Author: claimsbot

1. A data embedding method to embed data into an image comprising:
dividing, by a predetermined length, subject data to be embedded into a plurality of pieces of partial data; and
embedding, using a processor, to generate resultant images by
a first embedding which embeds a first position information specifying divided positions of a first partial data, a first bit sequence obtained by rotating the first partial data in a certain direction by a first number of bits, and the first number of bits into a first input image,
a second embedding which embeds a second position information specifying divided positions of a second partial data, a second bit sequence obtained by rotating the second partial data in the certain direction by the first number of bits, and the first number of bits into a second input image, and
a third embedding which embeds the second position information, a third bit sequence obtained by rotating the second partial data in the certain direction by a second number of bits, and the second number of bits into a third input image.
2. A data recognition method used to extract a plurality of pieces of partial data from a display image and restore a subject image to be embedded, the display image displayed by a method to display resultant images in which a subject data is embedded as a plurality of pieces of partial data by the data embedding method according to claim 1 and to sequentially display the resultant images on a display device in a predetermined order and at predetermined display time intervals, the data recognition method comprising:
photographing the display image at predetermined photographing time intervals;
extracting, using a processor, the pieces of embedded partial data and position information from photographed images; and
integrating the pieces of partial data extracted based on the pieces of extracted position information to restore the subject data to be embedded, after repeatedly performing the photographing and the extracting until the pieces of partial data and position information are all obtained while identifying the pieces of extracted position information,
wherein the extracting extracts the first bit sequence from a first photographed image obtained by photographing the first input image after the first embedding,
the integrating obtains the first partial data by rotating the first bit sequence in an opposite direction from the certain direction by the first number of bits,
when the extracting fails to extract the second bit sequence from a second photographed image obtained by photographing the second input image after the second embedding, the extracting extracts the third bit sequence from a third photographed image obtained by photographing the third input image after the third embedding, and
the integrating obtains the second partial data by rotating the third bit sequence in the opposite direction by the second number of bits.
3. The data recognition method according to claim 2, wherein
the position information include at least information relating to an integrating order of the plurality of pieces of partial data,
the integrating determines, by identifying the integrating order indicated by the position information, that extraction of all the pieces of partial data is completed when a predetermined number of the plurality of pieces of partial data of a different integrating order are extracted, and
the integrating integrates the plurality of pieces of partial data based on the integrating order.
4. The data recognition method according to claim 2, wherein
the position information include at least information relating to a number of divisions of the subject data to be embedded and an integrating order of the plurality of pieces of partial data,
the integrating determines, by identifying the number of divisions and the integrating order indicated by the position information, that extraction of all the pieces of partial data is completed when the pieces of partial data of a different integrating order equal in number to the number of divisions are extracted, and
the integrating integrates the plurality of pieces of partial data based on the integrating order.
5. The data recognition method according to claim 2, wherein
the position information include at least information relating to an integrating order of the plurality of pieces of partial data, and a position information of a partial data that is at atop of the integrating order includes an information relating to a number of divisions of the plurality of pieces of partial data,
the integrating determines, by identifying the number of divisions and an integrating order indicated by the pieces of position information, that extraction of all the pieces of partial data is completed when the plurality of pieces of partial data of a different integrating order equal in number to the number of divisions are extracted, and
the integrating integrates the plurality of pieces of partial data based on the integrating order.
6. The data embedding method according to claim 1, wherein
the dividing cuts the subject data to be embedded by the predetermined length, and outputs a plurality of cut data as the plurality of pieces of partial data.
7. The data embedding method according to claim 1, wherein
the dividing cuts the subject data to be embedded by the predetermined length, performs a predetermined reversible data converting operation for a plurality of pieces of the cut data, and outputs a resulting plurality of pieces of converted data as the plurality of pieces of partial data.
8. The data embedding method according to claim 6, wherein
the dividing generates the plurality of pieces of partial data so that an identical portion of a plurality of the cut data is redundantly included in the plurality of pieces of partial data.
9. The data embedding method according to claim 1, wherein
the plurality of input images are identical, obtained by duplicating one still input image.
10. The data embedding method according to claim 1, wherein
the plurality of input images are a plurality of frame images composing an input moving image.
11. The data recognition method according to claim 2, wherein
the photographing time interval is shorter than the display time interval.
