read power phase;
comparing the first level and the second level to generate a level difference;
adjusting a gain of the SBAD signal by using the level difference to generate a calibrated SBAD signal, wherein the calibrated SBAD signal maintains at a same level during the write power phase and the read power phase substantially; and
detecting the defect of the optical disk by using the signal level of the calibrated SBAD signal.
9. The method according to claim 8 wherein the first level measuring step comprises:
testing to write at a non-data area of the optical disk, wherein the non-data area is a power calibration area for instance; and
obtaining the first level of the SBAD signal.
10. The method according to claim 9 wherein the second level measuring step comprises:
testing to write at the non-data area of the optical disk; and
obtaining the first level of the SBAD signal.
11. The method according to claim 8 wherein in the adjusting step, the calibrated SBAD signal is generated by decreasing the gain of the SBAD signal at the write power phase such that the calibrated SBAD signal maintains at a same level during the write power phase and the read power phase substantially.
12. The method according to claim 8 wherein in the adjusting step, the calibrated SBAD signal is generated by increasing the gain of the SBAD signal at the read power phase such that the calibrated SBAD signal maintains at a same level during the write power phase and the read power phase.
13. The method according to claim 8 wherein in the detecting step, the defect of the optical disk is determined when the calibrated SBAD signal decays at least a defect threshold.
14. An optical disk drive capable of writing an re-writable optical disk, comprising:
an optical pick-up head for recording the re-writable optical disk and outputting a Sub Beam Adder (SBAD) signal;
an adjustment apparatus for adjusting the SBAD signal to output a calibrated SBAD signal, the adjustment apparatus comprising:
a measurement unit for measuring a first level of the SBAD signal when the optical pick-up head operates at a write power phase and measuring a second level of the SBAD signal when the optical pick-up head operates at a read power phase;

a comparator for comparing the first level and the second level to derive a level difference; and
a calibration unit for adjusting a gain of the SBAD signal by using the level difference to generate a calibrated SBAD signal, wherein the calibrated SBAD signal maintains at a same level during the write power phase and read power phase substantially; and
a controller for detecting the defect of the optical disk according to the calibrated SBAD signal.
15. The drive according to claim 14 wherein the optical pick-up head performs an optimum power calibration (OPC) procedure at a power calibration area of the re-writable optical disk to determine an optimum power.
16. The drive according to claim 14 wherein the pick-up head tests to record at a non-data area of the re-writable optical disk by using the optimum power.
17. The drive according to claim 16 wherein the measurement unit measures the first level of the SBAD signal at a write power phase and measures the second level of the SBAD signal at a read power phase.
18. The drive according to claim 14 wherein the adjustment apparatus outputs the calibrated SBAD signal by decreasing the gain of the SBAD signal at the write power phase such that the calibrated SBAD signal maintains at a same level during the write power phase and the read power phase substantially.
19. The drive according to claim 14, wherein the adjustment apparatus outputs the calibrated SBAD signal by increasing the gain of the SBAD signal at the read power phase such that the calibrated SBAD signal maintains at a same level during the write power phase and the read power phase substantially.
20. The drive according to claim 14 wherein the controller finds the defect of the optical disk when the calibrated SBAD signal decays at least a defect threshold.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An armor plate comprising alternating protection layers of light-weight high-strength fiber and reinforcing layers of high tensile strength oblong bodies.
2. An armor plate according to claim 1, wherein the high tensile strength oblong bodies are arranged unidirectionally and in parallel to each other.
3. An armor plate according to claim 2, wherein the reinforcing layers comprise gaps between the oblong bodies.
4. An armor plate according to claim 2, wherein a direction of said oblong bodies in at least one of said reinforcing layers of oblong bodies is substantially perpendicular to a direction of oblong bodies in adjacent andor other reinforcing layers.
5. An armor plate according to claim 1, wherein said reinforcing layers comprise lattice structures of high tensile strength oblong bodies.
6. An armor plate according to claim 5, wherein said lattice structures may comprise at least one of plain weave, basket weave, triaxial weave and double weave.
7. An armor plate according to claim 1, wherein at least one of said high tensile strength oblong bodies comprise pieces of high tensile strength material aligned with predetermined gaps between them.
8. An armor plate according to claim 7, wherein at least one of the gaps between said pieces and the lengths of said pieces vary within said reinforcing layer.
9. An armor plate according to claim 7, wherein said pieces in at least one of said reinforcing layers is displaced relative to said pieces in adjacent andor other reinforcing layers.
10. A method for production of armor plates, the method comprising: arranging alternating protection layers of light-weight high-strength fabric and reinforcing layers of high tensile strength oblong bodies; and fastening the layers of the construction together.
11. A method according to claim 10, wherein said arranging is according to a desired construction of the armor plate determined based on at least one of a required strength, weight and resistibility against penetrators.
12. A method according to claim 10, wherein said fastening is by heating and pressing all layers of the construction together