All The Claims

1. An insulated gate bipolar transistor (IGBT) comprising:
a gallium nitride (GaN) substrate with an upper surface;
a first GaN layer with a first conductive type, which is formed on the upper surface, wherein the first GaN layer has a side wall vertical to the upper surface;
a second GaN layer with a first conductive type, which is formed on the upper surface;
a third GaN layer with a second conductive type or an intrinsic conductive type, which is formed on the first GaN layer, wherein the third GaN layer and the GaN substrate are separated by the first GaN layer; and
a gate, which is formed on the GaN substrate, and has a side plate, which is directly or indirectly connected to the side wall in a lateral direction, for controlling a channel;
wherein the second GaN layer is separated from the first GaN layer by the gate.
2. The IGBT of claim 1, further comprising an aluminum gallium nitride (AlGaN) barrier layer, which is formed on the upper surface, and overlays the side wall, wherein the gate is separated from the GaN substrate and the first GaN layer by the AlGaN barrier layer.
3. The IGBT of claim 1, wherein the GaN substrate, the first GaN layer, the third GaN layer, and the gate form a junction field effect transistor (JFET), and the first GaN layer, the second GaN layer, and the GaN substrate form a bipolar junction transistor (BJT), wherein the JFET and the BJT are connected in parallel.
4. The IGBT of claim 2, wherein the GaN substrate, the first GaN layer, the third GaN layer, the AlGaN barrier layer, and the gate form a metal oxide semiconductor field effect transistor (MOSFET), and the first GaN layer, the second GaN layer, and the GaN substrate form a bipolar junction transistor (BJT), wherein the MOSFET and the BJT are connected in parallel.
5. A manufacturing method of an insulated gate bipolar transistor (IGBT) comprising:
providing a gallium nitride (GaN) substrate with an upper surface;
forming a first GaN layer with a first conductive type on the upper surface, wherein the first GaN layer has a side wall vertical to the upper surface;
forming a second GaN layer with a first conductive type on the upper surface;
forming a third GaN layer with a second conductive type or an intrinsic conductive type on the first GaN layer, wherein the third GaN layer and the GaN substrate are separated by the first GaN layer; and
forming a gate on the GaN substrate, which has a side plate, which is directly or indirectly connected to the side wall in a lateral direction, for controlling a channel;
wherein the second GaN layer is separated from the first GaN layer by the gate.
6. The manufacturing method of claim 5 further comprising: forming an aluminum gallium nitride (AlGaN) barrier layer on the upper surface, which overlays the side wall, wherein the gate is separated from the GaN substrate and the first GaN layer by the AlGaN barrier layer.
7. The manufacturing method of claim 5, wherein the GaN substrate, the first GaN layer, the third GaN layer, and the gate form a junction field effect transistor (JFET), and the first GaN layer, the second GaN layer, and the GaN substrate form a bipolar junction transistor (BJT), wherein the JFET and the BJT are connected in parallel.
8. The manufacturing method of claim 6, wherein the GaN substrate, the first GaN layer, the third GaN layer, the AlGaN barrier layer, and the gate form a metal oxide semiconductor field effect transistor (MOSFET), and the first GaN layer, the second GaN layer, and the GaN substrate form a bipolar junction transistor (BJT), wherein the MOSFET and the BJT are connected in parallel.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A dry etching method for forming a trench on a silicon substrate by plasma processing silicon of the silicon substrate by way of introducing a process gas into an airtight processing chamber, the method comprising:
a first process of conducting a plasma processing by introducing a mixture gas at least including HBr and N2 as the process gas to thereby round a boundary between a mask and an upper portion of a sidewall of the trench;
a second process of conducting a plasma processing to form the trench in the silicon of the silicon substrate; and
a third process of conducting a plasma processing by introducing a mixture gas including at least HBr and Cl2 as the process gas to thereby round a bottom portion of the trench.
2. The method of claim 1, wherein the first process is conducted under a condition where a pressure within the processing chamber is at most not greater than 6.7 Pa (50 mTorr); a ratio of a flow rate of HBr to a flow rate of N2 among the process gas is equal to or greater than 3; and a bias high frequency power applied to an electrode provided in the processing chamber to generate plasma is 100 W or larger.
3. The method of claim 1, wherein the third process is conducted under a condition where a pressure within the processing chamber is at least 20 Pa (150 mTorr) or greater; a ratio of a flow rate of HBr to a flow rate of Cl2 among the process gas is equal to or greater than 2; and a bias high frequency power applied to an electrode provided in the processing chamber to generate plasma is 50 W or larger.
