Author: claimsbot

1. A process of reducing the cholesterol content in cholesterol-containing organic oils or fats, particularly animal oils or fats, the process comprising the steps of:
adding at least one of demineralized water and distilled water having a set pH-value to the cholesterol-containing oils or fats, thereby forming a mixture; and
separating the mixture into a cholesterol-containing aqueous phase and a cholesterol-reduced oil or fat phase.
2. The process according to claim 1, wherein the separating into the cholesterol-containing aqueous phase takes place in a centrifuge.
3. The process according to claim 1, wherein the separating into the cholesterol-containing aqueous phase takes place in a separating centrifuge.
4. The process according to claim 1, wherein the at least one of demineralized water and distilled water has a set pH-value between 4 and 6.
5. The process according to claim 1, wherein the at least one of demineralized water and distilled water has a set pH-value between 6.5 and 8.
6. The process according to claim 1, wherein the separating takes place within a time period of less than 5 to 10 minutes after the adding of the at least one of demineralized water and distilled water.
7. The process according to claim 1, wherein the steps of adding and separating repeated at least once.
8. The process according to claim 1, wherein the cholesterol-containing oils or fats includes cut-up beef drippings.
9. The process according to claim 1, wherein the at least one of demineralized water and distilled water is added to the cholesterol-containing oils or fats at a ratio of 1:1.
10. The process according to claim 1, wherein the separating into the cholesterol-containing aqueous phase takes place in a separator.
11. The process according to claim 10, wherein the separator includes a vertical axis of rotation and a disk stack.
12. The process according to claim 1, wherein the at least one of the demineralized water and distilled water has set pH-value between 5 and 6.
13. The process according to claim 1, wherein the separating takes place within a period of less than 120 seconds after the adding of the at least one of demineralized water and distilled water.
14. The process according to claim 1, wherein the separating takes place within a time period of less than 60 seconds after the adding of the at least one of demineralized water and distilled water.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A packaged semiconductor, comprising:
a leadframe comprising a plurality of leads and a paddle, each one of said plurality of leads having a top portion and a bottom portion;
a semiconductor chip attached to said paddle;
a plurality of wires electrically connecting said semiconductor chip to said plurality of leads; and
a sealing material encapsulating said leadframe, said semiconductor chip, and said plurality of wires, said sealing material forming a top surface and a bottom surface of said packaged semiconductor, said top portion of said plurality of leads protruding from said top surface of said packaged semiconductor and said bottom portion of said plurality of leads protruding from said bottom portion of said packaged semiconductor.
2. The semiconductor package of claim 1 wherein said plurality of leads are etched.
3. The semiconductor package of claim 1 wherein said paddle is etched.
4. The semiconductor package of claim 1 wherein said paddle has a bottom side resting flush against said bottom surface of said semiconductor package.
5. The semiconductor package of claim 1 wherein said top portion and said bottom portion of said plurality of leads are electroplated.
6. The semiconductor package of claim 1 wherein said plurality of electrically conductive wires are electroplated with a material selected from the group consisting of: silver, gold, aluminum, or an alloy thereof
7. The semiconductor package of claim 1 wherein said plurality of leads are arranged in at least one single line wherein said at least one single line surrounds said paddle.
8. A semiconductor package of claim 1 wherein said plurality of leads are randomly dispersed in a plurality of lines surrounding said paddle.
9. A packaged semiconductor, comprising:
a leadframe comprising a plurality of leads and a location for attaching a semiconductor chip, each one of said plurality of leads having a top portion and a bottom portion;
a semiconductor chip attached to said location for attaching a semiconductor chip;
a plurality of wires electrically connecting said semiconductor chip to said plurality of leads; and
a sealing material encapsulating said leadframe, said semiconductor chip, and said plurality of wires, said sealing material forming a top surface and a bottom surface of said packaged semiconductor, said top portion of said plurality of leads protruding from said top surface of said packaged semiconductor and said bottom portion of said plurality of leads protruding from said bottom portion of said packaged semiconductor.
10. The semiconductor package of claim 9 wherein said plurality of leads are etched.
11. The semiconductor package of claim 9 wherein said paddle has a bottom side resting flush against said bottom surface of said semiconductor package.
12 The semiconductor package of claim 9 wherein said paddle is etched.
13. The semiconductor package of claim 9 wherein said top portion and said bottom portion of said plurality of leads are electroplated.
14. The semiconductor package of claim 9 wherein said plurality of electrically conductive wires are selected from the group consisting of: silver, gold, aluminum, or an alloy thereof.
