All The Claims

1. An electronics assembly comprising:
a semiconductor die assembly, comprising:
a semiconductor die encapsulated in a molded material;
one or more conductive pillars on a top surface of the semiconductor die;
an encapsulation layer located over the top surface of the semiconductor die and surrounding the conductive pillars; and
at least one patterned metal layer and at least one dielectric layer over the encapsulation layer;

an enclosure affixed to the semiconductor die assembly, the enclosure defining first and second chambers over the semiconductor die assembly and including a wall between the first and second chambers;
first and second optical elements mounted in the first and second chambers, respectively, and electrically connected to the semiconductor die; and
wherein the encapsulation layer blocks optical crosstalk between the first and second chambers.
2. An electronics assembly as defined in claim 1, wherein the molded material and the encapsulation layer are formed of the same material.
3. An electronics assembly as defined in claim 1, wherein the molded material and the encapsulation layer are formed of different materials.
4. An electronics assembly as defined in claim 1, wherein the conductive pillars have a pillar height above the top surface of the semiconductor die and wherein the encapsulation layer has a thickness equal to the pillar height.
5. An electronics assembly as defined in claim 1, wherein the first and second optical elements are electrically connected to the semiconductor die by the conductive pillars.
6. An electronics assembly as defined in claim 1, wherein the first optical element comprises a light source and the second optical element comprises a light sensor.
7. An electronics assembly as defined in claim 6, wherein the semiconductor die comprises an image sensor processor.
8. An electronics assembly as defined in claim 1, wherein the enclosure includes a first lens positioned over the first optical element and a second lens positioned over the second optical element.
9. An electronics assembly as defined in claim 1, wherein a first portion of the semiconductor die is located under the first chamber and a second portion of the semiconductor die is located under the second chamber.
10. An electronics assembly as defined in claim 1, wherein the semiconductor die assembly further includes conductive vias through the molded material for electrically connecting front and rear surfaces of the molded material.
11. An electronics assembly as defined in claim 1, wherein the wall between the first and second chambers extends into an opening in the dielectric layer.
12. An electronics assembly as defined in claim 1, wherein the encapsulation layer is formed of a material that blocks light in an operating wavelength range of the electronics assembly.
13. An electronics assembly as defined in claim 1, wherein the enclosure is affixed to the semiconductor die assembly by an opaque adhesive that extends over an outer edge of the dielectric layer.
14. The electronics assembly as defined in claim 1, wherein the semiconductor die comprises a transparent passivation layer and the encapsulation layer blocks light from reaching the transparent passivation layer.
15. A semiconductor die assembly comprising:
a semiconductor die having a transparent passivation layer and being encapsulated in a molded material;
one or more conductive pillars on a top surface of the semiconductor die;
an encapsulation layer located on the top surface of the semiconductor die and surrounding the conductive pillars;
at least one patterned metal layer and at least one dielectric layer over the encapsulation layer; and
wherein the encapsulation layer blocks light from reaching the transparent passivation layer.
16. A semiconductor die assembly as defined in claim 15, wherein the conductive pillars have a pillar height above the top surface of the semiconductor die and wherein the encapsulation layer has a thickness equal to the pillar height.
17. A semiconductor die assembly as defined in claim 15, further comprising conductive vias through the molded material for electrically connecting front and rear surfaces of the molded material.
18. A semiconductor die assembly as defined in claim 15, wherein the encapsulation layer is formed of a material that blocks light in an operating wavelength range of the semiconductor die assembly.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An electrical connector, comprising:
a base having a plurality of passageways;
a cover having a plurality of through holes corresponding to the passageways, the cover mounted to the base and slidably moveable relative to the base;
a cam mounted between the base and the cover, and rotatable to drive the cover to move relative to the base; and
a protecting mechanism comprising a cover plate mounted in the cover and a base element mounted in the base, the cover plate comprising a planar main portion, a via hole defined in a middle thereof, and a pair of stoppers bent toward the cover to engage with the cam and restrict the cam to rotate within a certain angle.
2. The electrical connector as claimed in claim 1, wherein the cover plate is made of metallic material by stamping, and the via hole is formed by drawing.
3. The electrical connector as claimed in claim 2, wherein the via hole has a shirting margin with a smooth inner surface extending from an edge of the via hole and passing into a cover hole of the cover.
4. The electrical connector as claimed in claim 3, wherein the stoppers are disposed at opposite sides of the main portion, a pair of stiffener portions extend from the main portion and parallel to the stoppers, respectively.
