All The Claims

1. A method of manufacturing a semiconductor laser device comprising:
depositing a first cladding layer over a substrate;
depositing an active region on said first cladding layer;
depositing a second cladding layer on said active region;
removing a portion of each of said first cladding layer, said active region and said second cladding layer to form a mesa region having a top portion and a side portion, such that all of said first cladding layer that extends beyond said active region and said second cladding layer of said mesa region is removed to thereby enhance heat dissipation capability through the substrate;
depositing an insulator layer on the side portion of said mesa region; and
depositing a metal layer to cover the top portion of said mesa region and said insulator layer which is dimensioned and configured to have a thickness at least half a thickness of said mesa region and to laterally spread heat away from said active region.
2. The method of claim 1, wherein the step of removing a portion of each of said first cladding layer, said active region and said second cladding layer comprises an etching process.
3. The method of claim 1, wherein the step of depositing a metal layer comprises:
evaporating a thin metal contact layer over said insulating layer; and
applying a thicker electroplated metal layer upon the thin metal contact layer.
4. The method of claim 3, further including the steps of:
evaporating a metal contact layer onto an underside of the substrate; and
applying a bonding layer to the metal contact layer.
5. The method of claim 4, further including the steps of:
applying a heat sink to the bonding layer; and
attaching wire connectors to the metal contact layer.
6. The method of claim 3, wherein:
the first cladding layer is InAsAlSb;
the second cladding layer is InAsAlSb;
the thin metal contact layer is AuTi; and
the thicker electroplated layer is gold.
7. The method of claim 1, wherein:
the step of depositing an insulator layer includes applying said insulator layer on the top portion of said mesa region.
8. The method of claim 1, wherein the step of removing a portion of each of said first cladding layer, said active region and said second cladding layer transgresses the entire thickness of said first cladding layer, said active region, and said second cladding layer.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A heating mould for thermal nanoimprint lithography comprising:
a substrate having a first principal surface and a second principal surface, and a through-cavity extending from a first orifice in the first principal surface up to a second orifice in the second principal surface, said first principal surface being at least partially covered by a first membrane, and said second orifice being completely closed off by a second electrically and thermally insulating membrane with a first disposed in contact with said second principal surface and at least partially covering said second surface;
a thermally conducting layer that mechanically supports the second membrane on said first side of the second membrane above said second orifice;
an insulating layer disposed beneath said thermally conducting mechanical support layer;
heating means disposed on a second side of said second membrane in a zone of said second membrane above said second orifice;
an electrically and thermally insulating layer which covers said heating means and, at least partially, said second membrane;
imprint patterns disposed on said electrically and thermally insulating layer in a zone of said electrically and thermally insulating layer above said second orifice; and
means for supplying an electric current to said heating means.
2. The mould according to claim 1, in which said first and second principal surfaces are planar and parallel.
3. The mould according to claim 2, in which said first and second principal surfaces are horizontal.
4. The mould according to claim 1, further comprising alignment marks.
5. The mould according to claim 4, in which said alignment marks are located in the second membrane, in said electrically and thermally insulating layer, or on said electrically and thermally insulating layer near the imprint patterns, or a combination thereof.
6. The mould according to claim 1, in which the substrate is made of a material chosen from among a group of materials compatible with microfabrication and nanofabrication processes including silicon, silicon oxide, silicon nitride, germanium, sapphire, GaAs, and composite materials comprising several of these materials.
7. The mould according to claim 1, in which the first and second membranes are made of a material resistant to anisotropic etching of the substrate material.
8. The mould according to claim 1, in which the heating means are made of a material chosen from among platinum, titanium nitride, single-crystal silicon, polycrystalline silicon and all the conductive materials compatible with microfabrication and nanofabrication technologies.
9. The mould according to claim 1, in which the electrically and thermally insulating layer is made of a material chosen from SiO2, Si3N4, Al2O3, HfO2, and all the electrically and thermally insulating materials compatible with microfabrication and nanofabrication technologies.
