1. A method for registering user identification data in an application service provider data repository within a computer memory device, wherein the application service provider provides web services for a plurality of customers, each customer having a plurality of users with respective user identification data, said method comprising:
receiving user identification data from one of the users through a website hosted on a server, the website associated with one of the plurality of customers;
retrieving customer identification data based on a uniform resource locator associated with the website;
concatenating the user identification data and customer identification data to create a user key; and
registering a user account for storage within the data repository based on the created user key.
2. A method according to claim 1 wherein retrieving customer identification data comprises identifying the customer based on the uniform resource locator.
3. A method according to claim 1 further comprising presenting a user registration page relevant to the customer associated with the uniform resource locator, for entry of user identification data.
4. A method according to claim 1 wherein concatenating the user identification data and customer identification data comprises one of:
appending the customer identification data to the user identification data; and
prepending the customer identification data to the user identification data.
5. A method according to claim 1 wherein registering a user account comprises determining if the created user key exists in the data repository.
6. A method according to claim 5 further comprising, upon determining that the created user key exists in the data repository:
informing the user that the user identification data has previously been registered; and
requesting entry of new user identification data.
7. A network-based system for registering users for one or more of a plurality of customers utilizing user information, said system operable to provide application services to the plurality of customers, said system comprising:
a client system comprising a browser;
a database for storing user account data and customer identification data, said database within one or more computer memory devices; and
a server system configured to be coupled to said client system and said database, said server system further configured to:
receive user identification data from said client system, the user identification data entered at said client system by a user through an interface associated with one of the plurality of customers;
retrieve customer identification data based on the interface accessed by the user with said client system;
concatenate the user identification data and customer identification data to create a user key; and
register a user account within said database based on the created user key.
8. A network-based system according to claim 7 wherein to retrieve customer identification data from said database, said server system is configured to identify the customer based on a uniform resource locator entered at said client system.
9. A network-based system according to claim 7 wherein said server system is configured to cause said client system to display a user registration page relevant to the customer associated a uniform resource locator entered at said client system, for entry of user identification data.
10. A network-based system according to claim 7 wherein to concatenate the user identification data and customer identification data, said server system is configured to either:
append the customer identification data to the user identification data; and
prepend the customer identification data to the user identification data.
11. A network-based system according to claim 7 wherein to register a user account, said server system is configured to determine if the created user key exists in said database.
12. A network-based system according to claim 11 wherein upon a determination that the created user key exists in said database, said server system is configured to send a message for display at said client system indicating that the user identification data has previously been registered and requesting entry of new user identification data.
13. A computer program embodied on a non-transitory computer readable medium for registering users for multiple customers for whom application services are provided such that the registered users for all the customers are capable of being stored in a single data repository while still retaining payment card industry (PCI) compliance, said program comprising at least one code segment that:
identifies the customer with which the user is attempting to register based on a uniform resource locator utilized by the user;
receives the user identification data entered into an interface by the user;
concatenates the user identification data and customer identification data based on the identified customer; and
registers a user account in the data repository based on the concatenation of the user identification data and customer identification data.
14. A computer program in accordance with claim 13 further comprising at least one code segment that causes a client system to display a user registration page relevant to the customer associated a uniform resource locator entered at the client system, for entry of user identification data.
15. A computer program according to claim 13 wherein to register a user account, said computer program further comprises at least one code segment that:
determines if the concatenation of the user identification data and customer identification data has been previously registered as a user account; and
causes a message to be sent to the user if the concatenation of the user identification data and customer identification data has been previously registered as a user account.
16. A computer program in accordance with claim 15 further comprising at least one code segment that causes a client system to display a user registration page requesting entry of new user identification data if the concatenation of the user identification data and customer identification data has been previously registered as a user account.
17. A method for registering users within a repository within a computer memory device and associated with an application service provider, the application service provider providing website hosting services to a plurality of customers, the users engaging in financial transaction card related transactions through the customer websites, said method comprising:
identifying the customer with which the user is attempting to register based on a web page accessed by the user and hosted on a server system;
receiving a potential user identifier as entered by the user;
retrieving a customer identifier for the identified customer;
combining the potential user identifier and customer identifier into user data; and
storing the user data in the data repository if the user data is not within the data repository.
18. A method for registering users according to claim 17 wherein identifying the customer comprises utilizing a uniform resource locator entered by the user to identify the customer.