5. The electrical connector as claimed in claim 4, wherein each stiffener portion bends at a same direction of the stopper firstly and then extends parallel to the main portion.
6. The electrical connector as claimed in claim 1, wherein the cover has a head portion protruding from one end of the cover, and includes a first concave formed at the middle of a bottom surface of the head portion, a second concave formed on a top surface of the head portion corresponding to the first concave, and a cover hole passing through the first and the second concaves.
7. The electrical connector as claimed in claim 6, wherein the second concave is formed with two semicircles having different diameters, there are two vertical sidewalls on the two semicircles intersectant place.
8. The electrical connector as claimed in claim 7, wherein the first concave has accommodating recesses for receiving the stoppers, and the accommodating recesses are communicated with the second concave by through the vertical sidewalls to partially expose the stoppers to the second concave.
9. The electrical connector as claimed in claim 8, wherein the first concave has a corresponding shape with the cover plate and receives with the cover plate by tight fitting.
10. An electrical connector, comprising:
a base having a plurality of passageways;
a cover having a plurality of through holes corresponding to the passageways, the cover mounted to the base and slidably moveable relative to base;
a cam mounted between the base and the cover, and rotateable to drive the cover to move relative to the base; and
a protecting mechanism comprising a cover plate mounted in the cover and a base element mounted in the base, the cover plate being formed by stamping, the cover plate comprising a planar main portion, a via hole defined in a middle thereof and formed by drawing, and a pair of stoppers bent toward the cover for engaging with the cam.
11. The electrical connector as claimed in claim 10, wherein the cover plate and the cover are assembled together by tight fitting.
12. The electrical connector as claimed in claim 11, wherein the cover plate further comprises a pair of stiffener portions to enhance an engaging force between the cover plate and the cover.
13. The electrical connector as claimed in claim 12, wherein the via hole has a shirting margin extending into a cover hole of the cover for receiving the cam.
14. The electrical connector as claimed in claim 10, wherein the cam includes a protrusion thereof, the protrusion is stopped by the stoppers at 180 degree to limit the distance of the cover moving relative to the base.
15. An electrical connector comprising:
an insulative base defining a plurality of passageways and a through hole in a head portion thereof;
a plurality of contacts disposed in the corresponding passageways, respectively;
an insulative cover mounted upon the slidable relative to the base, said cover defining a plurality of through passages in vertical alignment with the corresponding passageways, respectively, and a through aperture in thereof a head section in vertical alignment with the corresponding through hole of the base;
a cam extending axially and vertically in both said through hole and said through aperture; and
a protecting mechanism including a metallic cover plate mounted to an undersurface of the cover and defining another through hole via a drawing process to form a tubular section extending upwardly into the through aperture and engaged with the cam for operation; wherein
said tubular section is sandwiched between the cam and the cover diametrically.
16. The electrical connector as claimed in claim 15, wherein said cover plate is further equipped with a pair of upwardly extending stoppers to fasten the cover plate to the cover.
17. The electrical connector as claimed in claim 15, wherein said cover plate is further equipped with a pair of horizontally extending stiffeners to upwardly abut against the cover.

1. An implantable sensor assembly, comprising:
a first sensor having a first surface and a second surface facing different directions, the first surface having an electric circuit and the second surface having at least one electrode;
a second sensor having a first surface and a second surface facing different directions, the first surface having an electric circuit and the second surface having at least one electrode, the first surface of the second sensor being aligned with and directly opposing the first surface of the first sensor such that the second surfaces of the first and second sensors face out from the sensor assembly.
2. The implantable sensor assembly recited in claim 1, wherein the electrodes convert a sensed parameter to a detectable signal.
3. The sensor assembly recited in claim 2, wherein the electric circuits comprises circuits for processing the detectable signal.
4. The implantable sensor assembly recited in claim 1, wherein current flowing through the electrodes electrochemically reacts with at least one substance in proximity to exposed surface areas of the electrodes.
5. The implantable sensor assembly recited in claim 4, wherein the at least one substance is oxygen.
6. The sensor assembly recited in claim 1, wherein the electrodes apply an electrical pulse to a substance in contact with the electrodes.
7. The sensor assembly recited in claim 6, wherein the substance is living tissue.
8. The sensor assembly recited in claim 1, wherein the electric circuit of the first sensor is connected to the at least one electrode of the first sensor through the first sensor, and the electric circuit of the second sensor is connect to the at least one electrode of the second sensor through the second sensor.