10. The mould according to claim 1, in which the imprint patterns are made of a material chosen from Si, SiO2, Si3N4, Al2O3, HfO2, and all the materials compatible with microfabrication and nanofabrication technologies.
11. A process for producing a mould according to claim 1, the process comprising the following steps performed in succession:
a. forming a thermally conducting and mechanical support layer in a zone of a first principal surface of a substrate;
b. depositing a first membrane on a second principal surface of the substrate;
c. depositing a second electrically and thermally insulating membrane on said first principal surface;
d. depositing an electrically resistive heating layer on a zone of the second membrane above the thermally conducting and mechanical support layer;
e. shaping the electrically resistive heating layer;
f. depositing an electrically and thermally insulating layer on said shaped, electrically resistive heating layer and onto the second membrane;
g. producing imprint patterns on said electrically and thermally insulating layer;
h. forming at least one lead for supplying electric current to the electrically resistive heating layer; and
i. etching the first membrane, then forming a cavity in the substrate from a first orifice in the second principal surface up to the thermally conducting mechanical support layer, in a zone of the first principal surface.
12. The process according to claim 11, in which the at least one electric current lead is fabricated by etching at least one via through the first membrane, through the second membrane, or through the substrate, or a combination thereof, and by filling the at least one via by electrodeposition.
13. A process for producing a substrate comprising a nanostructured surface by thermal nanoimprint lithography, in which the mould according to claim 1 is employed.
14. The process according to claim 11, further comprising:
forming alignment or positioning marks are produced in the membrane layer, in the insulating layer, or on said electrically and thermally insulating layer near the imprint patterns.
15. The mould according to claim 7, wherein the substrate is made of silicon and the first and second membranes are made from Si3N4.
16. The mould according to claim 1, wherein said first membrane completely closes off said first orifice.
17. The mould according to claim 1, wherein said first membrane completely partially closes off said first orifice.
18. The mould according to claim 1, wherein said first membrane is disposed so as to not cover any portion of said first orifice.

1. A method of forming a ceramic matrix composite component, said method comprising:
applying a first amount of adhesive across a surface of a release film;
providing a first ceramic foam panel including a plurality of channels formed on a first side of the first ceramic foam panel;
contacting the first ceramic foam panel and the release film such that adhesive transfers to the first side of the first ceramic foam panel; and
coupling the first ceramic foam panel to a second ceramic foam panel.
2. The method in accordance with claim 1, wherein applying a first amount of adhesive comprises determining the first amount of adhesive that facilitates limiting excess adhesive from flowing into the plurality of channels.
3. The method in accordance with claim 2, wherein determining the first amount of adhesive comprises measuring a thickness of the first amount of adhesive on the surface of the release film.
4. The method in accordance with claim 1, wherein applying a first amount of adhesive comprises forming a first layer of adhesive having a thickness within a range between about 8 mils and about 10 mils on the surface of the release film.
5. The method in accordance with claim 1, wherein applying a first amount of adhesive comprises applying the first amount of adhesive at a substantially uniform thickness across the surface of the release film.
6. The method in accordance with claim 1, wherein applying a first amount of adhesive comprises extending the first amount of adhesive over the surface of the release film such that the first amount of adhesive extends past free edges of the first ceramic foam panel.
7. The method in accordance with claim 1, wherein coupling the first ceramic foam panel comprises:
applying a second amount of adhesive to a first side of the second ceramic foam panel; and
coupling the first side of the first ceramic foam panel to the first side of the second ceramic foam panel.
8. The method in accordance with claim 7 further comprising determining the first and second amounts of adhesive that facilitates reducing a cross-sectional area of the plurality of channels by less than about 10 percent.
9. The method in accordance with claim 7, wherein applying a second amount of adhesive comprises forming a second layer of adhesive having a thickness within a range between about 8 mils and about 10 mils on the first side of the second ceramic foam panel.