19. A method for registering users according to claim 17 further comprising notifying the user to provide a second potential user identifier if the combined potential user identifier and customer identifier is stored within the data repository.
20. A method for registering users according to claim 17 wherein combining the potential user identifier and customer identifier into user data comprises one of:
appending the potential user identifier to the customer identifier; and
appending the customer identifier to the potential user identifier.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A chip package comprising:
a first chip having a first active surface, an opposing first back surface and a plurality of first bonding pads disposed on the first active surface;
a plurality of first bumps jointed onto the first bonding pads; and
a die-attaching tape attached to the first active surface of the first chip, the die-attaching tape consisting of a first dielectric adhesive, a second dielectric adhesive and a wiring core sandwiched between the first dielectric adhesive and the second dielectric adhesive, wherein the wiring core is of a thickness of a dielectric material and includes a plurality of conductive traces separated by the dielectric material, wherein the conductive traces are also of the thickness of the dielectric material;
wherein the first dielectric adhesive is adhered to the first active surface with the first bumps penetrating through the first dielectric adhesive and jointing to the corresponding conductive traces.
2. The chip package as claimed in claim 1, wherein the conductive traces are parallel straight lines and the orientation of the conductive traces is perpendicular to the orientation of the first bonding pads.
3. The chip package as claimed in claim 1, wherein the first bumps are stud bumps formed by wire-bonding processes with extruded wire tips to be embedded into the conductive traces.
4. The chip package as claimed in claim 1, further comprising an encapsulant encapsulating the first chip and the die-attaching tape.
5. The chip package as claimed in claim 1, further comprising a substrate and a plurality of substrate bumps disposed on a plurality of bonding fingers on the substrate, wherein the first chip are disposed on the substrate and the die-attaching tape is extended from the first chip and is further attached to the substrate to make the first dielectric adhesive adhere to the substrate with the substrate bumps penetrating through the first dielectric adhesive and jointing to the corresponding conductive traces.
6. The chip package as claimed in claim 5, further comprising:
a second chip having a second active surface, an opposing second back surface and a plurality of second bonding pads disposed on the second active surface; and
a plurality of second bumps jointed onto the second bonding pads;
wherein the first chip and the second chip are face-to-face stacked together so that the second dielectric adhesive is adhered to the second active surface with the second bumps penetrating through the second dielectric adhesive and jointing to the corresponding conductive traces.
7. The chip package as claimed in claim 5, further comprising:
a second chip having a second active surface, an opposing second back surface and a plurality of second bonding pads disposed on the second active surface; and
a plurality of second bumps jointed onto the second bonding pads;
wherein the first chip and the second chip are stair-like stacked together so that two sides of the die-attaching tape are extended over the first active surface of the first chip to make the first dielectric adhesive adhere to the second active surface with the second bumps penetrating through the first dielectric adhesive and jointing to the corresponding conductive traces.
8. The chip package as claimed in claim 1, wherein the die-attaching tape does not extend over the first active surface of the first chip.
9. The chip package as claimed in claim 8, further comprising:
a substrate having a plurality of bonding fingers;
a second chip having a second active surface, an opposing second back surface and a plurality of second bonding pads disposed on the second active surface, wherein the second back surface of the second chip is attached onto the substrate; and
a plurality of bonding wires connecting the second bonding pads to the bonding fingers with a plurality of ball bonds of the bonding wires jointed onto the second bonding pads;
wherein the first chip and the second chip are face-to-face stacked together so that the second dielectric adhesive adheres to the second active surface with the ball bonds of the bonding wires penetrating through the second dielectric adhesive and jointing to the corresponding conductive traces.
10. The chip package as claimed in claim 9, wherein the bonding wires are copper wires.
11. The chip package as claimed in claim 1, wherein the pitch of the first bonding pads is equal to the pitch of the conductive traces.
12. The chip package as claimed in claim 1, wherein the pitch of the first bonding pads is integral multiples of the pitch of the conductive traces so that at least half of the conductive traces are not connected with the first bonding pads.
13. The chip package as claimed in claim 1, wherein the first dielectric adhesive and the second dielectric adhesive are resins with the characteristic of multiple curing stages.
14. The chip package as claimed in claim 13, wherein the Tg of the first dielectric adhesive is greater than the Tg of the second dielectric adhesive.