Author: claimsbot

1. A susceptor device comprising:
a ceramic base body having a mounting surface for mounting a plate sample on a surface of the ceramic base body; and
a temperature controlling section for supporting the base body, in which a flow path for circulating a medium for controlling a temperature is formed;
wherein the base body and the temperature controlling section are attached together via an adhesive layer; and
the adhesive layer is sealed by a sealing member which is disposed near a peripheral section of the adhesive layer.
2. A susceptor device according to claim 1 wherein an electrode is disposed inside of the base body.
3. A susceptor device according to claim 1 wherein:
at least a main portion of the temperature controlling section is formed by a conductive material; and
the temperature controlling section serves as an electrode.
4. A susceptor device according to claim 1 wherein:
a supporting section for supporting the sealing member is disposed outside of a peripheral section of the temperature controlling section;
the supporting section is fixed by a fixing member on the temperature controlling section; and
the sealing member is attached to the base body, or the adhesive layer, or the base body and the adhesive layer by compressing the sealing member by the supporting section.
5. A susceptor device according to claim 4 wherein a groove for supporting the sealing member is formed on an upper surface of the supporting section.
6. A susceptor device according to claim 4 wherein:
an inclined surface is formed on an upper end section in an inner peripheral surface of the supporting section such that the inclined surface has a predetermined angle to the inner peripheral surface; and
the sealing member is attached to the base body, or the adhesive layer, or the base body and the adhesive layer by the inclined surface compressing the sealing member.
7. A susceptor device according to claim 6 wherein a ring flange section for supporting the sealing member is formed in a peripheral section of the base body.
8. A susceptor device according to claim 4 wherein:
a flange section which contacts a part of the sealing member is formed in an inner peripheral section of the supporting section;
a second supporting section which contacts other part of the sealing member is disposed so as to face the flange section;
the second supporting section is fixed to the supporting section by a second fixing member and,
the sealing member is attached to the base body, or the adhesive layer, or the base body and the adhesive layer by the second supporting section and the flange section by compressing the sealing section.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A microstructured optical waveguide comprising
a central core region disposed along the length thereof; and
an inner cladding layer surrounding said central core region, said inner cladding layer being microstructured to include at least one air channel disposed along the length of said waveguide, wherein said at least one air channel comprises a first plurality of plugs of optically active material disposed to exhibit a desired periodicity .
2. The microstructured optical waveguide as defined in claim 1 wherein the at least one air channel comprises a plurality of air channels disposed axially to surround the core region, wherein at least two, opposing air channels each include a first plurality of plugs of optically active material.
3. The microstructured optical waveguide as defined in claim 1 wherein at least one air channel includes a second plurality of plugs of an alternative optically active material, said alternative optically active material exhibiting different optical characteristics than the original optically active material.
4. The microstructured optical waveguide as defined in claim 3 wherein the first plurality of plugs of optically active material exhibits a refractive index that decreases with increasing temperature and the second plurality of plugs of alternative optically active material exhibits a refractive index that increases with increasing temperature.
5. The microstructured optical waveguide as defined in claim 1 wherein the periodicity of the plugs is tunable by modifying an environmental factor that alters the spacing of the plugs within the air channel.
6. The microstructured optical waveguide as defined in claim 5 wherein opposing ends of said waveguide are subjected to a temperature change to alter the spacing of the plugs.
7. The microstructured optical waveguide as defined in claim 5 wherein opposing ends of the waveguide are subjected to a pressure change to alter the spacing of the plugs.
8. The microstructured optical waveguide as defined in claim 1 wherein the optically active material comprises a liquid.
9. The microstructured optical waveguide as defined in claim 8 wherein the liquid comprises trifluorotoluence.
10. The microstructured optical waveguide as defined in claim 1 wherein the waveguide comprises an optical fiber.
11. The microstructured optical waveguide as defined in claim 1 wherein the waveguide comprises an optical fiber including a tapered region to allow for coupling of a propagating signal between the central core region and the inner cladding layer.
12. The microstructured optical waveguide as defined in claim 11 wherein the tapered region comprises an adiabatically tapered region.
13. A method of forming a microstructured optical waveguide including a plurality of plugs of optically active material in at least one air channel disposed along the length of an inner cladding layer, the method comprising the steps of:
a) supplying a reservoir of optically active material;
b) attaching a vacuum source to a far end of the microstructured optical waveguide;
c) lowering the opposing, near end of said microstructured optical waveguide into the reservoir of optically active material for a defined period of time;
d) applying a vacuum to draw an amount of optically active material into at least one inner cladding air channel;
e) removing said microstructured optical waveguide from said reservoir; and
f) repeating steps c) – e) until a desired plurality of plugs of optically active material have been introduced into said microstructured optical waveguide.
14. The method as defined in claim 13 wherein the frequency of steps c) – e) is controlled to determined the periodicity A of the plugs in the microstructured optical waveguide.
15. The method as defined in claim 13 wherein the method further comprises the steps of heating and stretching the final microstructured optical waveguide to form a central tapered region.
16. The method as defined in claim 15 wherein the heating and stretching are controlled to form adiabatic transition regions into and out of the central tapered region.