12. A data embedding device performing a data embedding operation by the data embedding method according to claim 1.
13. A data recognition device performing a data recognition operation by the data recognition method according to claim 2.
14. A non-transitory recording medium storing a program, the program causing a computer to execute a process to embed data into an image, the process comprising:
dividing, by a predetermined length, subject data to be embedded into a plurality of pieces of partial data; and
to generate resultant images by
a first embedding which embeds a first position information specifying divided positions of a first partial data, a first bit sequence obtained by rotating the first partial data in a certain direction by a first number of bits, and the first number of bits into a first input image,
a second embedding which embeds a second position information specifying divided positions of a second partial data, a second bit sequence obtained by rotating the second partial data in the certain direction by the first number of bits, and the first number of bits into a second input image, and
a third embedding which embeds the second position information, a third bit sequence obtained by rotating the second partial data in the certain direction by a second number of bits, and the second number of bits into a third input image.
15. A non-transitory recording medium storing a program, the program causing a computer to perform a process to extract a plurality of pieces of partial data from a display image and restore subject data to be embedded, the process comprising:
photographing the display image at predetermined photographing time intervals;
extracting, the pieces of embedded partial data and position information from the photographed images; and
integrating the pieces of partial data extracted based on the pieces of extracted position information to restore the subject data to be embedded, after repeatedly performing the photographing and the extracting until the pieces of partial data and position information are all obtained while identifying the pieces of extracted position information,
wherein the extracting extracts the first bit sequence from a first photographed image obtained by photographing the first input image after the first embedding,
the integrating obtains the first partial data by rotating the first bit sequence in an opposite direction from the certain direction by the first number of bits,
when the extracting fails to extract the second bit sequence from a second photographed image obtained by photographing the second input image after the second embedding, the extracting extracts the third bit sequence from a third photographed image obtained by photographing the third input image after the third embedding, and
the integrating obtains the second partial data by rotating the third bit sequence in the opposite direction by the second number of bits.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A semiconductor device comprising:
a base material portion that includes a semiconductor substrate and an insulating film that is formed on one face of the semiconductor substrate and on which a hole is formed along a thickness direction of the semiconductor substrate;
a hole wiring portion that includes a hole electrode formed on a side wall of the base material portion that forms the hole;
a metallic film that is formed within the insulating film and that is electrically connected to the hole wiring portion;
a conductive protective film that is arranged at a position that opposes an opening portion of the hole and formed to be in physical contact with the metallic film within the insulating film,
wherein the conductive protective film is provided on the semiconductor substrate side of the metallic film; and
wherein a region of the metallic film in the vicinity of the outer circumference end portion is covered by the insulating film.
2. The semiconductor device according to claim 1,
wherein an opening area of an opening portion of the insulating film is smaller than the area of the metallic film.
3. The semiconductor device according to claim 1,
wherein the conductive protective film is arranged at a position that opposes an opening portion of the hole.
4. The semiconductor device according to claim 1, wherein the conductive protective film comprises any one of an Au film, an Ni film, and a Cu film.
5. The semiconductor device according to claim 1, wherein the conductive protective film comprises at least one of a W film, a Ti film, a laminated film of a TiN film and a Ti film, and a laminated film of a TaN film and a Ta film.
6. A semiconductor device comprising:
a base material portion that includes a semiconductor substrate and an insulating film that is formed on one face of the semiconductor substrate and on which a hole is formed along a thickness direction of the semiconductor substrate;
a hole wiring portion that includes a hole electrode formed on a side wall of the base material portion that forms the hole;
a metallic film that is formed within the insulating film and that is electrically connected to the hole wiring portion;
a conductive protective film that is arranged at a position that opposes an opening portion of the hole and formed to be in physical contact with the metallic film within the insulating film,
wherein the metallic film is provided on the semiconductor substrate side of the conductive protective film; and
wherein a region of the conductive protective film in the vicinity of the outer circumference end portion is covered by the insulating film.
7. The semiconductor device according to claim 6,
wherein an opening area of an opening portion of the insulating film is smaller than the area of the conductive protective film.
8. The semiconductor device according to claim 6,
wherein the conductive protective film is arranged at a position that opposes an opening portion of the hole.
9. The semiconductor device according to claim 6, wherein the conductive protective film comprises any one of an Au film, an Ni film, and a Cu film.