4. The method of claim 1, wherein a time period during which the plasma processing is conducted in the first process is shorter than a time period during which the plasma processing is conducted in the second process.
5. The method of claim 4, wherein a ratio of the time period during which the plasma processing is conducted in the second process to the time period during which the plasma processing is conducted in the first process is 1 to 0.15\u02dc0.5.
6. The method of claim 1, wherein a time period during which the plasma processing is conducted in the third process is shorter than a time period during which the plasma processing is conducted in the second process.
7. The method of claim 6, wherein if a ratio of the time period during which the plasma processing is conducted in the second process to the time period during which the plasma processing is conducted in the third process is 1 to 0.3\u02dc0.7.

1. A method comprising:
(a) receiving, at one or more computers from a requestor device, a request for one or more educational institution matches;
(b) obtaining, at the one or more computers via an interface, user information associated with a user of the requestor device, the user information comprising
(1) user identification data including information identifying the user;
(2) demographic data including information identifying demographic data related to the user;
(3) location data including information indicating one or more addresses associated with the user;
(4) education data including information indicating educational background of the user;
(5) education preference data including information indicating educational preferences for the user; and
(6) contact data including information indicating contact information for the user;

(c) accessing, by the one or more computers, one or more electronic databases stored on one or more non-transitory computer-readable storage media and operatively connected to the one or more computers, the one or more databases comprising information for a plurality of educational institutions, including for the respective institutions:
(1) user educational identification data including information identifying the user;
(2) education location data including information identifying one or more locations associated with the respective educational institution;
(3) education program data including information related to education programs associated with the respective educational institution;
(4) education requirements data including information indicating admission requirements and admission preferences for respective educational institution;
(5) representative data including information indicating representatives for the respective educational institution; and
(6) appointment data including information indicating scheduled and available times;

(d) determining, by the one or more computers, based at least in part on the obtained user information, one or more educational institutions as matches;
(e) providing, by the one or more computers, the one or more education institution matches as selectable options to the requestor device via the interface;
(f) transmitting, by the one or more computers to one or more computers associated with each of the matched educational institutions, a notification to each of the educational institution matches, the notification including a message indicating that the educational institution matches a prospect;
(g) obtaining, at the one or more computers from the requestor device via the interface, a selection of an educational institution;
(h) providing, by the one or more computers to the requestor device, an option to schedule an appointment with a third party representative that is not affiliated with the selected educational institution;
(i) receiving, at the one or more computers from the requestor device, a request to schedule an appointment with the third party representative;
(j) determining, by the one or more computers, one or more available appointment times for the selected educational institution;
(k) transmitting, by the one or more computers, a request to select one or more appointment times for the selected educational institution;
(l) upon the condition that an appointment time is selected, transmitting, by the one or more computers to one or more computers associated with the selected educational institution, a confirmation-seeking message requesting confirmation of the selected appointment time with a designated representative of the selected educational institution;
(m) obtaining, at the one or more computers, a message indicating confirmation of the appointment time by selected educational institution with a designated representative;
(n) transmitting, by the one or more computers, a confirmation message to the requestor device confirming the date, time, location;
(o) transmitting, by the one or more computers to the requestor device via the interface, directions to the selected educational institution; and
(p) transmitting, by the one or more computers, a request to a third party service to cause a map illustrating the directions to be displayed on the interface on the requestor device.
2. The method of claim 1, further comprising:
(q) transmitting, by the one or more computers to the requestor device, a reminder notification regarding the confirmed appointment.
3. The method of claim 1, wherein the obtained user’s education data comprises at least one of a high school, college, or postgraduate school attendance dates.
4. The method of claim 1, the education data further comprises one or more degrees completed by the user to the extent they exist.
5. The method of claim 3, the education data further comprises the user’s grade point average in at least one of high school, college, or postgraduate school.
6. The method of claim 1, wherein at least one of the provided matches is sponsored match.
7. The method of claim 1, wherein the third party representative is an educational advisor.
8. The method of claim 1, further comprising the steps of:
(r) upon the condition that an appointment time is not selected, receiving, at the one or more computers from the requestor device, a request to contact a representative of the selected educational institution;
(s) determining, at the one or more computers, the representative of the selected educational institution;
(t) connecting, by the one or more computers, the determined representative with the requestor device.