15. The semiconductor package of claim 9 wherein said plurality of leads are arranged in at least one single line wherein said at least one single line surrounds said paddle.
16. A semiconductor package of claim 9 wherein said plurality of leads are randomly dispersed in a plurality of lines surrounding said paddle.
17. A method for stacking semiconductor packages for semiconductor chips, said method for stacking semiconductor packages comprising the steps of:
physically and electrically connecting a first side of a first semiconductor package to a printed circuit board, said first semiconductor package having a first plurality of leads, each one of said first plurality of leads having a first section protruding out of a first top surface of said first semiconductor package and a second section protruding out of a first bottom surface of said first semiconductor package; and
physically and electrically connecting a second semiconductor package to a second side of said first semiconductor package, said second side located generally opposite of said first side, said second semiconductor package having a second plurality of leads in generally the same place as said first plurality of leads.
18. The method for stacking semiconductor packages as in claim 17 further comprising the step of soldering said first semiconductor package to said printed circuit board.
19. A method for stacking semiconductor packages as in claim 17 further comprising the step of soldering said second semiconductor package to said first semiconductor package.
20. A method for stacking semiconductor packages as in claim 17, further comprising sandwiching a solder ball between said first plurality of leads of said first semiconductor package and said second plurality of leads of said second semiconductor package prior to physically and electrically connecting said second semiconductor package to said first semiconductor package.
21. A method for stacking semiconductor packages as in claim 17 further comprising the step of soldering said first semiconductor package to said printed circuit board.
22. A method for stacking semiconductor packages as in claim 17 further comprising the step of soldering said second semiconductor package to said first semiconductor package.
23. A method for manufacturing a semiconductor package for a semiconductor chip, said method for manufacturing a semiconductor package comprising the steps of:
attaching a semiconductor chip to a paddle of a lead frame, said lead frame having a plurality of leads surrounding said paddle;
electrically connecting said semiconductor chip to at least some of said plurality of leads via a plurality of wires; and
applying a sealing material to secure said semiconductor chip, said lead frame, and said plurality of wires, said sealing material forming a top side and a bottom side of said semiconductor package, with a first section of each of said plurality of leads protruding out of said top side of said semiconductor package and a second section of each of said plurality of leads protruding out of said bottom side of said semiconductor package.
24. A semiconductor package, comprising:
a lead frame having a plurality of leads and a paddle for supporting a semiconductor chip, each one of said plurality of leads having a top portion protruding from a top surface of said semiconductor package and a bottom portion protruding from a bottom surface of said semiconductor package;
a plurality of wires electrically connecting said semiconductor chip to said plurality of leads; and
sealing material encapsulating said lead frame, said semiconductor chip, and said plurality of wires.
25. A lead frame, comprising:
a paddle for supporting a semiconductor chip; and
a plurality of leads, each one of said plurality of leads having an attachment point for a plurality of wires to electrically connect said semiconductor chip to at least some of said plurality of leads, each one of said plurality of leads configured to be encapsulated such that a top portion of each one of said plurality of leads protrudes from a top surface of an encapsulant and a bottom portion of each one of said plurality of leads protrudes from a bottom surface of said encapsulant.

1. A system for reducing the diameter of a stent comprising:
a stent contracting assembly, the stent contracting assembly comprising a plurality of moveable contracting members, the plurality of contracting members defining a diameter reduction chamber, the chamber having a reduced diameter configuration and a pre-reduction diameter configuration, the contracting assembly constructed and arranged to receive a stent into and through the chamber, wherein when the chamber is in the pre-reduction diameter configuration the stent has a first diameter and when the chamber is in the reduced diameter configuration the stent has a second diameter, the second diameter being less than the first diameter, wherein the chamber defines a first end opening and a second end opening, the stent being moveable through the chamber from the first end opening to the second end opening, the stent contracting assembly further comprising a housing, the plurality of moveable contracting members being mechanically engaged to the housing, the stent contracting assembly further comprising at least one seal member, the at least one seal member engaged to a portion of the housing adjacent to at least one of the first end opening and the second end opening of the chamber, the at least one seal member providing a fluid tight seal to the at least one of the first end opening and the second end opening;
a fluid source, the fluid source in fluid communication with the chamber, the fluid source constructed and arranged to provide a fluid bearing between the contracting members and the stent which prevents the contracting members from contacting the stent in the reduced diameter configuration;
wherein the stent contracting assembly defines at least one fluid injection port, the at least one fluid injection port in fluid communication with the chamber and the fluid source.
2. The system of claim 1 wherein the plurality of moveable contracting members are adjacent one another, adjacent contracting members defining a space therebetween, each space in fluid communication with the fluid source and the chamber.