10. The semiconductor device according to claim 6, wherein the conductive protective film comprises at least one of a W film, a Ti film, a laminated film of a TiN film and a Ti film, and a laminated film of a TaN film and a Ta film.

What is claimed is:

1. An X-ray exposure apparatus comprising an X-ray mirror containing a material having an absorption edge only in at least either one of a wavelength region of less than 0.45 nm and a wavelength region exceeding 0.7 nm as to X-rays.
2. The X-ray exposure apparatus according to claim 1, wherein said X-rays are included in radiation outgoing from a synchrotron radiation source.
3. The X-ray exposure apparatus according to claim 1, wherein said X-ray mirror includes an X-ray mirror for cutting shorter wavelengths absorbing at least 90% of X-rays of a wavelength region of less than 0.3 nm.
4. The X-ray exposure apparatus according to claim 1, wherein said X-ray mirror contains a single type of mirror material selected from a group consisting of beryllium, titanium, silver, ruthenium, rhodium and palladium, nitrides, carbides and borides of these, diamond, diamond-like carbon and boron nitride.
5. The X-ray exposure apparatus according to claim 1, wherein said X-ray mirror has a function of converging X-rays.
6. The X-ray exposure apparatus according to claim 1, wherein said X-ray mirror has a function of magnifying the area of a region capable of being simultaneously irradiated with X-rays outgoing from said X-ray mirror.
7. The X-ray exposure apparatus according to claim 1, further comprising an X-ray converging mirror.
8. The X-ray exposure apparatus according to claim 1, further comprising a magnifying mirror having a function of magnifying the area of a region capable of being simultaneously irradiated with X-rays outgoing from said X-ray mirror.
9. The X-ray exposure apparatus according to claim 1, wherein a surface of said X-ray mirror upon which X-rays are incident is mechanically polished.
10. The X-ray exposure according to claim 1, wherein a surface of said X-ray mirror upon which X-rays are incident is chemically polished.
11. The X-ray exposure apparatus according to claim 1 further comprising an X-ray mask, wherein said X-ray mask includes a membrane and an X-ray absorber formed on said membrane, and
said membrane contains a single species selected from a group consisting of diamond, diamond-like carbon, boron nitride and beryllium.
12. The X-ray exposure apparatus according to claim 1 further comprising an X-ray mask, wherein said X-ray mask includes a membrane and an X-ray absorber formed on said membrane,
said membrane contains a material having an absorption edge only in at least either one of a wavelength region of less than 0.45 nm and a wavelength region exceeding 0.7 nm as to X-rays, and
said X-ray absorber contains a material having an absorption edge in a wavelength region of at least 0.6 nm and less than 0.85 nm.
13. The X-ray exposure apparatus according to claim 1, comprising a plurality of said X-ray mirrors.
14. The X-ray exposure apparatus according to claim 1, wherein the outgoing direction of X-rays outgoing from said X-ray mirror finally reached by X-rays is substantially identical to the incidence direction of X-rays incident upon said X-ray mirror initially reached by X-rays.
15. The X-ray exposure apparatus according to claim 1, wherein the outgoing optical axis of X-rays outgoing from said X-ray mirror finally reached by X-rays is substantially identical to the incidence optical axis of X-rays incident upon said X-ray mirror initially reached by X-rays.
16. An X-ray mirror having an absorption edge only in at least either one of a wavelength region of less than 0.45 nm and a wavelength region exceeding 0.7 nm as to X-rays.
17. The X-ray mirror according to claim 16, reflecting X-rays included in radiation outgoing from a synchrotron radiation source.
18. The X-ray mirror according to claim 16, absorbing at least 90% of X-rays in a wavelength region of less than 0.3 nm and cutting shorter wavelengths.
19. The X-ray mirror according to claim 16, wherein said X-ray mirror contains a single type of mirror material selected from a group consisting of beryllium, titanium, silver, ruthenium, rhodium and palladium, nitrides, carbides and borides of these, diamond, diamond-like carbon and boron nitride.
20. The X-ray mirror according to claim 16, having a function of converging X-rays.
21. The X-ray mirror according to claim 16, having a function of magnifying the area of a region capable of being simultaneously irradiated with X-rays.
