1. An integrated exciter-igniter unit comprising:
a housing comprising an exciter electronics assembly;
an igniter directly mounted to an end of the housing; and
an ignition coil contained within the housing and which directly interfaces with the igniter.
2. The integrated exciter-igniter unit of claim 1, wherein the housing is a hermetically sealed stainless steel enclosure.
3. The integrated exciter-igniter unit of claim 1, wherein the unit transforms a DC input voltage into a high-voltage, high-energy pulse train for igniting a propellant.
4. The integrated exciter-igniter unit of claim 3, wherein the unit mates to an external electrical system via a hermetic connector.
5. The integrated exciter-igniter unit of claim 4, wherein the igniter comprises a spark plug and a tip.
6. The integrated exciter-igniter unit of claim 5, wherein the tip is comprised of a high temperature alloy.
7. The integrated exciter-igniter unit of claim 1, wherein the exciter electronics assembly comprises an input connector board, a DC-DC converter board, and an HV exciter board.
8. The integrated exciter-igniter unit of claim 7, wherein the input connector board provides an interface between the hermetic connector and the exciter electronics assembly.
9. The integrated exciter-igniter unit of claim 8, wherein the input connector board generates timing signals.
10. The integrated exciter-igniter unit of claim 9, wherein the DC-DC converter board regulates energy storage voltage, which is responsible for delivering a bulk of a spark energy pulse.
11. The integrated exciter-igniter unit of claim 10, wherein the HV exciter board is positioned at bottom of the exciter electronics assembly.
12. The integrated exciter-igniter unit of claim 11, wherein the HV exciter board generates a high voltage spark and sends a scaled signal of spark current to the input connector board.
13. The integrated exciter-igniter unit of claim 12, wherein the HV exciter board provides a mounting location for the ignition coil and eliminates need for a high voltage cable by interconnecting the igniter and the ignition coil.
14. The integrated exciter-igniter unit of claim 13, wherein a high voltage pin interfaces the igniter to the HV exciter board and the ignition coil.
15. A flight-like, exciter-igniter unit comprising:
a hermetically sealed housing comprising an exciter electronics assembly and an ignition coil enclosed within the housing; and
an igniter directly mounted to an end of the housing,
wherein the ignition coil directly interfaces with the igniter.
16. The flight-like, exciter-igniter unit of claim 15, wherein the exciter electronics assembly comprises an input connector board, a DC-DC converter board, and an HV exciter board.
17. The flight-like, exciter-igniter unit of claim 16, wherein the unit mates to an external electrical system via a hermetic connector.
18. The flight-like, exciter-igniter unit of claim 15, wherein the igniter comprises a spark plug and a tip.
19. An exciter-igniter, comprising:
an enclosure comprising an input connector board, a DC-DC converter board, and an HV exciter board;
an igniter directly mounted to an end of the enclosure; and
an ignition coil housed within the enclosure and which directly interfaces to the igniter via the HV exciter board.
20. The exciter-igniter of claim 19, wherein a high voltage pin interfaces the igniter to the HV exciter board and the ignition coil.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An optical transceiver module, comprising:
an optical transmitter including a light source that produces an optical signal;
an optical receiver that receives an optical signal;
a lead frame connector for connecting at least one of the optical transmitter and the optical receiver to a component of the optical transceiver module, the lead frame connector including:
at least one electrically insulating casing; and
a plurality of conductors that are electrically isolated one from another, the plurality of conductors forming:
a plurality of electrical contacts that correspond with and can be connected to leads of the corresponding one of the optical transmitter and the optical receiver; and
a plurality of leads that correspond with and can be connected to conductive structures on the component of the optical transceiver module.
2. An optical transceiver module as defined in claim 1, further comprising an integrated circuit control module that is in digital communication with a consolidated post amplifier and laser driver, the control module and consolidated post amplifierlaser driver being included on a printed circuit board positioned in the optical transceiver module.
3. An optical transceiver module as defined in claim 2, wherein the optical transmitter is connected to the printed circuit board by the lead frame connector, and wherein the plurality of electrical contacts consists of four electrical contacts.