10. The method in accordance with claim 1, wherein coupling the first ceramic foam panel comprises contacting the first and second ceramic foam panels such that excess adhesive flows into the plurality of channels.
11. The method in accordance with claim 10, wherein contacting the first and second ceramic foam panels comprises forming a fillet between a side wall of the plurality of channels and the first side of the second ceramic foam panel with the excess adhesive.
12. The method in accordance with claim 1, wherein coupling the first ceramic foam panel comprises substantially aligning free edges of the first and second ceramic foam panels.
13. The method in accordance with claim 1, wherein contacting the first ceramic foam panel and the release film comprises contacting the first ceramic foam panel and the release film such that adhesive selectively transfers to the first side of the first ceramic foam panel.
14. The method in accordance with claim 1 further comprising forming the release film from a flexible material.
15. A ceramic matrix composite component comprising:
a first ceramic foam panel including a plurality of channels formed on a first side of said first ceramic foam panel;
a first amount of adhesive applied to said first side of said first ceramic foam panel, wherein said first amount of adhesive is transferred to said first side from a surface of a release film; and
a second ceramic foam panel coupled to said first ceramic foam panel with said first amount of adhesive.
16. The component in accordance with claim 15 further comprising a second amount of adhesive applied to a first side of said second ceramic foam panel to be coupled to said first ceramic foam panel.
17. The component in accordance with claim 16 further comprising determining the first and second amounts of adhesive that facilitate reducing a cross-sectional area of the plurality of channels by less than about 10 percent.
18. The component in accordance with claim 15, wherein said first amount of adhesive on the surface of the release film has a thickness within a range between about 8 mils and about 10 mils.
19. The component in accordance with claim 15 further comprising a fillet formed from excess adhesive between a side wall of said plurality of channels and a first side of said second ceramic foam panel.
20. The component in accordance with claim 15, wherein said first amount of adhesive is determined such that excess adhesive flowing into said plurality of channels facilitates reducing a cross-sectional area of said plurality of channels by less than about 10 percent.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A computer-implemented method for inserting an ascending sequence of records into a tree structure having multiple nodes, comprising:
a) receiving, with a processor, a record included in the ascending sequence of records;
b) locating, with the processor, a node of the multiple nodes that includes an insertion point for the record, wherein the located node includes first, second and third sequentially-ordered records, wherein the first, second and third sequentially-ordered records are adjacent records within the located node, and wherein the insertion point lies between the first and second sequentially-ordered records;
c) determining, with the processor, that the located node has insufficient storage space to store the record;
d) based on the determination of insufficient storage space, determining whether dividing the located node at the insertion point will lower a load factor with the processor, wherein the load factor is a metric that measures overall usage of storage space within the tree structure;
e) dividing, in response to determining that dividing the located node at the insertion point will lower the load factor of the tree structure, the located node into two nodes at a point between the second and third sequentially ordered records with the processor;
f) storing, after the division of the located node into the two nodes, the first sequentially-ordered record, the record to be inserted and the second sequentially-ordered record on a first one of the two nodes resulting from the division of the located node with the processor to increase the load factor of the tree structure for ascending sequences of records; and
g) storing the third sequentially-ordered record on a second one of the two nodes resulting from the division.
2. The method of claim 1, wherein determining whether dividing the located node at the insertion point lowers the load factor further comprises:
determining, based on the determination that the insertion point is not located at an edge of the located node, whether dividing the located node at the insertion point will result in non-optimal storage of the sequence,
the method further comprising:
dividing, based on the determination that dividing the located node at the insertion point will result in optimal storage of the sequence, dividing the located node at the insertion point; and
storing the record on either one of the two nodes having sufficient storage space available.
3. The method of claim 2, wherein determining whether dividing the located node at the insertion point will result in non-optimal storage of the sequence includes determining whether, if the record were stored on the same one of the two nodes as other records in the sequence, whether a searchable field of the record would be stored within another one of the multiple nodes included within the tree structure.
