Author: claimsbot

What is claimed is:

1. An aspiration system that can be coupled to a medical handpiece, comprising:
an aspiration tube;
a vacuum generator adapted to create a vacuum pressure within said aspiration tube; and,
a pulse generator adapted to create a plurality of vacuum pulses within said aspiration tube.
2. The aspiration system of claim 1, wherein the vacuum pulses decrease the pressure within said aspiration tube.
3. The aspiration system of claim 1, wherein said pulse generator is coupled to an input device that can be manipulated to vary a repetition rate of the vacuum pulses.
4. The aspiration system of claim 3, wherein said input device is a foot pedal.
5. An medical handpiece, comprising:
a first cannula that has an inner passage which is in fluid communication with a distal opening; and,
a wire that extends across said distal opening.
6. The handpiece of claim 5, further comprising a second cannula that extends over said first cannula.
7. The handpiece of claim 6, wherein said second cannula has a plurality of external teeth.
8. The handpiece of claim 6, wherein said first cannula can be rotated within said second cannula.
9. A tissue removal system, comprising:
a cutter adapted to cut a tissue;
an irrigation handpiece adapted to hold the tissue;
an aspiration system coupled to said cutter; and,
an irrigation system coupled to said irrigation handpiece.
10. The system of claim 9, wherein said aspiration system includes an aspiration tube, a vacuum generator adapted to create a vacuum pressure within said aspiration tube, and a pulse generator adapted to create a plurality of vacuum pulses within said aspiration tube.
11. The system of claim 10, wherein the vacuum pulses decrease the pressure within said aspiration tube.
12. The system of claim 10, wherein said pulse generator is coupled to an input device that can be manipulated to vary a repetition rate of the vacuum pulses.
13. The system of claim 12, wherein said input device is a foot pedal.
14. The system of claim 9, wherein said cutter includes a first cannula that has an inner passage in fluid communication with a distal opening, and a wire that extends across said distal opening.
15. The system of claim 14, further comprising a second cannula that extends over said first cannula.
16. The system of claim 15, wherein said second cannula has a plurality of external teeth.
17. The system of claim 15, wherein said first cannula can be rotated within said second cannula.
18. A medical cutter, comprising:
a first cannula that has an inner passage that is in fluid communication with a distal opening;
a wire that extends across said distal opening;
an aspiration tube that is in fluid communication with said inner passage;
a vacuum generator adapted to create a vacuum pressure within said aspiration tube; and,
a pulse generator adapted to create a plurality of vacuum pulses within said aspiration tube.
19. The cutter of claim 18, wherein the vacuum pulses decrease the pressure within said aspiration tube.
20. The cutter of claim 18, wherein said pulse generator is coupled to an input device that can be manipulated to vary a repetition rate of the vacuum pulses.
21. The cutter of claim 20, wherein said input device is a foot pedal.
22. The cutter of claim 18, further comprising a second cannula that extends over said first cannula.
23. The cutter of claim 22, wherein said second cannula has a plurality of external teeth.
24. The cutter of claim 22, wherein said first cannula can be rotated within said second cannula.
25. A medical device, comprising:
a first cannula that has an inner passage which is in fluid communication with a distal opening;
a heating element that is coupled to said first cannula; and,
a controller that provides energy to said heating element.
26. The device of claim 25, wherein said heating element is a wire that extends across said distal opening.
27. The device of claim 25, further comprising a second cannula that extends over said first cannula.
28. The device of claim 25, wherein said second cannula has a plurality of external teeth.
29. The device of claim 25, wherein said first cannula can be rotated within said second cannula.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for preparing a beverage from a container containing beverage ingredients by centrifugation of the container in a beverage preparation device;
said container comprising:
an outer wall and an inner wall; each wall having a peripheral portion extending around a central axis (I) and a bottom portion;
a lid covering said outer and inner walls; and forming with said inner wall an inner cavity containing beverage ingredients,
an outer collecting cavity positioned between the outer and inner walls,
beverage outlets or outlet precursors positioned on the peripheral portion of the inner wall,

wherein the method comprises:
supplying liquid in the inner cavity,
rotating the container around its central axis (I) to force liquid through beverage outlets from the inner cavity to the outer cavity under the effect of centrifugal pressure, and
maintaining an overpressure of supplied liquid in the container to enable the beverage to be drained from the outer cavity out of the container.
2. The method of claim 1, further comprising the step of forming beverage outlets from the outlet precursors by effect of the centrifugal forces of liquid acting against the peripheral portion of the inner wall during the rotation of the container.