1. A capacitor comprising:
a first electrode and a second electrode; and
a dielectric layer sandwiched between the first electrode and the second electrode,
wherein the dielectric layer includes Pb(ZrxTiyMz)O3 (where M is at least one material selected from Nb, Ta, and V, and x+y+z-1).
2. A capacitor according to claim 1, wherein a composition ratio of Zr, Ti and M within the Pb(ZrxTiyMz)O3 satisfies the following equation:
0.2\u2266z(x+y)\u22660.9
3. A capacitor according to claim 1, wherein Si is added to the dielectric layer.
4. A capacitor according to claim 3, wherein the Si is added to the dielectric layer as a metallic silicate in an amount greater than or equal to 0.1 mole percent and less than or equal to 10.0 mole percent.
5. A capacitor according to claim 1, wherein the dielectric layer is in the amorphous phase, or is in a mixture of the amorphous phase and the crystalline phase.
6. A capacitor according to claim 1, wherein the dielectric layer is in a mixture of the amorphous phase and the crystalline phase, and
the crystalline phase is formed in a discontinuous state between the first electrode and the second electrode.
7. A method of manufacture of a capacitor having a structure in which a dielectric layer is sandwiched between a first electrode and a second electrode, comprising the steps of:
forming the first electrode upon a base;
depositing upon the first electrode by a droplet discharge method a liquid material containing a precursor compound for Pb(ZrxTiyMz)O3 (where M is at least one material selected from Nb, Ta, and V, and x+y+z=1); and
forming the dielectric layer including Pb(ZrxTiyMz)O3 (where M is at least one material selected from Nb, Ta, and V, and x+y+\u03bcl) by heat processing the deposited liquid material.
8. A method of manufacture of a capacitor according to claim 7, further comprising the step of, before the step of depositing the liquid material upon the first electrode by the droplet discharge method, forming a self organizing layer upon the surfaces of the base and the first electrode using fluoroalkylsilane.
9. A method of manufacture of a capacitor according to claim 8, further comprising the step of, after the step of forming a self organizing layer upon the surfaces of the base and the firs electrode using fluoroalkylsilane, irradiating light upon the fluoroalkylsilane which has been formed upon the surface of the first electrode.
10. A method of manufacture of a capacitor according to claim 7, wherein, in the step of forming the dielectric layer by heat processing the liquid material, the temperature for heat processing is less than or equal to 450\xb0 C.
11. A method of manufacture of a capacitor according to claim 7,
wherein the first electrode is made by the steps of:
depositing upon the base by a droplet discharge method a first liquid material in which first minute particles are dispersed in a first dispersion medium;
eliminating the first dispersion medium by heat processing the first liquid material; and
sintering the first minute metallic particles.
12. A method of manufacture of a capacitor according to claim 7,
wherein the second electrode is made by the steps of:
depositing upon the base by a droplet discharge method a second liquid material in which second minute particles are dispersed in a second dispersion medium;
eliminating the second dispersion medium by heat processing the second liquid material; and
sintering the second minute metallic particles.
13. A method of manufacture of a capacitor according to claim 11, wherein the first minute metallic particles are minute particles made from at least one of platinum, iridium, ruthenium, gold, or silver, and the heat processing temperature at which the first minute metallic particles are sintered is less than or equal to 400\xb0 C.
14. A process of manufacture of a capacitor according to claim 12, wherein the second minute metallic particles are minute particles made from at least one of platinum, iridium, ruthenium, gold, or silver, and the heat processing temperature at which the second minute metallic particles are sintered is less than or equal to 400\xb0 C.
15. A semiconductor device comprising a capacitor according to claim 1.
16. A semiconductor device comprising a capacitor which has been manufactured by a method of manufacture of a capacitor according to claim 7,

