All The Claims

1. A planar lightwave circuit having an element secured thereon, the planar lightwave circuit comprising:
a substrate;
a trench cut in said substrate;
at least one metal pad deposited on a top surface above said substrate, said at least one metal pad exhibiting a top surface removed from said substrate top surface;
at least one of a waveguide defined in a layer deposited above said substrate and below said at least one metal pad and an optical fiber, said top surface of said at least one metal pad being parallel with a longitudinal axis of said at least one of a waveguide and an optical fiber; and
an optical element placed within said trench and in optical communication with said at least one of a waveguide and an optical fiber,
said optical element comprising at least one metal contact configured to be adjacent to said metal pad, said metal contact being connected to said metal pad by at least one of a solder ball and a conductive adhesive deposited on the metal pad top surface at a point where said top surface lies parallel with said longitudinal axis of said at least one of a waveguide and an optical fiber,
wherein said at least one of a solder ball and a conductive adhesive deposited on the metal pad top surface supplies physical support to said optical element and electrical connection between said metal pad and said metal contact.
2. A planar lightwave circuit according to claim 1, wherein said optical element comprises an active optical area on a facet of said optical element substantially perpendicular to said top surface, said optical communication being between said active optical area and said at least one of a waveguide and an optical fiber.
3. A planar lightwave circuit according to claim 1, wherein said optical element is a photodiode.
4. A planar lightwave circuit according to claim 1, wherein said optical element is one of a vertical cavity surface emitting laser and a vertical external cavity surface emitting laser.
5. A planar lightwave circuit according to claim 4, further comprising a lens, said lens being placed between said optical element and said at least one of a waveguide and an optical fiber.
6. A planar lightwave circuit according to claim 5, wherein said lens is a ball lens.
7. A planar lightwave circuit according to claim 1, further comprising a lens, said lens being placed between said optical element and said at least one of a waveguide and an optical fiber.
8. A planar lightwave circuit according to claim 7, wherein said lens is a ball lens.
9. A planar lightwave circuit according to claim 1, wherein said metal pad is connected to said metal contact by said deposited one of a solder ball and a conductive adhesive deposited on the metal pad top surface over a gap.
10. A planar lightwave circuit according to claim 1, wherein said conductive adhesive is silver epoxy.
11. A planar lightwave circuit according to claim 1, wherein said at least one metal pad comprises two metal pads, and wherein said at least one metal contact comprises two metal contacts configured on said optical element to be adjacent said two metal pads, each of said two metal pads being connected to a respective one of said two metal contacts.
12. A planar lightwave circuit according to claim 1, wherein said metal pad is separated from said metal contact by a gap.
13. A planar lightwave circuit according to claim 12, wherein said gap is filled with optical adhesive, said optical adhesive supporting said at least one of a solder ball and a conductive adhesive.
14. An optical element for use in a planar lightwave circuit having a substrate, the optical element comprising:
a first facet having an optical aperture, said first facet exhibiting an end configured and dimensioned to placed at the bottom of a trench formed in a planar lightwave circuit; and
a plurality of contacts positioned to extend above a top surface of matching pads deposited on, and parallel to, a top surface of the planar lightwave circuit, said top surface of the matching pads opposing a bottom surface of the matching pads, the bottom surface being formed on the top surface of the planar lightwave circuit, said plurality of contacts being positioned removed from said end of said first facet.
15. An optical element according to claim 14, wherein at least one of said plurality of contacts is placed on said first facet.
16. An optical element according to claim 14, wherein said contacts are dimensioned to further extend below said top surface.
17. An optical element according to claim 14, further comprising a facet opposing said first facet, wherein at least one of said plurality of contacts is placed on said facet opposing said first facet.
18. An optical element according to claim 14, wherein said optical element is one of a photodiode, a vertical cavity surface emitting laser and a vertical external cavity surface emitting laser.
19. A method of manufacturing a planar lightwave circuit, comprising:
defining a waveguide;
defining a top surface above said waveguide;
depositing at least one metal pad on said top surface, said at least one metal pad exhibiting a top surface removed from said defined top surface above said waveguide and parallel to a longitudinal axis of said defined waveguide;
providing an optical element having at least one metal contact configured to extend above said top surface of said deposited metal pad;
cutting a trench;
defining a facet of said waveguide;
inserting said provided optical element within said cut trench; and
connecting said at least one metal contact to said top surface of said at least one deposited metal pad at a point where said top surface lies parallel with said longitudinal axis of said waveguide.
20. A method of manufacturing a planar lightwave circuit according to claim 19, wherein said provided optical element comprises an active optical area, said stage of inserting being accomplished with said active optical area being substantially perpendicular to said waveguide.
21. A method of manufacturing a planar lightwave circuit according to claim 19, wherein said provided optical element is one of a photodiode, a vertical cavity surface emitting laser and a vertical external cavity surface emitting laser.
22. A method of manufacturing a planar lightwave circuit according to claim 19, wherein said connecting comprises placing a solder ball and heating said placed solder ball.
23. A method of manufacturing a planar lightwave circuit according to claim 19, wherein said connecting comprises placing conductive adhesive.
24. A method of manufacturing a planar lightwave circuit according to claim 19, wherein said connecting further comprises filling a gap between said metal contacts and said top surface of said at least one deposited metal pad with optical adhesive.
25. A method of manufacturing a planar lightwave circuit according to claim 24, wherein said connecting comprises placing conductive adhesive on top of said optical adhesive, said optical adhesive supporting said conductive adhesive.
26. A method of manufacturing a planar lightwave circuit according to claim 19, wherein said connecting provides physical support to said optical element and electrical connection between said top surface of said deposited at least one metal pad and said metal contact.
27. A method of manufacturing a planar lightwave circuit, comprising:
providing a substrate;
defining a v-groove in a first portion of said substrate;
defining a top surface deposited on a second portion of said substrate;
depositing at least one metal pad on said top surface, said at least one metal pad exhibiting a top surface parallel to, and removed from, said defined top surface on said second portion of said substrate;
providing an optical element having at least one metal contact configured to be adjacent to, and extend above, said top surface of said deposited metal pad;
cutting a trench;
placing an optical fiber in said v-groove;
inserting said provided optical element within said cut trench; and
connecting said at least one metal contact to said top surface of said at least one deposited metal pad at a point where said top surface of said at least one metal pad lies parallel with a longitudinal axis of said placed optical fiber.
28. A method of manufacturing a planar lightwave circuit according to claim 27, wherein said provided optical element comprises an active optical area, said inserting being accomplished with said active optical area being substantially perpendicular to placed optical fiber.
29. A method of manufacturing a planar lightwave circuit according to claim 27, wherein said provided optical element is one of a photodiode, a vertical cavity surface emitting laser and a vertical external cavity surface emitting laser.
30. A method of manufacturing a planar lightwave circuit according to claim 27, wherein said connecting comprises placing a solder ball and heating said placed solder ball.
31. A method of manufacturing a planar lightwave circuit according to claim 27, wherein said connecting comprises placing conductive adhesive.
32. A method of manufacturing a planar lightwave circuit according to claim 27, wherein said connecting further comprises filling a gap between said metal contacts and said top surface of said deposited at least one metal pad with optical adhesive.
33. A method of manufacturing a planar lightwave circuit according to claim 32, wherein said connecting comprises placing conductive adhesive on top of said optical adhesive, said optical adhesive supporting said conductive adhesive.
34. A method of manufacturing a planar lightwave circuit according to claim 27, wherein said connecting provides physical support to said optical element and electrical connection between said top surface of said deposited metal pad and said metal contact.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An adhesive agent comprising a base and an activator,
wherein the base comprises at least any one of:
a first epoxy compound of bisphenol F epoxy compound;
a second epoxy compound in which bisphenol F epoxy compound is mixed with an epoxy compound having three or more epoxy groups; and
a third epoxy compound in which bisphenol A epoxy compound is mixed with an epoxy compound having three or more epoxy groups,