22. The X-ray mirror according to claim 16, wherein a surface upon which X-rays are incident is mechanically polished.
23. The X-ray mirror according to claim 16, wherein a surface upon which X-rays are incident is chemically polished.
24. An X-ray exposure method comprising:
an X-ray incidence step of making X-rays incident upon an X-ray mirror containing a material having an absorption edge only in at least either one of a wavelength region of less than 0.45 nm and a wavelength region exceeding 0.7 nm as to X-rays; and
an exposure step of performing exposure with X-rays outgoing from said X-ray mirror.
25. The X-ray exposure method according to claim 24, further comprising an X-ray outgoing step of making said X-rays outgo from a synchrotron radiation source.
26. The X-ray exposure method according to claim 24, wherein said X-ray mirror includes an X-ray mirror for cutting shorter wavelengths, absorbing at least 90% of X-rays in a wavelength region of less than 0.3 nm.
27. The X-ray exposure method according to claim 24, wherein said X-ray mirror contains a single type of mirror material selected from a group consisting of beryllium, titanium, silver, ruthenium, rhodium and palladium, nitrides, carbides and borides of these, diamond, diamond-like carbon and boron nitride.
28. The X-ray exposure method according to claim 24, wherein said X-ray incidence step includes a step of converging X-rays with said X-ray mirror.
29. The X-ray exposure method according to claim 24, wherein said X-ray incidence step includes a step of magnifying the area of a region capable of being simultaneously irradiated with X-rays outgoing from said X-rays with said X-ray mirror.
30. The X-ray exposure method according to claim 24, wherein said X-ray incidence step includes a step of further converging X-rays with a converging mirror.
31. The X-ray incidence method according to claim 24, wherein said X-ray incidence step includes a step of magnifying the area of a region capable of being simultaneously irradiated with X-rays outgoing from said X-ray mirror with a magnifying mirror.
32. The X-ray exposure method according to claim 24, employing said X-ray mirror whose surface upon which X-rays are incident is mechanically polished in said X-ray incidence step.
33. The X-ray exposure method according to claim 24, employing said X-ray mirror whose surface upon which X-rays are incident is chemically polished in said X-ray incidence step.
34. The X-ray exposure method according to claim 24 employing an X-ray mask, wherein said X-ray mask includes a membrane and an X-ray absorber formed on said membrane, and
said membrane contains a single species selected from a group consisting of diamond, diamond-like carbon, boron nitride and beryllium.
35. The X-ray exposure method according to claim 24 employing an X-ray mask, wherein said X-ray mask includes a membrane and an X-ray absorber formed on said membrane,
said membrane contains a material having an absorption edge only in at least either one of a wavelength region of less than 0.45 nm and a wavelength region exceeding 0.7 nm as to X-rays, and
said X-ray absorber contains a material having an absorption edge in a wavelength region of at least 0.6 nm and less than 0.85 nm.
36. The X-ray exposure method according to claim 24, employing a plurality of said X-ray mirrors in said X-ray incidence step.
37. The X-ray exposure method according to claim 24, wherein the outgoing direction of X-rays outgoing from said X-ray mirror finally reached by X-rays is substantially identical to the incidence direction of X-rays incident upon said X-ray mirror initially reached by X-rays in said X-ray incidence step.
38. The X-ray exposure method according to claim 24, wherein the outgoing optical axis of X-rays outgoing from said X-ray mirror finally reached by X-rays is substantially identical to the incidence optical axis of X-rays incident upon said X-ray mirror initially reached by X-rays in said X-ray incidence step.
39. A semiconductor device manufactured with the X-ray exposure method according to claim 24.
40. A synchrotron radiation apparatus comprising a synchrotron radiation source and an X-ray mirror group including a plurality of X-ray mirrors upon which radiation outgoing from said synchrotron radiation source is incident, wherein
said X-ray mirrors contain a material having an absorption edge only in at least either one of a wavelength region of less than 0.45 nm and a wavelength region exceeding 0.7 nm as to X-rays, and
the outgoing direction of said radiation outgoing from said synchrotron radiation source and the outgoing direction of reflected light outgoing from said X-ray mirror group are substantially identical.
41. The synchrotron radiation apparatus according to claim 40, wherein the outgoing optical axis of said radiation outgoing from said synchrotron radiation source and the outgoing optical axis of reflected light outgoing from said X-ray mirror group are substantially identical.