4. The method of claim 2,
wherein storing the record comprises:
determining that one of the two nodes stores previously stored records in the sequence;
determining for the one of the two nodes that previously stored records in the sequence whether adequate storage space is available; and
storing, based on the determination that adequate storage space is not available, the record on the other one of the two nodes,
the method further comprising:
identifying the second sequentially-ordered record that is not included in the sequence but that is adjacent to the insertion point; and
storing the second sequentially-ordered record on whichever one of the two nodes stores the record if adequate storage space is available, and if not, storing the second sequentially-ordered record on the other one of the two nodes.
5. The method of claim 1, and further including processing the records of the sequence as the records of the sequence are being inserted into the tree to detect that the sequence is being received.
6. The method of claim 1, and further including obtaining information before receipt of any of the records of the sequence that the sequence will be inserted into the tree.
7. The method of claim 6, wherein obtaining the information includes processing all of the records of the sequence to determine a total size of the sequence.
8. The method of claim 7, wherein receiving the record in the sequence includes receiving all of the records in the sequence, and
the method further includes:
storing all of the records in the sequence on the located node if sufficient storage space is available on the located node, and if not, dividing the located node to form at least two nodes; and
storing all of the records in the sequence on a same one of the at least two nodes if sufficient storage space is available on the same one of the at least two nodes, and if not, storing one or more of the records in the sequence on the same one of the at least two nodes with the second sequentially-ordered record.
9. A system for managing a tree structure that stores data records, comprising:
a storage device for storing multiple pages included in the tree structure; and
a processor coupled to the storage device to:
receive a data record included within an ascending sequence of data records;
locate a page of the multiple pages that includes an insertion point at which to store the data record based on a searchable field in the data record, wherein the located page includes first, second and third sequentially-ordered data records, wherein the first, second and third sequentially-ordered data records are adjacent data records within the page, and wherein the insertion point lies between the first and second sequentially-ordered data records;
determine whether the located page includes insufficient storage space to store the data record;
based on the determination of insufficient storage space, determine whether dividing the located page at the insertion point will lower a load factor of the tree structure, wherein the load factor is a metric that measures overall usage of storage space within the tree structure;
divide, in response to the determination that dividing the located page at the insertion point will lower the load factor of the tree structure, the located page into two pages at a point between the second and third sequentially-ordered data records;
store, after the division of the located page into the two pages, the first sequentially-ordered data record, the data record to be inserted and the second sequentially-ordered data record to a same one of the two pages to increase the load factor of the tree structure for ascending sequences of records; and
store the third sequentially-ordered record on a second one of the two pages resulting from the division.
10. The system of claim 9 wherein the processor executes software means for dividing the located page so that the data record is stored on a same one of the at least two pages with any other previously received data records in the sequence if storage space is available, and if not, for storing the data record on another one of the at least two pages.
11. The system of claim 10, wherein the software means further includes means for determining whether, if the page storing the data record has adequate storage space available, any subsequently received data records in the sequence would still be prevented from being stored on the page storing the data record, and if so, for storing the second sequentially-ordered data record on the page storing the data record if storage space permits.
12. The system of claim 9, wherein the processor executes software means for obtaining information indicative of the sequence prior to the time data records in the sequence are obtained for storage in the tree structure.
13. The system of claim 12, wherein the information includes size information indicative of total size of the sequence, and wherein the software means includes:
means for determining, based on the size information, whether all data records in the sequence can be stored at the insertion point without dividing the located page, and if so, for storing all data records in the sequence on the located page, and if not, for dividing the located page into at least two pages at the insertion point;
means for storing all data records in the sequence on one of the at least two pages if storage space is available, and if not, for storing all data records in the sequence on multiple ones of the at least two pages; and
means for storing the second sequentially-ordered data record on the same one of the at least two pages as the last-received data record.
14. The system of claim 12, wherein the tree structure represents a database table, and wherein the software means is included within a database management system.
