1. A leadframe package comprising:
a die pad;
a semiconductor die attached to the die pad;
a plurality of leads disposed along four peripheral edges of the die pad;
a first exposed pad segment disposed between the plurality of leads and the die pad;
a second exposed pad segment being spaced apart from the first exposed pad segment and being disposed between the first exposed pad segment and the die pad, wherein both of the first and second exposed pads are covered with an etching mask;
conductive wires electrically connected to and extending between the semiconductor die and respective ones of the leads, the first exposed pad segment and the second exposed pad segment; and
a molding compound at least partially encapsulating the die pad, the leads, the first exposed pad segment, the second exposed pad segment and the conductive wires, wherein bottom surfaces of the die pad, the first exposed pad segment and the second exposed pad segment are exposed.
2. The leadframe package according to claim 1, wherein the first exposed pad segment embraces and shelters the second exposed pad segment.
3. The leadframe package according to claim 2, wherein the first exposed pad segment is electrically connected to a first signal and the second exposed pad segment is electrically connected to a second signal, wherein the second signal is more sensitive to noise than the first signal.
4. The leadframe package according to claim 3, wherein the first signal has a lower state switch rate than the second signal.
5. The leadframe package according to claim 3, wherein the second signal is one of analog power and analog ground.
6. The leadframe package according to claim 3, wherein the second signal is one of control signals or differential signals.
7. The leadframe package according to claim 1, wherein a surface area of the first exposed pad segment is larger than that of the second exposed pad segment.
8. The leadframe package according to claim 1, wherein the first exposed pad segment extends along one of the four peripheral edges of the die pad and span of the first exposed pad segment depends upon electrical characteristics of bond pads on the semiconductor die.
9. The leadframe package according to claim 1, wherein the first and second exposed pad segments have a surface area that is adequate for wire bonding more than four said conductive wires.
10. A leadframe comprising:
a die pad for mounting a semiconductor die thereon;
a plurality of leads disposed along four peripheral edges of the die pad;
a first pad segment disposed between the plurality of leads and the die pad, wherein the first pad segment juts out from one of the four peripheral edges of the die pad; and
a second pad segment being spaced apart from the first exposed pad segment and being disposed between the first exposed pad segment and the die pad.
11. The leadframe according to claim 10, wherein the four peripheral edges are straight edges and no recess is formed on any one of the four peripheral edges.
12. The leadframe according to claim 10, wherein the first pad segment is used to couple to a first signal and the second pad segment is used to couple to a second signal, wherein the second signal is more sensitive to noise than the first signal.
13. The leadframe according to claim 12, wherein the first signal has a lower state switch rate than the second signal.
14. The leadframe according to claim 12, wherein the second signal is one of analog power and analog ground.
15. The leadframe according to claim 12, wherein the second signal is one of control signals and differential signals.
16. The leadframe according to claim 10, wherein a surface area of the first pad segment is larger than that of the second pad segment.
17. The leadframe according to claim 10, wherein the first pad segment extends along said one of the four peripheral edges of the die pad and span of the first pad segment depends upon electrical characteristics of bond pads on the semiconductor die.
18. The leadframe according to claim 10, wherein the first and second pad segments have a surface area that is adequate for wire bonding more than four conductive wires.
19. The leadframe according to claim 10, wherein the first pad segment embraces and shelters the second pad segment.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A method of projecting an impact of configuration changes on controllers in a computing environment having at least one bridge attached channel, said method comprising:
associating a plurality of pseudo-channels with said at least one bridge attached channel,
selecting a first controller associated with a configuration change,
projecting an impact of the configuration change on said first controller, wherein said projecting includes:
modeling said plurality of pseudo-channels as a plurality of independent channels, and
quantifying the impact.
2. The method of claim 1, wherein said modeling comprises designating a second controller as affected by said configuration change if said first controller and said second controller share a common pseudo-channel.
3. The method of claim 2, wherein said first controller and said second controller comprise logical controllers within a single physical controller.
4. The method of claim 1, wherein said modeling comprises designating a second controller as unaffected by said configuration change if said first controller and said second controller utilize different pseudo-channels associated with the same bridge attached channel.
5. The method of claim 1, wherein said projecting comprises determining a projected IO velocity of said controller, said projected IO velocity quantifying the impact.
6. The method of claim 5, wherein said determining comprises:
projecting utilization of one or more channels of said controller to obtain one or more channel utilizations;
determining one or more contention factors for said controller, said determining employing said one or more channel utilizations; and
obtaining said projected io velocity using at least one contention factor of said one or more contention factors.