3. The system of claim 2 wherein the plurality of moveable contracting members are positioned longitudinally adjacent one another.
4. The system of claim 2 wherein the plurality of moveable contracting members are positioned radially adjacent one another.
5. The system of claim 1 wherein at least one of the plurality of moveable contracting members defines a space the space in fluid communication with the fluid source and the chamber.
6. The system of claim 1, wherein in the reduced diameter configuration the diameter of the chamber in the first end region and the diameter of the chamber second end region are different.
7. The system of claim 6 wherein the diameter of the chamber in the second end region is greater than the diameter of the chamber in the first end region.
8. The system of claim 7 wherein the second end region is constructed and arranged to removably receive a portion of a catheter therein, the stent being loaded on to the catheter by advancing the stent through the chamber.
9. The system of claim 1, wherein at least one seal member comprises a first seal member and a second seal member, the first seal member engaged to a portion of the housing adjacent to the first end opening of the chamber and the second seal member engaged to a portion of the housing adjacent to the second end opening of the chamber.
10. The system of claim 1, wherein the at least one seal member comprises a removable fluid tight seal.
11. The system of claim 1, wherein the at least one seal member comprises a labyrinth.
12. The system of claim 1, wherein the at least one seal member comprises an adjustable valve.
13. The system of claim 1, further comprising a mandrel, in the reduced configuration the mandrel is constructed and arranged to be advanced through the chamber to expel the stent therefrom.
14. The system of claim1 13 wherein the mandrel has a diameter at least as great as that of the second diameter of the stent.
15. The system of claim 13 wherein the mandrel defines a stent mounting region, the stent being disposed about at least a portion of the stent mounting region.
16. The system of claim 15 wherein the mandrel further comprises a first end region and a second end region, the stent mounting region positioned between the first end region of the mandrel and the second end region of the mandrel, at least one of the first end region of the mandrel and the second end region of the mandrel having a diameter at least as great as the second diameter of the stent.
17. The system of claim 16 wherein the first end region of the mandrel is external and immediately adjacent to the first end opening of the chamber and the second end region of the mandrel is external and immediately adjacent to the second end opening of the chamber.
18. The system of claim 17 wherein the first end region of the mandrel is sealingly engaged to the first open end of the chamber.
19. The system of claim 17 wherein the second end region of the mandrel is sealingly engaged to the second open end of the chamber.
20. The system of claim 17 wherein the first end region of the mandrel is sealingly engaged to the first open end of the chamber and the second end region of the mandrel is sealingly engaged to the second open end of the chamber.
21. The system of claim 16 wherein at least a portion of the at least one of the first end region of the mandrel and the second end region of the mandrel are tapered.
22. The system of claim 15 wherein the mandrel defines a fluid injection lumen, a second fluid being injected into the fluid injection lumen.
23. The system of claim 22 wherein the second fluid is a coolant.
24. The system of claim 23 wherein the second fluid is substantially the same as the fluid from the fluid source.
25. The system of claim 22 wherein the at least a portion of the stent mounting region of the mandrel defines at least one perfusion port, the at least one perfusion port in fluid communication with the fluid injection lumen.
26. The system of claim 1 wherein the fluid is selected from a member of the group consisting of air, water, carbon dioxide, nitrous oxide, nitrogen gas and any combination thereof.
27. The system of claim 26 wherein the fluid is cooled to a temperature of about \u221260\xb0 Celsius to about \u221280\xb0 Celsius.
28. The system of claim 1 wherein at least a portion of the stent is coated with at least one therapeutic agent.
29. The system of claim 28 wherein the at least one therapeutic agent is at least one non-genetic therapeutic agent selected from at least one member of the group consisting of: anti-thrombogenic agents such as heparin, heparin derivatives, urokinase, and PPack (dextrophenylalanine proline arginine chloromethylketone); anti-proliferative agents such as enoxaprin, angiopeptin, monoclonal antibodies capable of blocking smooth muscle cell proliferation, hirudin, and acetylsalicylic acid; anti-inflammatory agents such as dexamethasone, prednisolone, corticosterone, budesonide, estrogen, sulfasalazine, and mesalamine; antineoplasticantiproliferativeanti-miotic agents such as paclitaxel, 5-fluorouracil, cisplatin, vinblastine, vincristine, epothilones, endostatin, angiostatin and thymidine kinase inhibitors; anesthetic agents such as lidocaine, bupivacaine and ropivacaine; anti-coagulants such as D-Phe-Pro-Arg chloromethyl keton, an RGD peptide-containing compound, heparin, antithrombin compounds, platelet receptor antagonists, anti-thrombin antibodies, anti-platelet receptor antibodies, aspirin, prostaglandin inhibitors, platelet inhibitors and tick antiplatelet peptides; vascular cell growth promoters such as growth factor inhibitors, growth factor receptor antagonists, transcriptional activators, and translational promoters, vascular cell growth inhibitors such as growth factor inhibitors, growth factor receptor antagonists, transcriptional repressors, translational repressors, replication inhibitors, inhibitory antibodies, antibodies directed against growth factors, bifunctional molecules consisting of a growth factor and a cytotoxin; bifunctional molecules consisting of an antibody and a cytotoxin; cholesterol-lowering agents; vasodilating agents; and agents which interfere with endogenous vascoactive mechanisms, and any combinations thereof.