42. A synchrotron radiation method employing a synchrotron radiation apparatus comprising a synchrotron radiation source and an X-ray mirror group including a plurality of X-ray mirrors upon which radiation outgoing from said synchrotron radiation source is incident, said synchrotron radiation method comprising:
a radiation incidence step of making radiation outgoing from the synchrotron radiation source incident upon an X-ray mirror containing a material having an absorption edge only in at least either one of a wavelength region of less than 0.45 nm and a wavelength region exceeding 0.7 nm as to X-rays, and
a reflected light emitting step of emitting reflected light from said X-ray mirror group in a direction substantially identical to the outgoing direction of the radiation outgoing from said synchrotron radiation source.
43. The synchrotron radiation method according to claim 42, wherein the outgoing optical axis of the radiation outgoing from said synchrotron radiation source and the outgoing optical axis of the reflected light outgoing from said X-ray mirror group are substantially identical.
44. An X-ray mask comprising a membrane and an X-ray absorber formed on said membrane, wherein
said membrane contains a material having an absorption edge only in at least either one of a wavelength region of less than 0.45 nm and a wavelength region exceeding 0.7 nm as to X-rays, and
said X-ray absorber contains a material having an absorption edge in a wavelength region of at least 0.6 nm and less than 0.85 nm.
45. An X-ray exposure apparatus including the X-ray mask according to claim 44.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A punching device comprising:
a punching member opens a punch hole on a sheet material on a die plate by penetrating a die hole provided to the die plate;
a discharging member discharges static electricity charged on a punching chip generated by opening of the punch hole when the punching chip is guided to fall on the discharging member arranged on a lower side of the die hole and brought into contact with the discharging member; and
a pressing member that presses the punching chip on the discharging member against the discharging member.
2. The punching device according to claim 1, wherein the pressing member is the punching member.
3. The punching device according to claim 1, wherein space for retaining the punching chip is formed between an end of the punching member and the discharging member.
4. The punching device according to claim 1, wherein the discharging member includes a plurality of discharging members, and ends of the discharging members face each other.
5. The punching device according to claim 1, wherein the discharging member includes a plurality of discharge needles, and the discharge needles are arranged with intervals smaller than the punching chip.
6. The punching device according to claim 5, wherein needle ends of the discharge needles arranged to form the discharging members disposed to face each other cross each other when viewed from an arrangement direction of the discharge needles.
7. The punching device according to claim 1, wherein the discharging member is inclined with respect to a punching direction.
8. The punching device according to claim 1, wherein lengths of the discharging members extending in a falling direction of the punching chip are set such that one of the discharging members that are disposed to face each other is longer than the other discharging member, and an inclination direction of the one discharging member is set in accordance with the falling direction of the punching chip.
9. The punching unit according to claim 1, wherein a backflow preventing member restricting movement of the punching chip to an opposite direction of an accumulation direction of the punching chip on the discharging member is arranged directly under the die hole.
10. The punching unit according to claim 9, wherein an end of the backflow preventing member extends toward a center part of the die hole.
11. The punching device according to claim 9, wherein the backflow preventing member is formed of a fiber material.
12. A paper sheet processing apparatus, comprising a punching unit that performs punching processing on a paper sheet, wherein
the punching unit comprises:
a punching member opens a punch hole on a sheet material on a die plate by penetrating a die hole provided to the die plate;
a discharging member discharges static electricity charged on a punching chip generated by opening of the punch hole when the punching chip is guided to fall on the discharging member arranged on a lower side of the die hole and brought into contact with the discharging member; and
a pressing member that presses the punching chip on the discharging member against the discharging member.
13. An image forming apparatus, comprising:
an image forming unit that forms an image on a recording paper sheet; and
a recording paper sheet processing unit that performs certain processing on the recording paper sheet on which the image is formed by the image forming unit, wherein
the recording paper sheet processing unit includes a punching unit, the punching unit comprising:
a punching member opens a punch hole on a sheet material on a die plate by penetrating a die hole provided to the die plate;
a discharging member discharges static electricity charged on a punching chip generated by opening of the punch hole when the punching chip is guided to fall on the discharging member arranged on a lower side of the die hole and brought into contact with the discharging member; and
a pressing member that presses the punching chip on the discharging member against the discharging member.