3. Method according to The method of claim 2, wherein the outlet outlets are formed by tearing a membrane of the inner wall to uncover premade openings covered by said membrane or by tearing pre-weakened areas of the inner wall or by expanding pre-cuts formed in the inner wall.
4. The method of claim 1, further comprising the step of draining the beverage through a beverage outlet provided in the bottom portion of the outer wall along said central axis (I) while maintaining said overpressure.
5. The method of claim 1, wherein the overpressure of supplied liquid is of at least 300 mbar, preferably at least 500 mbar.
6. The method of claim 1, wherein the container is rotated by a rotating holding assembly of the device firmly holding a peripheral flange of the container.
7. The method of claim 1, wherein liquid is supplied in the container through the lid.
8. The method of claim 7, wherein the lid is perforated by a liquid injector of the device.
9. The method of claim 1, wherein beverage is drained directly into a receptacle without contacting the device.
10. The method of claim 9, wherein the bottom portion of the outer wall is unsupported by the device.
11. The method of claim 9, wherein a beverage outlet forms a duct protruding outwardly from the outer wall of the container.

1. A method in a wireless communication device, said method comprising:
collecting radio events;
converting said radio events to timing control unit (TCU) instructions;
mapping each of said TCU instructions to a corresponding TCU output to be each executed at a given time; and
if two given TCU outputs are to be executed at consecutive times and are identical, said processor cancelling one of said TCU instructions.
2. The method of claim 1 wherein said wireless communication device is adapted for a Downlink Dual Carrier (DLDC), said wireless communication device comprising a processor, a single TCU and two or more radio devices.
3. The method of claim 2 wherein each of said radio devices comprises a receiver, and said two or more radio devices enable said wireless communication device to simultaneously receive data on two or more frequency channels.
4. The method of claim 2 wherein said TCU interfaces between said processor and said two or more radio devices.
5. The method of claim 2 wherein said TCU is configured to execute said TCU instructions one at a time to generate one or more commands to control at least one of said two or more radio devices.
6. The method of claim 2 wherein each of said two or more radio devices has a corresponding radio event list, and said corresponding radio events lists are collected by said processor.
7. The method of claim 1 wherein said radio events include any one of a digital signal processing radio queue command, a strobe, a front end module configuration change, a processor sleep mode entry, and a system clock calibration.
8. The method of claim 1 further comprising, after converting said radio events to said TCU instructions, sorting said TCU instructions from highest priority to lowest priority to form a sorted list.
9. The method of claim 8 further comprising, after cancelling said at least one of the TCU instructions, loading said sorted list onto said TCU.
10. The method of claim 8 wherein said TCU instructions are sorted from highest priority to lowest priority using any one of bubble sort, quicksort, shell sort, merge sort and bucket sort.
11. The method of claim 8 wherein a priority is dynamically assigned to each of said TCU instructions based on the availability of resources in said wireless communication device’s front end module.
12. The method of claim 1 occurring on Layer 1 of a networking model.
13. A computer readable medium comprising computer executable instructions that when executed by a processor at said wireless communication device perform the method according to claim 1.
14. A wireless communication device comprising a processor, said wireless communication device configured to:
collect radio events;
convert said radio events to timing control unit (TCU) instructions;
map each of said TCU instructions to a corresponding TCU output to be each executed at a given time; and
if two given TCU outputs are to be executed at consecutive times and are identical, said wireless device is configured to cancel one of the TCU instructions.
15. The wireless communication device of claim 14 wherein said wireless communication device is adapted for a Downlink Dual Carrier (DLDC), and further comprises a single TCU and two or more radio devices.
16. The wireless communication device of claim 15 wherein each of said radio devices comprises a receiver, and said two or more radio devices enable said wireless communication device to simultaneously receive data on two or more frequency channels.
17. The wireless communication device of claim 15 wherein said TCU interfaces between said processor and said two or more radio devices.
18. The wireless communication device of claim 15 wherein said TCU is configured to execute said TCU instructions one at a time to generate one or more commands to control at least one of said two or more radio devices.
19. The wireless communication device of claim 15 wherein each of said two or more radio devices has a corresponding radio event list, and said process is configured to collect said corresponding radio events lists.
20. The wireless communication device of claim 15 wherein said radio events include any one of a digital signal processing radio queue command, a strobe, a front end module configuration change, a processor sleep mode entry, and a system clock calibration.