30. The system of claim 28 wherein the at least one therapeutic agent is at least one genetic therapeutic agent selected from at least one member of the group consisting of: anti-sense DNA and RNA; DNA coding for anti-sense RNA, tRNA or rRNA to replace defective or deficient endogenous molecules; angiogenic factors including growth factors such as acidic and basic fibroblast growth factors, vascular endothelial growth factor, epidermal growth factor, transforming growth factor \u03b1 and \u03b2, platelet-derived endothelial growth factor, platelet-derived growth factor, tumor necrosis factor \u03b1, hepatocyte growth factor and insulin like growth factor; cell cycle inhibitors including CD inhibitors, thymidine kinase (\u201cTK\u201d) and other agents useful for interfering with cell proliferation; at least one of the family of bone morphogenic proteins (\u201cBMP’s\u201d) such as BMP-2, BMP-3, BMP-4, BMP-5, BMP-6 (Vgr-1), BMP-7 (OP-1), BMP-8, BMP-9, BMP-10, BMP-11, BMP-12, BMP-13, BMP-14, BMP-15, and BMP-16, Any of BMP-2, BMP-3, BMP-4, BMP-5, BMP-6 and BMP-7; dimeric proteins such as homodimers, heterodimers, or combinations thereof, alone or together with other molecules; molecules capable of inducing an upstream or downstream effect of a BMP such as \u201chedgehog\u201d proteins, or the DNA’s encoding them and any combinations thereof.
31. The system of claim 28 wherein the at least one therapeutic agent is at least one type of cellular material selected from at least one member of the group consisting of: cells of human origin (autologous or allogeneic); cells of non-human origin (xenogeneic) and any combination thereof.
32. The system of claim 31 wherein the cellular material is selected from at least one member of the group consisting of: side population cells; lineage negative cells; lineage negative CD34\u2212cells; lineage negative CD34+cells; lineage negative cKit+cells; mesenchymal stem cells; cord blood bells; cardiac or other tissue derived stem cells; whole bone marrow; bone marrow mononuclear cells; endothelial progenitor cells; satellite cells; muscle derived cells; go cells; endothelial cells; adult cardiomyocytes; fibroblasts; smooth muscle cells; cultures of mesenchymal stem cells with 5-aza forces differentiation into cardiomyocytes; adult cardiac fibroblasts +5-aza; genetically modified cells; tissue engineered grafts; MyoD scar fibroblasts; Pacing cells; embryonic stem cell clones; embryonic stem cells; fetal or neonatal cells; immunologically masked cells; tissue engineered grafts; genetically modified cells; teratoma derived cells and any combinations thereof.