9. A system comprising:
one or more data processing apparatus; and
a non-transitory computer-readable medium coupled to the one or more data processing apparatus having instructions stored thereon which, when executed by the one or more data processing apparatus, cause the one or more data processing apparatus to perform a method comprising:
(a) receiving, from a requestor device, a request for one or more educational institution matches;
(b) obtaining, via an interface, user information associated with a user of the requestor device, the user information comprising
(1) user identification data including information identifying the user;
(2) demographic data including information identifying demographic data related to the user;
(3) location data including information indicating one or more addresses associated with the user;
(4) education data including information indicating educational background of the user;
(5) education preference data including information indicating educational preferences for the user; and
(6) contact data including information indicating contact information for the user;

(c) accessing one or more electronic databases stored on the one or more non-transitory computer-readable storage media, the one or more databases comprising information for a plurality of educational institutions, including for the respective institutions:
(1) user educational identification data including information identifying the user;
(2) education location data including information identifying one or more locations associated with the respective educational institution;
(3) education program data including information related to education programs associated with the respective educational institution;
(4) education requirements data including information indicating admission requirements and admission preferences for respective educational institution;
(5) representative data including information indicating representatives for the respective educational institution; and
(6) appointment data including information indicating scheduled and available times;

(d) determining, based at least in part on the obtained user information, one or more educational institutions as matches;
(e) providing the one or more education institution matches as selectable options to the requestor device via the interface;
(f) transmitting to one or more computers associated with each of the matched educational institutions, a notification to each of the educational institution matches, the notification including a message indicating that the educational institution matches a prospect;
(g) obtaining, from the requestor device via the interface, a selection of an educational institution;
(h) determining one or more available appointment times for the selected educational institution;
(i) obtaining a selection of one or more appointment times for the selected educational institution;
(j) transmitting, to one or more computers associated with the selected educational institution, a confirmation-seeking message requesting confirmation of the selected appointment time with a designated representative of the selected educational institution;
(k) obtaining a message indicating confirmation of the appointment time by selected educational institution with a designated representative;
(l) transmitting a confirmation message to the requestor device confirming the date, time, location;
(m) transmitting, to the requestor device via the interface, directions to the selected educational institution; and
(n) transmitting a request to a third party service to cause a map illustrating the directions to be displayed on the interface on the requestor device.
10. The system of claim 9, further comprising:
(o) transmitting, by the one or more computer’s to the requestor device, a reminder notification regarding the confirmed appointment.
11. The system of claim 9, wherein the obtained user’s education data comprises at least one of a high school, college, or postgraduate school attendance dates.
12. The system of claim 9, wherein the education data further comprises one or more degrees completed by the user to the extent they exist.
13. The system of claim 11, wherein the education data further comprises the user’s grade point average in at least one of high school, college, or postgraduate school.
14. The system of claim 9, wherein at least one of the provided matches is a sponsored match.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An electrical connector assembly comprising:
a housing comprising a body fabricated at least partially from a dielectric material, the housing body having an opening therein; and
an electrical contact held by the housing, the electrical contact comprising an intermediate portion and a spring portion each held at least partially within the opening, the spring portion of the electrical contact being engaged by the housing body such that the spring portion is deflected into shorting engagement with the intermediate portion of the electrical contact.
2. The electrical connector assembly according to claim 1, wherein the housing body comprises a shoulder, the opening communicating with the shoulder, the spring portion of the electrical contact engaging the shoulder such that the spring portion is deflected into shorting engagement with the intermediate portion of the electrical contact.
3. The electrical connector assembly according to claim 1, wherein the housing body comprises a shoulder, the opening communicating with the shoulder, the spring portion of electrical contact comprising an extension that engages the shoulder such that the spring portion is deflected into shorting engagement with the intermediate portion of the electrical contact.
4. The electrical connector assembly according to claim 1, wherein the housing body comprises a pair of opposite shoulders, the opening communicating with the opposite pair of shoulder, the spring portion of the electrical contact comprising a pair of opposite extensions that each engage a corresponding one of the opposite pair of shoulders such that the spring portion is deflected into shorting engagement with the intermediate portion of the electrical contact.
5. The electrical connector assembly according to claim 1, wherein the intermediate portion of the electrical contact extends between mating and mounting contact portions of the electrical contact, the mating contact portion being configured to electrically connect to a first electrical component and the mounting contact portion being configured to electrically connect to a second electrical component.