7. The method of claim 6, wherein said one or more channels includes at least one pseudo-channel.
8. The method of claim 7, wherein said projecting utilization of one or more channels comprises:
iteratively adjusting projected load on the one or more channels until a projected unassigned load associated with said controller is at a predefined level; and
determining projected utilization of the one or more channels, in response to the iteratively adjusting.
9. A method of projecting an impact of configuration changes on controllers in a computing environment having at least one bridge attached channel, said method comprising:
associating a plurality of pseudo-channels with said at least one bridge attached channel,
determining a utilization metric of said bridge attached channel,
selecting a first controller associated with a configuration change,
projecting an impact of the configuration change on said first controller, wherein said projecting includes:
modeling said plurality of pseudo-channels as a plurality of independent channels if said utilization metric is below a threshold, and
quantifying the impact.
10. The method of claim 9, wherein said utilization metric is channel utilization.
11. The method of claim 10, wherein said threshold is a fixed percent.
12. The method of claim 10, wherein said threshold is pseudo-channel utilization.
13. A system of projecting an impact of configuration changes on controllers in a computing environment having at least one bridge attached channel, said system comprising:
means for associating a plurality of pseudo-channels with said at least one bridge attached channel,
means for selecting a first controller associated with a configuration change,
means for projecting an impact of the configuration change on said first controller, wherein said means for projecting includes:
means for modeling said plurality of pseudo-channels as a plurality of independent channels, and
means for quantifying the impact.
14. The system of claim 13, wherein said means for modeling comprises means for designating a second controller as affected by said configuration change if said first controller and said second controller share a common pseudo-channel.
15. The system of claim 14, wherein said first controller and said second controller comprise logical controllers within a single physical controller.
16. The system of claim 13, wherein said means for modeling comprises means for designating a second controller as unaffected by said configuration change if said first controller and said second controller utilize different pseudo-channels associated with the same bridge attached channel.
17. The system of claim 13, wherein said at least one bridge attached channel is a FICON bridge channel.
18. The system of claim 17, further comprising at least one ESCON channel.
19. The system of claim 17, further comprising at least one dynamic switch.
20. A system of projecting an impact of configuration changes on controllers in a computing environment having at least one bridge attached channel, said system comprising:
means for associating a plurality of pseudo-channels with said at least one bridge attached channel,
means for determining a utilization metric of said bridge attached channel,
means for selecting a first controller associated with a configuration change,
means for projecting an impact of the configuration change on said first controller, wherein said projecting includes:
means for modeling said plurality of pseudo-channels as a plurality of independent channels if said utilization metric is below a threshold, and
means for quantifying the impact.
21. The system of claim 20, wherein said utilization metric is channel utilization.
22. The method of claim 21, wherein said threshold is a fixed percent.
23. The method of claim 21, wherein said threshold is pseudo-channel utilization.
24. At least one program storage device readable by a machine, tangibly embodying at least one program of instructions executable by the machine to perform a method of projecting an impact of configuration changes on controllers in a computing environment having at least one bridge attached channel, said method comprising:
associating a plurality of pseudo-channels with said at least one bridge attached channel,
selecting a first controller associated with a configuration change,
projecting an impact of the configuration change on said first controller, wherein said projecting includes:
modeling said plurality of pseudo-channels as a plurality of independent channels, and
quantifying the impact.
25. The at least one program storage device of claim 24, wherein said modeling comprises designating a second controller as affected by said configuration change if said first controller and said second controller share a common pseudo-channel.
26. The at least one program storage device of claim 25, wherein said first controller and said second controller comprise logical controllers within a single physical controller.
27. The at least one program storage device of claim 24, wherein said modeling comprises designating a second controller as unaffected by said configuration change if said first controller and said second controller utilize different pseudo-channels associated with the same bridge attached channel.
28. At least one program storage device readable by a machine, tangibly embodying at least one program of instructions executable by the machine to perform a method of projecting an impact of configuration changes on controllers in a computing environment having at least one bridge attached channel, said method comprising:
associating a plurality of pseudo-channels with said at least one bridge attached channel,
determining a utilization metric of said bridge attached channel,
selecting a first controller associated with a configuration change,
projecting an impact of the configuration change on said first controller, wherein said projecting includes:
modeling said plurality of pseudo-channels as a plurality of independent channels if said utilization metric is below a threshold, and
quantifying the impact.
29. The at least one program storage device of claim 28, wherein said utilization metric is channel utilization.
30. The at least one program storage device of claim 29, wherein said threshold is a fixed percent.
31. The at least one program storage device of claim 29, wherein said threshold is pseudo-channel utilization.