9. The sensor assembly recited in claim 1, further comprising an outer casing enclosing the first and second sensors, the outer casing having at least one window pocket formed therein in proximity to an exposed surface area of the second surface of the first sensor.
10. A sensor assembly, comprising:
a first substrate sensor having a first surface and a second surface facing different directions, the second surface having at least one electrode for converting a sensed parameter to a detectable signal, and the first surface having an electric circuit for processing said detectable signal;
a second substrate sensor having a first surface and a second surface facing different directions, the second surface having at least one electrode for converting a sensed parameter to a detectable signal, and the first surface having an electric circuit for processing said detectable signal; and,
at least a portion of the first surface of the second substrate sensor being directly opposed to at least a portion of the first surface of the first substrate sensor such that the second surfaces of the first and second substrate sensors face out from the sensor assembly in substantially opposite directions.
11. The sensor assembly recited in claim 10, wherein current flowing through the electrodes electrochemically reacts with at least one substance in proximity to the electrodes.
12. The sensor assembly recited in claim 11, wherein the at least one substance is oxygen.
13. The sensor assembly recited in claim 10, wherein the first substrate sensor is fixed stationary relative to the second substrate sensor.
14. The sensor assembly recited in claim 10, further comprising an outer casing enclosing the first and second substrate sensors, the outer casing having at least one window pocket formed therein in proximity to an exposed surface area of the electrode surface of the first substrate sensor.
15. A sensor assembly, comprising:
a first substrate sensor having an electrode surface and a circuit surface facing in different directions, said circuit surface comprising an electric circuit on a semiconductor substrate;
a second substrate sensor having an electrode surface and a circuit surface facing in different directions, said circuit surface comprising an electric circuit on a semiconductor substrate; and,
at least a portion of the circuit surface of the second substrate sensor facing at least a portion of the circuit surface of the first substrate sensor such that the electrode surfaces of the first and second substrate sensors face out from the sensor assembly in substantially opposite directions.
16. The sensor assembly recited in claim 15, wherein the electrode surfaces include electrodes for converting a sensed parameter to a detectable signal.
17. The sensor assembly recited in claim 15, wherein current flowing through the electrodes electrochemically reacts with at least one substance in proximity to the electrodes.
18. The sensor assembly recited in claim 17, wherein the at least one substance is oxygen.
19. The sensor assembly recited in claim 15, wherein the electrodes apply an electrical pulse to a substance in contact with the electrodes.
20. The sensor assembly recited in claim 19, wherein the substance is living tissue.
21. The sensor assembly recited in claim 15, further including an outer casing enclosing the first and second substrate sensors, the outer casing having at least one window pocket formed therein in proximity to an exposed surface area of the electrode surface of the first substrate sensor.
22. The sensor assembly recited in claim 21, further including at least one additional window pocket formed in the outer casing in proximity to an exposed surface area of the electrode surface of the second substrate sensor.
23. The sensor assembly of claim 21, wherein the outer casing is a membrane.
24. An implantable sensor lead comprising:
a proximal end connected to a controller;
a distal end; and
at least one sensor assembly within the sensor lead controlled by the controller, the at least one sensor assembly including:
a first substrate sensor having a first surface and a second surface facing different directions, the first surface having an electric circuit and the second surface having at least one electrode;
a second substrate sensor having a first surface and a second surface facing different directions, the first surface having an electric circuit and the second surface having at least one electrode; and,
at least a portion of the first surface of the second substrate sensor being opposed to at least a portion of the first surface of the first substrate sensor such that the second surfaces of the first and second substrate sensors face out from the sensor assembly in substantially opposite directions.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A method for transmitting a data frame, comprising:
detecting whether or not a collision of a plurality of received data frames occurs;
determining a priority of thedata frames colliding with each other;
calculating a backoff time according to the priority; and
transmitting the data frames colliding with each other, the data frames being transmitted based on the calculated backoff time.
2. The method of claim 1, wherein calculating the backoff time includes calculating the backoff time based on at least one priority of the data frame and a number of collisions of the data frame.
3. The method of claim 2, wherein the backoff time is given by an expression:
Backoff timer512 (bit number),
wherein r is determined by the number of collisions and the priority of the data frame.
4. The method of claim 3, wherein
r is a priority number of the data frame, the priority number increasing as the priority decreases, if the number of collisions of the data frame is 1.