4. An optical transceiver module as defined in claim 2, wherein the optical receiver is connected to the printed circuit board by the lead frame connector, and wherein the plurality of electrical contacts consists of five electrical contacts.
5. An optical transceiver module as defined in claim 2, wherein a first lead frame connector connects the optical transmitter to the printed circuit board, and wherein a second lead frame connector connects the optical receiver to the printed circuit board.
6. An optical transceiver module as defined in claim 1, wherein an isolating hole of the lead frame connector is formed through the at least one electrically insulating casing, wherein the plurality of conductors are exposed at the isolating hole and are electrically separated one from another by the isolating hole.
7. An optical transceiver module as defined in claim 1, wherein the conductors are bent at segments thereof between a first electrically insulating casing and a second electrically insulating casing.
8. An optical transceiver module as defined in claim 1, wherein the at least one electrically insulating casing is insert injection molded over a portion of the plurality of conductors.
9. An optical transceiver module as defined in claim 8, wherein the at least one electrically insulating casing includes a flexible portion that enables the casing and the plurality of conductors to be bent at the flexible portion.
10. An optical transceiver module as defined in claim 9, wherein the flexible portion is interposed between the plurality of electrical contacts and the plurality of leads.
11. An optical transceiver module, comprising:
a transmitter optical subassembly including a laser for producing an optical signal;
a receiver optical subassembly that receives an optical signal;
a printed circuit board including:
a laser driver operably connected to the transmitter optical subassembly;
a post amplifier operably connected to the receiver optical subassembly; and
an integrated circuit control module that is in digital communication with at least one of the laser driver and post amplifier; and
first and second lead frame connectors for respectively connecting the transmitter optical subassembly and the receiver optical subassembly to the printed circuit board, each lead frame connector including:
a first electrically insulating casing forming a body that defines a plane;
a second electrically insulating casing; and
a plurality of conductors that are electrically isolated one from another, the plurality of conductors forming:
a plurality of electrical contacts exposed through the electrically insulating casing, the electrical contacts being arrayed in a configuration that is substantially parallel to the plane defined by the first casing, wherein the electrical contacts correspond to and can be connected to leads of the corresponding one of the transmitter optical subassembly and the receiver optical subassembly; and
a plurality of leads each electrically connected to one of the plurality of contacts, wherein each of the plurality of leads corresponds to and can be connected to conductive structures on the printed circuit board, wherein each of the leads extends from the second casing.
12. An optical transceiver module as defined in claim 11, wherein the laser driver and the post amplifier are integrated as a single chip on the printed circuit board.
13. An optical transceiver module as defined in claim 11, wherein the laser driver, the post amplifier, and the control module are integrated as a single chip on the printed circuit board.
14. An optical transceiver module as defined in claim 11; wherein the transmitter optical subassembly and the receiver optical subassembly are configured to operate at a data rate of at least four gigabitssecond.
15. An optical transceiver module as defined in claim 11, wherein each of the plurality of conductors in shaped so as to control impedance mismatch of an electrical signal carried by the conductor.
16. An optical transceiver module, comprising:
a transmitter optical subassembly including a laser device that produces an optical signal for transmission via an optical fiber;
a receiver optical subassembly that receives an optical signal from an optical fiber;
a printed circuit board;
first and second lead frame connectors for respectively connecting the transmitter and receiver optical subassemblies to the printed circuit board, each lead frame connector including:
first and second electrically insulating cases;
a plurality of conductors that are electrically isolated one from another by the first and second insulating cases; and
wherein each of the plurality of conductors forms an electrical contact housed within the first insulating case and a contact point extending from the second insulating case.
17. An optical transceiver module as defined in claim 16, wherein the first insulating case is oriented at an angle with respect to the second insulating case.
18. An optical transceiver module as defined in claim 17, wherein the first and second insulating cases are configured to affect the impedance of the plurality of conductors.
19. An optical transceiver module as defined in claim 18, wherein the first and second lead frame connectors are manufactured such that the first insulating case is initially co-planar with the second insulating case.
20. An optical transceiver module as defined in claim 19, wherein each of the conductors is bent at a point between the first insulating case and the second insulating case.