33. The system of claim 28 wherein the at least one therapeutic agent comprises at least one polymer coating, the at least one coating selected from at least one member of the group consisting of: polycarboxylic acids; cellulosic polymers, including cellulose acetate and cellulose nitrate; gelatin; polyvinylpyrrolidone; cross-linked polyvinylpyrrolidone; polyanhydrides including maleic anhydride polymers; polyamides; polyvinyl alcohols; copolymers of vinyl monomers such as EVA; polyvinyl ethers; polyvinyl aromatics; polyethylene oxides; glycosaminoglycans; polysaccharides; polyesters including polyethylene terephthalate; polyacrylamides; polyethers; polyether sulfone; polycarbonate; polyalkylenes including polypropylene, polyethylene and high molecular weight polyethylene; halogenated polyalkylenes including polytetrafluoroethylene; polyurethanes; polyorthoesters; proteins; polypeptides; silicones; siloxane polymers; polylactic acid; polyglycolic acid; polycaprolactone; polyhydroxybutyrate valerate and blends and copolymers thereof coatings from polymer dispersions such as polyurethane dispersions (BAYHDROL\xae, etc.), fibrin, collagen and derivatives thereof polysaccharides such as celluloses, starches, dextrans, alginates and derivatives; hyaluronic acid; squalene emulsions; polyacrylic acid, a copolymer of polylactic acid and polycaprolactone; medical-grade biodegradable materials such as PGA-TMC, Tyrosine-Derived Polycarbonates and arylates; polycaprolactone co butyl acrylate and other co polymers; Poly-L-lactic acid blends with DL-Lactic Acid; Poly(lactic acid-co-glycolic acid); polycaprolactone co PLA; polycaprolactone co butyl acrylate and other copolymers; Tyrosine-Derived Polycarbonates and arylate; poly amino acid; polyphosphazenes; polyiminocarbonates; polydimethyltrimethylcarbonates; biodegradable CAPO4 ‘s; cyanoacrylate; 5050 DLPLG; polydioxanone; polypropylene fumarate; polydepsipeptides; macromolecules such as chitosan and Hydroxylpropylmethylcellulose; surface erodible material; maleic anhydride copolymers; zinc-calcium phosphate; amorphous polyanhydrides; sugar; carbohydrate; gelatin; biodegradable polymers; and polymers dissolvable in bodily fluids; A block copolymers; B block copolymers and any combinations thereof.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of operating a processing device comprising:
in response to determining mode information indicates a first mode of operation, performing memory accesses at the processing device by translating N-bit address values stored at a first register to corresponding physical addresses associated with a memory device and performing arithmetic operations at the processing device using N-bit values;
in response to determining the mode information indicates a second mode of operation, performing memory accesses at the processing device by translating M-bit address values stored at the first register to corresponding physical addresses associated with the memory device and performing arithmetic operations at the processing device using N-bit values, wherein M is less than N; and
in response to determining the mode information indicates a third mode of operation, performing memory accesses at the processing device by translating M-bit address values stored at the first register to corresponding physical addresses associated with the memory device and performing arithmetic operations at the processing device using M-bit values.
2. The method of claim 1, wherein translating M-bit address values in the third mode of operation comprises translating the M-bit address values of M-bits to address values of Q-bits, where Q is different from M.
3. The method of claim 1, wherein translating M-bit address values in the second mode of operation comprises translating the M-bit address values to address values of Q-bits, where Q is different from M.
4. The method of claim 1, further comprising determining a mode of operation of the processing device based on the mode information.
5. The method of claim 4, wherein the mode information is based on one or more bits of a register.
6. The method of claim 4, wherein
the mode information is based on one or more input pins.
7. The method of claim 1, wherein N is 64 and M is 32.
8. The method of claim 1, wherein N is 128 and M is 64.
9. A device, comprising:
an N-bit storage location;
a memory device;
an arithmetic logic module coupled to the N-bit storage location, the arithmetic logic module configured to:
in a first mode of operation perform arithmetic operations using N-bit values from the N-bit storage location;
in a second mode of operation perform arithmetic operations using N-bit values from the N-bit storage location;
in a third mode of operation perform arithmetic operations using M-bit values from the N-bit storage location, wherein M is less than N;

a memory management module coupled to the N-bit storage location, the memory management module configured to:
in the first mode of operation perform memory accesses by translating N-bit address values from the N-bit storage location to corresponding physical addresses associated with the memory device;
in the second mode of operation perform memory accesses by translating M-bit address values from the N-bit storage location to corresponding physical addresses associated with the memory device;
in the third mode of operation perform memory accesses by translating M-bit address values from the N-bit storage location to corresponding physical addresses associated with the memory device.
10. The device of claim 9, wherein the N-bit storage location is a register file.
11. The device of claim 9, wherein the corresponding physical address values are Q-bit address values in the third mode of operation, where Q is different from M.
12. The device of claim 9, wherein the corresponding physical address values are Q-bit address values in the second mode of operation, where Q is different from M.
13. The device of claim 9, wherein M is equal to N divided by 2P, where P is an integer.
14. The device of claim 9, wherein M is 32 and N is 64.
15. The device of claim 9, wherein M is 64 and N is 128.
16. The device of claim 9, wherein the mode of operation of the arithmetic logic module is based on one or more bit values of a register.
17. The device of claim 9, wherein the mode of operation of the arithmetic logic module is based on an inputoutput pin of the device.
18. The device of claim 9, further comprising a memory coupled to the memory management module.
19. The device of claim 9, further comprising a bus coupled between the N-bit storage location and the memory management module, and wherein in the first mode of operation the N-bit address values are provided via the bus and in the second mode of operation the M-bit address values are provided via the bus.
20. The device of claim 19, wherein in the third mode of operation the M-bit address values are provided via the bus.