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A quick connector prior to assembly with a plug, said quick connector comprising:
a tubular body having an open input end, an open output end and a body chamber communicating with the input and output ends;
a socket base being hollow, connected to the tubular body and having
a peripheral wall having at least one longitudinal flat facet;
an inserting end;
a connecting end connected to the output end of the tubular body;
a socket chamber formed in the socket base and communicating with the inserting and connecting ends;
an annular lip formed on and protruding inward from the inserting end and having an inserting hole with a diameter;
multiple elongated ball slots longitudinally formed through the peripheral wall, arranged in a circle around the socket base and communicating with the socket chamber; and
multiple ball bores formed through the peripheral wall, arranged in a circle around the socket base and communicating with the socket chamber;

a moving base movably mounted in the socket chamber and having
a peripheral wall;
a closed end corresponding to the connecting end of the socket base;
an open end corresponding to and abutting with the annular lip on the inserting end of the socket base;
a base chamber formed in the moving base and communicating with the open end;
a sealing flange formed around the closed end and abutting against and closing the connecting end of the socket base;
an annular groove defined around the peripheral wall of the moving base;
multiple ball holes defined through the peripheral wall of the moving base, communicating with the base chamber and corresponding respectively to the ball slots in the socket base; and
at least one vent defined through the peripheral wall at a position between the sealing flange and the open end of the moving base and communicating with the base chamber;

a pushing assembly movably mounted in the base chamber of the moving base and comprising
a collar movably mounted in the base chamber and having an abutting end abutting with the lip on the socket base; and
a first seal being tubular and resilient and mounted in the collar;

an outer sleeve slidably mounted around the socket base and comprising
a central hole defined through the outer sleeve and having a diameter and an inner surface;
a ball cavity defined in one end of the outer sleeve, corresponding to the ball slots in the socket base and having a diameter larger than that of the central hole of the outer sleeve; and
multiple elongated ball recesses longitudinally formed in the inner surface of the central hole, communicating with the ball cavity and corresponding respectively to the ball bores in the socket base;

a first spring mounted in the tubular body and having two ends abutting respectively with the tubular body and the moving base;
a second spring mounted in the moving base and having two ends abutting respectively with the moving base and the pushing assembly;
a third spring having two ends abutting respectively with the tubular body and the outer sleeve;
multiple first balls each held in one of the ball slots in the socket base and a corresponding one of the ball holes in the moving base and abutting the collar; and
multiple second balls held respectively in the ball bores in the socket base and abutting the peripheral wall of the moving base.
2. The quick connector as claimed in claim 1, wherein
the annular groove in the moving base is defined near the open end and has a bottom; and
the ball holes are defined in the bottom of the annular groove.
3. The quick connector as claimed in claim 2, wherein the socket base further comprises at least one releasing hole defined through the peripheral wall of the socket base and communicating with the socket chamber.
4. The quick connector as claimed in claim 3, wherein
the socket base further comprises an outer flange formed around the inserting end; and
the ball slots are defined near the outer flange.
5. The quick connector as claimed in claim 4, wherein
the collar of the pushing assembly has a diameter and further comprises an annular abutting lip formed on and protruding inward from the abutting end to define a hole with a diameter; and
the diameter of the inserting hole in the socket base is larger than that of the hole in the collar but is smaller than that of the collar.
6. The quick connector as claimed in claim 5, wherein the first seal of the pushing assembly has a central hole having multiple segments with different inner diameters and a front end abutting against the abutting lip on the collar.
7. The quick connector as claimed in claim 6, wherein the pushing assembly further comprises a second seal being resilient and attached to a rear end of the first seal; and
the second seal has an inner diameter different from the diameters of the central hole of the first seal.
8. The quick connector as claimed in claim 1, wherein the socket base further comprises at least one releasing hole defined through the peripheral wall of the socket base and communicating with the socket chamber.
9. The quick connector as claimed in claim 1, wherein
the socket base further comprises an outer flange formed around the inserting end; and
the ball slots are defined near the outer flange.
10. The quick connector as claimed in claim 1, wherein
the collar of the pushing assembly has a diameter and further comprises an annular abutting lip formed on and protruding inward from the abutting end to define a hole with a diameter; and
the diameter of the inserting hole in the socket base is larger than that of the hole in the collar but is smaller than that of the collar.
11. The quick connector as claimed in claim 1, wherein the first seal of the pushing assembly has a central hole having multiple segments with different inner diameters.
12. The quick connector as claimed in claim 11, wherein the pushing assembly further comprises a second seal being resilient and attached to a rear end of the first seal; and
the second seal has an inner diameter different from the diameters of the central hole of the first seal.