21. The wireless communication device of claim 15 further configured to, after converting said radio events to said TCU instructions, sort said TCU instructions from highest priority to lowest priority to form a sorted list.
22. The wireless communication device of claim 21 further configured to, after cancelling said at least one of the TCU instructions, load said sorted list onto said TCU.
23. The wireless communication device of claim 21 wherein said TCU instructions are sorted from highest priority to lowest priority using any one of bubble sort, quicksort, shell sort, merge sort and bucket sort.
24. The wireless communication device of claim 21 wherein a priority is dynamically assigned to each of said TCU instructions based on the availability of resources in said wireless communication device’s front end module.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A semiconductor package comprising:
an interconnecting structure, wherein the interconnecting structure includes a redistribution layer (RDL);
a semiconductor die bonded to the interconnecting structure by a first plurality of bonding structures, wherein the RDL of the interconnecting layer enables fan-out connection of the semiconductor die; and
a package structure bonded to the interconnecting structure by a second plurality of bonding structures, wherein the semiconductor die is placed in a space between the package structure and the interconnecting structure.
2. The semiconductor package of claim 1, the interconnecting structure includes conductive structures surrounded by one or more dielectric layers.
3. The semiconductor package of claim 2, wherein the one of more dielectric layers are made of photo-sensitive polymers.
4. The semiconductor package of claim 1, wherein the interconnecting structure has a thickness equal to or less than about 30 \u03bcm.
5. The semiconductor package of claim 1, wherein a total thickness of the interconnecting structure and the package structure covered with a molding layer is in a range from about 350 \u03bcm to about 1050 \u03bcm.
6. The semiconductor package of claim 1, wherein a distance between a first surface of the package structure facing a second surface of the interconnecting structure and the second surface is in a range from about 100 \u03bcm to about 400 \u03bcm.
7. The semiconductor package of claim 1, wherein a plurality of connecting elements are bonded to the interconnecting structures on an opposite surface from the semiconductor die and the package structure.
8. The semiconductor package of claim 1, further comprising:
another semiconductor die adjacent to the semiconductor die, wherein the other semiconductor die is bonded to the interconnecting structure and is placed in a space between the package structure and the interconnecting structure.
9. The semiconductor package claim 1, wherein the package structure includes two or more semiconductor dies.
10. The semiconductor package of claim 1, wherein the interconnecting structure includes a first connector for forming a first bonding structure with the semiconductor die and a second connector for forming a second bonding structure with the package structure, wherein a first width of the first connector is smaller than a second width of the second connector.
11. The semiconductor package of claim 10, wherein the first connector and the second connector both include a barrier layer.
12. The semiconductor package of claim 10, wherein the first connector and the second connector both include a conductive layer.
13. The semiconductor package of claim 10, wherein the first width is in a range from about 20 \u03bcm to about 100 \u03bcm.
14. The semiconductor package of claim 10, wherein the second width is in a range from about 100 \u03bcm to about 400 \u03bcm.
15. A semiconductor package comprising:
an interconnecting structure, wherein the interconnecting structure include a redistribution layer (RDL), wherein the interconnecting structure has a thickness equal to or less than about 30 \u03bcm;
a semiconductor die bonded to the interconnecting structure by a first plurality of bonding structures, wherein the RDL of the interconnecting layer enables fan-out connection of the semiconductor die; and
a package structure bonded to the interconnecting structure by a second plurality of bonding structures, wherein the semiconductor die is placed in a space between the package structure and the interconnecting structure.
16-20. (canceled)
21. A semiconductor package comprising:
an interconnecting structure, wherein the interconnecting structure comprises a first redistribution layer (RDL);
a semiconductor die bonded to the first RDL by a first bonding structure having a first width; and
a package structure bonded to the first RDL by a second bonding structure having a second width different from the first width, wherein the package structure is on an opposite side of the semiconductor die from the interconnecting structure.
22. The semiconductor package of claim 21, wherein the interconnecting structure further comprising a second RDL separated from the first RDL, the semiconductor die is bonded to the second RDL by a third bonding structure having the first width, and the package structure is bonded to the second RDL by a fourth bonding structure having the second width.
23. The semiconductor package of claim 22, wherein the semiconductor die is located between the second bonding structure and the fourth bonding structure.
24. The semiconductor package of claim 21, further comprising a molding layer, wherein the molding layer surrounds the package structure and fills a space between the semiconductor die and the interconnecting structure.
25. The semiconductor package of claim 21, wherein an overall height of the semiconductor package ranges from about 350 microns (\u03bcm) to about 1050 \u03bcm.