Author: claimsbot

1. A method of acquiring data surrounding an anomalous or identifiable event within a modulated input signal comprising the steps of:
demodulating the modulated input signal according to a specified modulation standard to obtain data representing information content;
analyzing the information content for an occurrence of the anomalous or identifiable event; and
generating a trigger signal upon the occurrence of the anomalous or identifiable event in order to acquire the data surrounding the anomalous or identifiable event from the modulated input signal.
2. The method as recited in claim 1 wherein the modulated input signal comprises a signal selected from the group consisting of a realtime modulated signal, a stored modulated signal, and a simulated modulated signal.
3. A method of acquiring data surrounding an anomalous or identifiable event within an input signal comprising the steps of:
inputting the input signal to each of a plurality of types of trigger generators, each trigger generator providing as an output a different type of trigger signal; and
combining the outputs from the trigger generators to produce an acquisition trigger signal for acquiring the data surrounding the anomalous or identifiable event from the input signal.
4. The method as recited in claim 3 wherein the types of trigger generators include one or more of a frequency domain trigger generator, a time domain trigger generator, a frequency modulation domain trigger generator and a modulation domain trigger generator.
5. The method as recited in claim 4 wherein the modulation domain trigger generator includes one or more of a QAM trigger generator, a CDMA trigger generator and an OFDM trigger generator.
6. The method as recited in claim 5 wherein each of the trigger generators include the steps of:
converting the input signal to a specified domain according to the type of the trigger generator; and
processing the converted input signal in the specified domain in response to specified trigger criteria to generate the trigger signal when the criteria are satisfied.
7. The method as recited in any of claims 3-6 wherein the input signal comprises a signal selected from the group consisting of a realtime signal, a stored signal and a simulated signal.
8. A multi-domain trigger generator for acquiring data surrounding an anomalous or identifiable event within an input signal comprising:
a plurality of trigger generators in parallel, each trigger generator being of a different type and receiving the input signal as an input and providing a trigger signal as an output; and
means for combining the trigger signals from the plurality of trigger generators to produce an acquisition trigger for acquiring the data surrounding the anomalous or identifiable event from the input signal.
9. The multi-domain trigger generator as recited in claim 8 wherein the trigger generators include one or more of a frequency domain trigger generator, a time domain trigger generator, a frequency modulation domain trigger generator and a modulation domain trigger generator.
10. The multi-domain trigger generator as recited in claim 9 wherein the modulation domain trigger generator includes one or more of a QAM trigger generator, a CDMA trigger generator and an OFDM trigger generator.
11. The multi-domain trigger generator as recited in claim 10 wherein each of the trigger generators comprise:
means for converting the input signal to a specified domain according to the type of the trigger generator; and
means for processing the converted input signal in the specified domain in response to specified trigger criteria to generate the trigger signal when the criteria are satisfied.
12. The apparatus as recited in any of claims 8-12 wherein the input signal comprises a signal selected from the group consisting of a realtime signal, a stored signal and a simulated signal.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of fabricating a FinFET, the method comprising:
forming a hard mask pattern on a semiconductor substrate;
etching the semiconductor substrate, using the hard mask pattern as an etching mask, to form a trench therein, the trench defining an active region;
forming an isolation layer that fills the trench and covers sidewalls of the hard mask pattern;
forming a photoresist pattern having a groove extending across the hard mask pattern;
etching the isolation layer, using the photoresist pattern and the hard mask pattern as an etching mask, to expose both sidewalls of the active region;
removing the photoresist pattern;
recessing sidewalls of the exposed active region to form a fin;
removing the hard mask pattern to expose an upper surface of the fin; and
forming a gate electrode that covers the exposed upper surface and sidewalls of the fin, wherein the gate electrode is insulated from the fin.
2. The method as recited in claim 1, further comprising forming a channel stopping region by implanting channel ions onto the semiconductor substrate before forming the hard mask pattern.
3. The method as recited in claim 2, wherein the hard mask pattern includes a lower hard mask pattern and an upper hard mask pattern, which are sequentially stacked.
4. The method as recited in claim 3, wherein forming the isolation layer includes:
forming an insulating layer on the semiconductor substrate having the hard mask pattern; and
planarizing the insulating layer until an upper surface of the lower hard mask pattern is exposed.
5. The method as recited in claim 4, further comprising selectively recessing the isolation layer after forming the isolation layer.
6. The method as recited in claim 3, wherein the hard mask pattern further includes a pad oxide layer.
7. The method as recited in claim 1, wherein forming the gate electrode includes:
forming a gate insulating layer that covers the upper surface and sidewalls of the fin;
forming a gate conductive layer and a gate hard mask layer overlying the gate insulating layer; and
sequentially patterning the gate hard mask layer and the gate conductive layer.
8. The method as recited in claim 7, further comprising forming source and drain regions, after forming the gate electrode.
9. The method as recited in claim 1, further comprising forming a channel stopping layer on the recessed active region between the fin and the isolation layer.
10. The method as recited in claim 1, wherein recessing sidewalls of the exposed active region comprises using an isotropic etching technique.
11. The method as recited in claim 1, wherein a width of the recessed active region is greater than a width of the fin.
12. The method as recited in claim 5, further comprising selectively recessing the isolation layer before forming the photoresist pattern.