6. The electrical connector assembly according to claim 1, wherein the electrical contact includes mating and mounting contact portions of the electrical contact, the mating contact portion being configured to electrically connect to a first electrical component and the mounting contact portion being configured to electrically connect to a second electrical component, the spring portion of the electrical contact comprising the mating contact portion.
7. The electrical connector assembly according to claim 1, wherein the spring portion of the electrical contact comprises an end portion of the electrical contact.
8. The electrical connector assembly according to claim 1, wherein the electrical contact includes a mounting contact portion configured to electrically connect to an electrical component using at least one of a press-fit arrangement, a surface mount arrangement, and a solder tail arrangement.
9. The electrical connector assembly according to claim 1, wherein the intermediate portion of the electrical contact comprises an extension that engages the housing body to facilitate at least one of preventing and reducing movement of the intermediate portion when the spring portion is deflected into shorting engagement with the intermediate portion.
10. The electrical connector assembly according to claim 1, wherein the intermediate portion of the electrical contact comprises a pair of opposite extensions that engage the housing body to facilitate at least one of preventing and reducing movement of the intermediate portion when the spring portion is deflected into shorting engagement with the intermediate portion.
11. A socket connector assembly for connecting a module card to a circuit board, said socket connector comprising:
a housing having a body extending along a longitudinal axis between opposite ends, the housing body including a mounting face configured for mounting on the circuit board and a slot configured to receive a mating edge of the module card, the housing body having a plurality of openings therein; and
a plurality of electrical contacts held by the housing, each electrical contact comprising an intermediate portion and a spring portion each held at least partially within the corresponding opening, the spring portion of each of the electrical contacts being engaged by the housing body such that the spring portion is deflected into shorting engagement with the intermediate portion of the same electrical contact.
12. The socket connector assembly according to claim 11, wherein the housing body comprises a plurality of shoulders, each opening communicating with at least one corresponding shoulder, the spring portion of each of the electrical contacts engaging at least one corresponding shoulder such that the spring portion is deflected into shorting engagement with the intermediate portion of the same electrical contact.
13. The socket connector assembly according to claim 11, wherein the housing body comprises a plurality of shoulders, each opening communicating with at least one corresponding shoulder, the spring portion of each of the electrical contacts comprising an extension that engages at least one corresponding shoulder such that the spring portion is deflected into shorting engagement with the intermediate portion of the same electrical contact.
14. The socket connector assembly according to claim 11, wherein the housing body comprises a plurality of shoulders, each opening communicating with a corresponding opposite pair of the shoulders, the spring portion of each of the electrical contacts comprising a pair of opposite extensions that each engage a corresponding one of the corresponding opposite pair of shoulders such that the spring portion is deflected into shorting engagement with the intermediate portion of the same electrical contact.
15. The socket connector assembly according to claim 11, wherein the intermediate portion of each electrical contact extends between mating and mounting contact portions of the electrical contact, the mating contact portion being configured to electrically connect to the module card and the mounting contact portion being configured to electrically connect to the circuit board.
16. The socket connector assembly according to claim 11, wherein each electrical contact includes mating and mounting contact portions of the electrical contact, the mating contact portion being configured to electrically connect to the module card and the mounting contact portion being configured to electrically connect to the circuit board, the spring portion of each electrical contact comprising the mating contact portion of the electrical contact.
17. The socket connector assembly according to claim 11, wherein the spring portion of each electrical contact comprises an end portion of the electrical contact.
18. The socket connector assembly according to claim 11, wherein each electrical contact includes a mounting contact portion configured to electrically connect to the circuit board using at least one of a press-fit arrangement, a surface mount arrangement, and a solder tail arrangement.
19. The socket connector assembly according to claim 11, wherein the intermediate portion of each electrical contact comprises an extension that engages the housing body to facilitate at least one of preventing and reducing movement of the intermediate portion when the spring portion is deflected into shorting engagement with the intermediate portion.
20. A socket connector assembly for connecting a module card to a circuit board, said socket connector comprising:
a housing extending along a longitudinal axis between opposite ends, the housing including a mounting face configured for mounting on the circuit board and a slot configured to receive a mating edge of the module card, the housing having an opening therein; and
an electrical contact held by the housing, the electrical contact comprising an intermediate portion and a spring portion each held at least partially within the opening, the housing deflecting the spring portion of the electrical contact from a non-shorting position to a shorting position wherein the spring portion of the electrical contact is in shorting engagement with the intermediate portion of the electrical contact, the spring portion of the electrical contact being in shorting engagement with the intermediate portion of the electrical contact before the mating edge of the module card is inserted within the slot.