5. The method of claim 4, wherein thecolliding data frames each have a different priority number.
6. The method of claim 3, wherein r has a random value, if the number of collisions of the data frame equals 2.
7. The method of claim 6, wherein the data frames colliding with each other have the same priority number.
8. The method of claim 7, wherein r is greater than or equal to 0, and less than or equal to 4.
9. The method of claim 3, wherein, if the number of collisions of the data frame is equal to or exceeds 3,
r is in a range from 0 to 2k,
k is equal to 3 if the priority number of the data frame is less than or equal to 3,
k equals the priority number of the data frame if the priority number of the data frame is greater than or equal to 4 and less than or equal to 9,
k equals 10 if the priority number of the data frame is greater than 9, and
a priority number of 1 represents a highest priority of the data frame, the priority number increasing as the priority of the data frame decreases.
10. An apparatus for transmitting a data frame, comprising:
means for detecting whether or not a collision of a plurality of received data frames has occurred;
means for determining a priority of the data frames colliding with each other;
means for calculating backoff time according to the priority for each data frame; and
means for transmitting the colliding data frames based on the calculated backoff time.
11. The apparatus of claim 10, wherein the means for calculating a backoff time calculates the backoff time based on at least one priority of the data frame and a number of collisions of the data frame.
12. The apparatus of claim 11, wherein the backoff time is given by an expression:
Backoff timer512(bit number),
wherein r is determined based on the number of collisions and the priority of the data frame.
13. The apparatus of claim 12, wherein r is a priority number of the data frame and the priority number increases as the priority of the data frame decreases, if the number of collisions is 1.
14. The apparatus of claim 12, wherein r has a random value if the number of collisions equals 2.
15. The apparatus of claim 14, wherein r is greater than or equal to 0, and is less than or equal to 4.
16. The apparatus of claim 12, wherein, if the number of collisions of the data frame is equal to or exceeds 3,
r is in a range from 0 to 2k,
k is equal to 3 if the priority number of the data frame is less than or equal to 3,
k equals the priority number of the data frame if the priority number of the data frame is greater than or equal to 4 and less than or equal to 9,
k equals 10 if the priority number of the data frame is greater than 9, and
a priority number of 1 represents a highest priority of the data frame,
the priority number increasing as the priority of the data frame decreases.
17. A method for transmitting data frames, comprising:
calculating for each of a plurality of colliding data frames, a backoff time that is based on a relative priority of a given data frame as compared to the other colliding data frames; and
transmitting each of the colliding data frames based on the calculated backoff time.
18. An apparatus for transmitting data frames, comprising:
at least one controller for calculating, for each of a plurality of colliding data frames, a backoff time that that is based on a relative priority of a given data frame as compared to the other colliding data frames; and
at least one port for transmitting each of the colliding data frames based on the calculated backoff time.
19. A computer program product comprising a computer-readable medium having computer program logic stored thereon for enabling a processor to transmit one or more data frames, the computer program logic causing the processor to perform the functions of:
detecting whether or not a collision of a plurality of received data frames occurs;
determining a priority for data frames colliding with each other;
calculating a backoff time according to the priority; and
transmitting the data frames colliding with each other, the data frames being transmitted based on the calculated backoff time.
20. A computer program product comprising a computer-readable medium having computer program logic stored thereon for enabling a processor to transmit one or more data frames, the computer program logic causing the processor to perform the functions of:
calculating, for each of a plurality of colliding data frames, a backoff time that is based on a relative priority of a given data frame as compared to the other colliding data frames; and
transmitting each of the colliding data frames based on the calculated backoff time.
21. A program, adapted to cause a computer to execute the method of claim 1.
22. A program, adapted to cause a computer to execute the method of claim 17.
23. A computer-readable storage medium, on which is recorded a program adapted to cause a computer to execute the method of claim 1.
24. A computer-readable storage medium, on which is recorded a program adapted to cause a computer to execute the method of claim 17.
25. A computer data signal embodied in a carrier wave, the computer data signal comprising
a first code segment for detecting whether or not a collision of a plurality of received data frames occurrs;
a second code segment for determining a priority for data frames colliding with each other;
a third code segment for calculating a backoff time according to the priority; and
a fourth code segment for transmitting the data frames colliding with each other to a receiving entity, the data frames being transmitted based on the calculated backoff time.
26. A computer data signal embodied in a carrier wave, comprising
instructions for calculating, for each of a plurality of colliding data frames, a backoff time that is based on a relative priority of a given data frame as compared to the other colliding data frames; and
instructions for transmitting each of the colliding data frames to a receiving entity based on the calculated backoff time.
27. An apparatus for transmitting data frames in accordance with the method of claim 1.
28. An apparatus for transmitting data frames in accordance with the method of claim 17.