1. A method for bonding flat glasses comprising the steps of:
obtaining flat glasses having bonding surfaces with a surface precision degree less than \xbd\u03bb (\u03bb=632.8 nm.);
cleaning the bonding surfaces of the flat glasses;
placing the flat glasses in a clamp;
tightening the clamp until the flat glasses are combined with each other to achieve an optical lens assembly; and
separating the optical lens assembly from the clamp.
2. The method for bonding flat glasses as claimed in claim 1, wherein the cleaning step uses an ultrasonic solution to clean the flat glasses, and then uses a volatile solvent to clean and dry the flat glasses.
3. The method for bonding flat glasses as claimed in claim 1 further comprising a step of examining the flat glasses with an interferometer to check whether contaminants left on the bonding surfaces after the cleaning step.
4. The method for bonding flat glasses as claimed in claim 1 further comprising a step of heating the clamp to decrease time for combining the flat glasses when the clamp is tightened.
5. The method for bonding flat glasses as claimed in claim 3 further comprising a step of blowing dust off the bonding surfaces with an airbrush after the step of examining the flat glasses.
6. the method for bonding flat glasses as claimed in claim 4, wherein the clamp is preferably heated to a temperature between 100\xb0 C. and 250\xb0 C.
7. A method for bonding flat glasses comprising the steps of:
obtaining flat glasses having bonding surfaces with surface precision degree less than \xbd\u03bb (\u03bb=632.8 nm);
cleaning the bonding surfaces of the flat glasses in an ultrasonic solution and a volatile solvent;
examining the flat glasses with an interferometer to check surface precision of the flat glasses and to ensure that no contaminant is on the bonding surfaces;
placing the flat glasses in a clamp;
tightening the clamp until the flat glasses are combined with each other to achieve an optical lens assembly; and
separating the optical lens assembly from the clamp.
8. The method for bonding flat glasses as claimed in claim 7 further comprising a step of heating the clamp to accelerate combination of the flat glasses after the act of tightening the clamp.
9. The method for bonding flat glasses as claimed in claim 7 further comprising a step of removing dust from the bonding surfaces with an airbrush after the act of examining the flat glasses.
10. The method for bonding flat glasses as claimed in claim 8, wherein the clamp is preferably heated to a temperature between 100\xb0 C. and 250\xb0 C.
11. A method for bonding flat glasses comprising the steps of:
obtaining flat glasses having bonding surfaces with surface precision degree less than \xbd\u03bb;
cleaning the bonding surfaces of the flat glasses in an ultrasonic solution and a volatile solvent;
examining the flat glasses with an interferometer to check surface precision of the flat glasses and ensure no contaminant is on the bonding surfaces;
placing the flat glasses in a clamp;
tightening the clamp until the flat glasses are combined with each other to achieve an optical lens assembly;
heating the clamp to a temperature between 100\xb0 C. and 250\xb0 C. to decrease time for combining the flat glasses; and
separating the optical lens assembly from the clamping apparatus.
12. The method for bonding flat glasses as claimed in claim 11 further comprising a step of removing dust from the bonding surfaces with an airbrush after the step of examining the flat glasses.
13. (canceled)

