Author: claimsbot

1. A management device that manages data migration between normal and virtual volumes in a storage system in which the normal and virtual volumes coexist as types of volumes for reading and writing data, the normal volumes being volumes to which existing physical storage areas are allocated in advance and the virtual volumes being volumes to which existing physical storage areas are dynamically allocated according to use status from a storage pool shared with the virtual volumes, the management device comprising:
a display unit that displays information; and
a control unit that collects information regarding the volumes, and based on the collected information, causes the display unit to separately display, simultaneously for both the normal volumes and the virtual volumes, at least a total logical capacity of the normal volumes and a total logical capacity of the virtual volumes, wherein each of the total logical capacities is a summation of logical capacities that include a capacity unallocated yet;
wherein based on collected information on each volume, for each volume belonging to a volume group that is specified as a data migration source, the control unit sets a pair with the volume as the data migration source and any of the volumes belonging to a volume group specified as the data migration destination as the data migration destination, and displays information regarding each of the set pairs on the display unit; and
wherein the control unit preferentially sets volumes of a same volume type as the pairs, and preferentially displays information related to the pairs on the display unit over other pairs.
2. The management device according to claim 1, wherein the control unit causes, with respect to a data migration source volume group, a total occupied capacity that is the capacity actually occupied on the storage to be displayed in addition to the total logical capacity on the display unit separately for the normal volumes and the virtual volumes.
3. The management device according to claim 1, wherein the control unit causes, with respect to a data migration destination volume group, the total logical capacity of unused normal volumes to be displayed on the display unit for normal volumes, and a free space of a virtual pool by which the storage area is dynamically allocated to the virtual volume to be displayed on the display unit for virtual volumes in addition to the respective total logical capacities of the normal volumes and the virtual volumes.
4. The management device according to claim 3, wherein the control unit causes data quantities by free space corresponding to each of the respective total logical capacities of the normal volumes and the virtual volumes to be displayed on the display unit.
5. The management device according to claim 1, wherein when a volume type of a data migration source volume is the virtual volume and a free space of the data migration source volume is equal to or lower than a predetermined value, the control unit selects a normal volume as a volume type of a data migration destination volume.
6. The management device according to claim 1, wherein for a pair of volumes whose volume attributes differ from each other, the control unit displays information indicating that the volume attributes differ on the display unit.
7. The management device according to claim 1, wherein the control unit causes the display unit to display an evaluation screen that displays a suggestion that data stored in a virtual volume having low free space, among virtual volumes mapped onto a virtual pool having low free space, should be migrated to a normal volume, the virtual pool being a pool of virtual volumes by which a storage area is dynamically allocated to the virtual volume.
8. A management device that manages data migration between normal and virtual volumes in a storage system in which the normal and virtual volumes coexist as types of volumes for reading and writing data, the normal volumes being volumes to which existing physical storage areas are allocated in advance and the virtual volumes being volumes to which existing physical storage areas are dynamically allocated according to use status from a storage pool shared with the virtual volumes, the management device comprising:
a display unit that displays information; and
a control unit that collects information regarding the volumes, and based on the collected information, causes the display unit to separately display, simultaneously for both the normal volumes and the virtual volumes, at least a total logical capacity of the normal volumes and a total logical capacity of the virtual volumes, wherein each of the total logical capacities is a summation of logical capacities that include a capacity unallocated yet;
wherein for each virtual volume belonging to a volume group specified as a data migration source, the control unit determines a free space of the virtual volume according to a predetermined evaluation formula, and based on the determination, displays on the display unit an evaluation screen that displays a suggestion that preferential migration of data stored in the virtual volume having a large free space should be performed to a virtual volume among volumes belonging to a volume group specified as the data migration destination.