15. A system for managing records of a database table that is represented by a tree structure having multiple nodes, comprising:
a storage device for storing multiple nodes included in the tree structure;
a processor coupled to the storage device;
means for receiving a record that is part of an ascending sequence of data records;
means for locating a node of the multiple nodes of the tree structure that includes an insertion point for the record at which to store the record based on a searchable field in the record, wherein the first, second and third sequentially-ordered data records are adjacent data records within the page and wherein the insertion point lies between the first and second sequentially-ordered records;
means for determining whether the located node includes insufficient storage space to store the data record;
means for determining based on the determination of insufficient storage space whether dividing the located node at the insertion point will lower a load factor of the tree structure, wherein the load factor is a metric that measures overall usage of storage space within the tree structure;
means for dividing, in response to the determination that dividing the located node at the insertion point will lower the load factor of the tree structure, the located node into two nodes at a point between the second and third sequentially-ordered records;
means for storing, after the division of the located node into the two pages, the first sequentially-ordered record, the record to be inserted and the second sequentially-ordered record to a same one of the two pages to increase the load factor of the tree structure for ascending sequences of records; and
means for storing the third sequentially-ordered record on a second one of the two pages resulting from the division.
16. The system of claim 15, including means for dividing the located node so that the received record is maintained on a same one of the resulting nodes as any other stored records in the sequence if storage space is available, and if not, for storing the received record on a different one of the resulting nodes as compared to the node storing other records in the sequence;
means for identifying the second sequentially-ordered record; and
means for determining whether, assuming storage space is available, it is possible to store a subsequently received record in the sequence on the same node as the received record, and it not, for storing the second sequentially-ordered record on the same node as the received record if available storage space permits.
17. The system of claim 16, and wherein the determining means of claim 16 includes means for determining whether the received record, if stored on a same one of the nodes as other stored records in the sequence, will be identified by identifying data stored within a different node of the tree structure.
18. The system of claim 15, wherein the tree structure is selected from a group consisting of a B-tree and a B+-tree.
19. The system of claim 15, and further including means for determining whether a sequence of records is being received.
20. The system of claim 19, further including:
means for determining the size of the sequence before any record in the sequence is inserted into the tree structure;
means for determining whether the located node must be divided to store all records in the sequence, and if a node division is necessary, for dividing the node and storing all records in the sequence on a node resulting from the division if storage space is available, and otherwise for storing the records in the sequence on at least two nodes; and
means for storing the second sequentially-ordered record on the same node with all records in the sequence if storage space is available, and otherwise for storing the second sequentially-ordered record on whichever one of the at least two node stores the last received record in the sequence.
21. The system of claim 15, further including means for interpreting a composite key having a range segment and a varying segment to determine that a the ascending sequence of records is being received.
22. The system of claim 21, further including means for programmably selecting the range segment and the varying segment.
23. A computer-readable storage medium comprising instructions that cause a processor to insert an ascending sequence of records into a tree structure having multiple nodes, wherein the instruction further cause the processor to:
a) receive a record included in the ascending sequence of records;
b) locate a node of the multiple nodes that includes an insertion point for the record, wherein the located node includes first, second, and third sequentially-ordered records, and wherein the first, second and third sequentially-ordered records are adjacent within the located node, and wherein the insertion point lies between the first and second sequentially-ordered records;
c) determine that the located node has insufficient storage space to store the record to be inserted;
d) based on the determination of insufficient storage space, determine whether dividing the located node at the insertion point will lower a load factor of the tree structure, wherein the load factor is a metric that measures overall usage of storage space within the tree structure;
e) in response to determining that dividing the located node at the insertion point will increase the load factor of the tree structure, divide the located node into two nodes at a point between the second and third sequentially ordered records
f) store, after the division of the located node into two nodes, the first sequentially-ordered record, the record to be inserted and the second sequentially-ordered record on a first one of the two nodes resulting from the division of the located node to increase the load factor of the tree structure for ascending sequences of records; and
g) store the third sequentially-ordered record on a second one of the two nodes resulting from the division.