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A storage system comprising:
a first storage component configured for connection to a host and operative to receive write requests from the host;
a second storage component configured for synchronous data transfer of data from the first storage component; and
a third storage component configured for asynchronous data transfer of data from the first storage component,
the first storage component comprising a first disk controller,
the second storage component comprising a path replacement controller,
the storage system further comprising a first communication path between the path replacement controller and the first disk controller,
the path replacement controller operative to receive a first write request from the host and to communicate data associated with the first write request to the first storage component.
2. The storage system of claim 1 wherein the second storage component is operative to service the first write request by storing the data associated with the first write request to a data volume in the second storage component.
3. A storage system comprising:
a first storage component comprising a disk controller and configured for connection to a host and operative to receive write requests from the host;
a second storage component configured for synchronous data transfer of data from the first storage component;
a third storage component configured for asynchronous data transfer of data from the first storage component;
a fourth storage component comprising a path replacement controller; and
a communication path between the path replacement controller and the first disk controller,
the path replacement controller operative to receive a first write request from the host and to communicate the first write request to the first storage component.
4. A remote copy method in a storage system comprising a first storage sub-system configured for communication with a host system and operative to exchange data with the host, a second storage sub-system in data communication with the first storage sub-system, and a third storage sub-system in data communication with the first storage sub-system, the method comprising:
operating in a first configuration, comprising steps of:
receiving, in the first storage sub-system, first IO requests from the host including first read requests and first write requests;
storing data associated with the first write requests on a data volume in the first storage sub-system;
synchronously transferring data stored in the first storage system to the second storage system; and
asynchronously transferring data stored in the first storage system to the third storage system; and

operating in a second configuration, comprising steps of:
receiving, in the second storage sub-system, second IO requests from the first host including second read requests and second write requests;
communicating the second IO requests to the first storage sub-system;
storing data associated with the second write requests on the data volume in the first storage sub-system;
synchronously transferring data stored in the first storage system to the second storage system; and
asynchronously transferring data stored in the first storage system to the third storage system.
5. A remote copy method in a storage system comprising a first storage sub-system configured for communication with a host system and operative to exchange data with the host, a second storage sub-system in data communication with the first storage sub-system, and a third storage sub-system in data communication with the first storage sub-system, the method comprising:
operating in a first configuration, comprising steps of:
receiving, in the first storage sub-system, first IO requests from the host including first read requests and first write requests;
storing data associated with the first write requests on a data volume in the first storage sub-system;
synchronously transferring data stored in the first storage system to the second storage system; and
asynchronously transferring data stored in the first storage system to the third storage system; and

operating in a second configuration, comprising steps of:
receiving, in the second storage sub-system, second IO requests from the first host including second read requests and second write requests;
storing data associated with the second write requests on a data volume in the second storage sub-system;
synchronously transferring data associated with the second write requests to the first storage system; and
asynchronously transferring data stored in the first storage system to the third storage system.
6. A remote copy method in a storage system comprising a first storage sub-system configured for communication with a host system and operative to exchange data with the host, a second storage sub-system in data communication with the first storage sub-system, a third storage sub-system in data communication with the first storage sub-system, and a fourth storage sub-system in communication with the first storage sub-system, the method comprising:
receiving, in the first storage sub-system, a first write request from the host;
storing first data associated with the first write request to data volumes in the first storage sub-system;
synchronously transferring the first data to the second storage sub-system at a time subsequent to receiving the first write request;
asynchronously transferring the first data to the third storage sub-system at a time subsequent to receiving the first write request;
receiving, in the fourth storage sub-system, a second write request from the host;
communicating the second write request to the first storage sub-system;
storing second data associated with the second write request to data volumes in the first storage sub-system;
synchronously transferring the second data to the second storage sub-system at a time subsequent to receiving the second write request; and
asynchronously transferring the second data to the third storage sub-system at a time subsequent to receiving the second write request.
7. The method of claim 6 further comprising:
receiving, in the fourth storage sub-system, a third write request from the host, wherein the host is no longer able to communicate with the first storage sub-system;
storing third data associated with the third write request to data volumes in the fourth storage sub-system;
synchronously transferring the third data to the second storage sub-system from the fourth storage sub-system at a time subsequent to receiving the third write request; and
asynchronously transferring the third data to the third storage sub-system from the fourth storage sub-system at a time subsequent to receiving the third write request.