9. A management method for managing data migration between normal and virtual volumes in a storage system in which the normal and virtual volumes coexist as types of volumes for reading and writing data, the normal volumes being volumes to which existing physical storage areas are allocated in advance and the virtual volumes being volumes to which existing physical storage areas are dynamically allocated according to use status from a storage pool shared with the virtual volumes, the management method comprising:
a first step for collecting information regarding the volumes, and
a second step for separately displaying, based on the collected information, and simultaneously for both the normal volumes and the virtual volumes, at least a total logical capacity of the normal volumes and a total logical capacity of the virtual volumes, wherein each of the total logical capacities is a summation of logical capacities that include a capacity unallocated yet;
wherein in the second step, based on collected information on each volume, for each volume belonging to a volume group that is specified as a data migration source, a pair is set with the volume as the data migration source and any of the volumes belonging to a volume group specified as the data migration destination as the data migration destination, and information regarding each of the set pairs is displayed;
wherein in the second step, volumes of a same volume type are preferentially set as the pairs, and information related to the pairs is preferentially displayed over other pairs.
10. The management method according to claim 9, wherein in the second step, with respect to a data migration source volume group, a total occupied capacity that is the capacity actually occupied on the storage is displayed in addition to the total logical capacity separately for the normal volumes and the virtual volumes.
11. The management method according to claim 9, wherein in the second step, with respect to a data migration destination volume group, the total logical capacity of unused normal volumes is displayed for normal volumes and a free space of a virtual pool by which the storage area is dynamically allocated to the virtual volume is displayed for virtual volumes in addition to the respective total logical capacities of the normal volumes and the virtual volumes.
12. The management method according to claim 11, wherein in the second step, data quantities by free space corresponding to each of the respective total logical capacities of the normal volumes and the virtual volumes are displayed.
13. The management method according to claim 9, wherein in the second step, when a volume type of a data migration source volume is the virtual volume and a free space of the data migration source volume is equal to or lower than a predetermined value, a normal volume is selected as a volume type of a data migration destination volume.
14. The management method according to claim 9, wherein, in the second step, for a pair of volumes whose volume attributes differ from each other, information indicating that the volume attributes differ is displayed.
15. The management method according to claim 9, further comprising a third step for displaying an evaluation screen that displays a suggestion that data stored in a virtual volume having low free space, among the virtual volumes mapped onto a virtual pool having low free space, should be migrated to a normal volume, the virtual pool being a pool of virtual volumes by which a storage area is dynamically allocated to the virtual volume.
16. A management method for managing data migration between normal and virtual volumes in a storage system in which the normal and virtual volumes coexist as types of volumes for reading and writing data, the normal volumes being volumes to which existing physical storage areas are allocated in advance and the virtual volumes being volumes to which existing physical storage areas are dynamically allocated according to use status from a storage pool shared with the virtual volumes, the management method comprising:
a first step for collecting information regarding the volumes, and
a second step for separately displaying, based on the collected information, and simultaneously for both the normal volumes and the virtual volumes, at least a total logical capacity of the normal volumes and a total logical capacity of the virtual volumes, wherein each of the total logical capacities is a summation of logical capacities that include a capacity unallocated yet;
wherein, in the second step, for each virtual volume belonging to a volume group specified as a data migration source, a free space of the virtual volume is determined according to a predetermined evaluation formula, and based on the determination, an evaluation screen is displayed that displays a suggestion that preferential migration of data stored in the virtual volume having a large free space should be performed to a virtual volume among volumes belonging to a volume group specified as the data migration destination.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A semiconductor chip electrical connection structure, comprising:
a plurality of electrode pads formed on a surface of a chip, wherein the chip is mounted via another surface thereof on a carrier;
a plurality of conductive bumps formed on the electrode pads, and protruding from a dielectric layer applied on the chip and the carrier, wherein a top surface and a side surface of the chip are completely covered by the dielectric layer; and
a plurality of electrical connection pads formed on the dielectric layer and electrically connected to the conductive bumps protruding from the dielectric layer, wherein the electrical connection pads are sized larger than the conductive bumps and completely cover the protruding conductive bumps, so as to provide outward electrical extension for the chip via the electrical connection pads.
2. The semiconductor chip electrical connection structure of claim 1, wherein a plurality of conductive elements are formed on the electrical connection pads to provide external electrical connection for the chip.
3. The semiconductor chip electrical connection structure of claim 1, wherein a circuit build-up structure is formed on the electrical connection pads and electrically connected to the chip.
4. The semiconductor chip electrical connection structure of claim 3, wherein the circuit build-up structure comprises an insulating layer, a circuit layer stacked on the insulating layer, and conductive blind vias formed through the insulating layer.
5. The semiconductor chip electrical connection structure of claim 4, wherein the circuit layer is electrically connected to the electrical connection pads on the conductive bumps of the chip by the conductive blind vias.
6. The semiconductor chip electrical connection structure of claim 4, wherein a plurality of conductive elements are formed on an exterior surface of the circuit build-up structure to provide external electrical connection for the chip.
7. The semiconductor chip electrical connection structure of claim 1, wherein the conductive bumps are formed on the electrode pads of the chip by electroplating, physical deposition or chemical deposition.

1. An organic EL display device comprising:
lower electrodes each provided for each of pixels;
a bank layer formed so as to cover the peripheries of the lower electrodes and including bank openings through each of which a portion of the lower electrode is exposed;
an organic layer including a light-emitting layer and portions each formed in the bank opening;
a first barrier layer covering the organic layer;
a second barrier layer covering the first barrier layer;
an intermediate layer formed between the first barrier layer and the second barrier layer, formed of a different material from those of the first barrier layer and the second barrier layer, and located at the edges of the bank openings;
light reflection films each provided under the lower electrode for each of the pixels;
a first region where the intermediate layer is located when the pixel is viewed in a plan view; and
a second region located inside the first region, wherein
the first region includes, above or under the intermediate layer, a different layer structure from that of the second region.
2. The organic EL display device according to claim 1, wherein
one of the first region and the second region includes, above or under the intermediate layer, a layer that is not present in the other.
3. The organic EL display device according to claim 1, wherein
a distance from the organic layer to the light reflection film in the first region is different from a distance from the organic layer to the light reflection film in the second region.
4. The organic EL display device according to claim 3, wherein
the number of layers present between the organic layer and the light reflection film in the first region is different from that of in the second region.
5. The organic EL display device according to claim 3, wherein
a first light reflection film and a second light reflection film are provided as the light reflection film for each of the pixels,
the organic EL display device further includes a conductive film under the lower electrode,
the first light reflection film, the conductive film, the second light reflection film, the lower electrode, and the organic layer are formed in this order, and
one of the first region and the second region includes the second light reflection film, while the other includes the first light reflection film and does not include the second light reflection film.
6. The organic EL display device according to claim 3, further comprising a conductive film above the lower electrode, wherein
the light reflection film, the lower electrode, the conductive film, and the organic layer are formed in this order, and
one of the first region and the second region includes both the lower electrode and the conductive film, while the other includes the lower electrode and does not include the conductive film.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An interposer comprising:
an array of buttons on a carrier having a proximity to each other that allows contact between two adjacent buttons to occur when the two adjacent buttons are compressed above a predetermined threshold.
2. The interposer of claim 1, wherein the contact between the two adjacent buttons occurs when the two adjacent buttons are axially compressed above a predetermined threshold.
3. The interposer of claim 1, wherein the array of buttons is arranged in a regularly spaced array.
4. The interposer of claim 1, wherein the array of buttons is arranged in a custom arrangement based upon positions of the contacts on one of a chip carrier and a printed circuit board.
5. The interposer of claim 1, wherein a rate at which the radius of at least one of the buttons expands while being axially compressed slows at a first range of axial compression.
6. The interposer of claim 5, wherein the rate at which the radius of the two buttons expand while being axially compressed slows at a second range of axial compression.
7. The interposer of claim 1, wherein the buttons comprise an elastomeric compound that has embedded metallic particles.
8. The interposer of claim 1, wherein the buttons comprise a deformable material.
9. The interposer of claim 8, wherein the buttons comprise a deformable metal.
10. The interposer of claim 9, wherein the buttons comprise soft metal balls.
11. A chip package comprising:
a chip having a first surface and a second surface;
a printed circuit board having a first surface and a second surface, wherein the first surfaces are closer to each other than the second surfaces; and
an interposer having an array of buttons between said chip and said printed circuit board, wherein said first surfaces face each other and said second surfaces face each other.
12. The package of claim 11, wherein at least one button of the array of buttons is compressed between said first surfaces.
13. The package of claim 12, wherein said at least one button contacts an adjacent button in the array of buttons.
14. The package of claim 12, wherein at least one other button of the array of buttons is compressed between said second surfaces.
15. The package of claim 14, wherein said at least one button of the array of buttons comprises a plurality of buttons compressed between said first surfaces and surrounding said at least one other button of the array of buttons compressed between said second surfaces.
16. The package of claim 15, wherein the plurality of buttons compressed between said first surfaces are compressed above a predetermined threshold such that adjacent buttons of the plurality of buttons contact each other.
17. The package of claim 16, wherein the plurality of buttons compressed between said first surfaces and said at least one other button of the array of buttons compressed between said second surfaces form at least one coaxial transmission line.
18. The package of claim 17, wherein the at least one coaxial transmission line supports a transverse electromagnetic mode of propagation across a wide frequency band.
19. The package of claim 17, wherein the at least one coaxial transmission line provides a predetermined impedance across a frequency band.
20. The package of claim 19, wherein the predetermined impedance is between about 50 Ohms and 100 Ohms.
21. The package of claim 19, wherein the wide frequency band is about 3 GHz wide.
22. The package of claim 11, wherein the array of buttons is arranged in a regularly spaced array.
23. The package of claim 11, wherein the array of buttons is arranged in a custom arrangement based upon positions of the contacts on one of the chip carrier and the printed circuit board.
24. The package of claim 11, wherein a rate at which the radius of at least one button of the buttons expands while being axially compressed slows at a first range of axial compression.
25. The package of claim 24, wherein the rate at which the radius of the at least one button expands while being axially compressed slows at a second range of axial compression.
26. The package of claim 11, wherein at least one button of the buttons comprise an elastomeric compound having embedded metallic particles.
27. The package of claim 11, wherein the buttons comprise a deformable material.
28. The package of claim 27, wherein the buttons comprise a deformable metal.
29. The package of claim 28, wherein the buttons comprise soft metal balls.
30. The package of claim 11, further comprising a clamping ring holding the chip against the interposer and the interposer against the printed circuit board.
31. The package of claim 11, wherein the chip comprises laminations that form said first surface and said second surface.
32. The package of claim 11, wherein the printed circuit board comprises laminations that form said first surface and said second surface.
33. A chip package comprising:
a chip carrier;
a printed circuit board;
an interposer having an array of buttons between said chip carrier and said printed circuit board; and
a sheet positioned between the interposer and one of the chip carrier and the printed circuit board,
wherein the sheet defines a first hole through which a first button of the array of buttons passes and a second hole through which a second button of the array of buttons passes, and
wherein the first hole compresses the first button more than the second hole compresses the second button.
34. The package of claim 33, wherein the second hole is large enough such that the second button does not contact the sheet.
35. The package of claim 33, wherein the first button is compressed such that the first button radially contacts an adjacent button.
36. A chip package comprising:
a chip carrier;
a printed circuit board;
an interposer having an array of buttons between said chip carrier and said printed circuit board; and
a sheet positioned between the interposer and one of the chip carrier and the printed circuit board,
wherein the sheet defines a hole through which a first button of the array of buttons passes and comprises a conductive disc axially compressing a second button of the array of buttons.
37. The package of claim 36, wherein the second button is axially compressed such that the second button radially contacts an adjacent button.
38. A method of making a chip package comprising:
providing an interposer having an array of buttons on a carrier having a proximity to each other that allows contact between two adjacent buttons to occur when the two adjacent buttons are compressed above a predetermined threshold; and
compressing the interposer between a chip carrier and a printed circuit board.
39. A method of making a chip package comprising:
providing an interposer having an array of buttons;
providing a sheet having a hole and a conductive disc;
positioning the interposer between a chip carrier and a printed circuit board; and
positioning the sheet between the interposer and one of the chip carrier and the printed circuit board such that a first button of the array of buttons passes through the hole in the sheet and such that a second button of the array of buttons is axially compressed by the conductive disc.