wherein the activator comprises:
polyamide composed of a condensation reaction product of C36 unsaturated fatty acid dimer and polyamine, and
alicyclic polyamine,
the activator containing 5 to 200 parts by mass of the alicyclic polyamine with respect to 100 parts by mass of the polyamide, and

wherein the base is mixed with the activator with a ratio of 10 to 200 parts by mass of the activator with respect to 100 parts by mass of the base.
2. The adhesive agent of claim 1, wherein the activator contains 10 to 150 parts by mass of the alicyclic polyamine with respect to 100 parts by mass of the polyamide.
3. The adhesive agent of claim 1, wherein the activator contains 20 to 100 parts by mass of the alicyclic polyamine with respect to 100 parts by mass of the polyamide.
4. The adhesive agent of claim 1, further comprising fine particles having mean particle size of 0.1 \u03bcm or less.
5-9. (canceled)
10. The inkjet head of claim 5, wherein the ink contains 3 mass % or more of solvent having 9.5 to 15.0 of a SP value and 2.0 to 5.0 of a dipole moment to whole solvent weight.
11. A manufacturing method of an inkjet head, the inkjet head comprising a channel substrate with a channel of ink, an adherend member adhered to the channel substrate, and a second adherend member further adhered to the adherend member, comprising the steps of:
applying an adhesive agent comprising a base and an activator at least one of between the channel substrate and the adherend member, and between the adherend member and the second adherend member, and
curing the adhesive agent by applying heat of 60\xb0 C. or less to the adhesive agent, so that the channel substrate is adhered with the adherend member, or the adherend member is adhered with the second adherend member,
wherein the base comprises at least any one of:
a first epoxy compound of bisphenol F epoxy compound;
a second epoxy compound in which bisphenol F epoxy compound is mixed with an epoxy compound having three or more epoxy groups; and
a third epoxy compound in which bisphenol A epoxy compound is mixed with an epoxy compound having three or more epoxy groups,

wherein the activator comprises:
polyamide containing a condensation reaction product of C36 unsaturated fatty acid dimer and polyamine, and
alicyclic polyamine,
the activator containing 5 to 200 parts by mass of the alicyclic polyamine with respect to 100 parts by mass of the polyamide, and

wherein the base is mixed with the activator with a ratio of 10 to 200 parts by mass of the activator with respect to 100 parts by mass of the base.
12. The method of claim 11, wherein the base comprises the second epoxy compound.
13. The method of claim 11, wherein the activator contains 10 to 150 parts by mass of the alicyclic polyamine with respect to 100 parts by mass of the polyamide.
14. The method of claim 11, wherein the activator contains 20 to 100 parts by mass of the alicyclic polyamine with respect to 100 parts by mass of the polyamide.
15. The method of claim 11, wherein the adhesive agent further comprises fine particles having mean particle size of 0.1 \u03bcm or less.
16. The method of claim 11, wherein the adhesive agent is cured by applying heat of 40\xb0 C. or less to the adhesive agent.

1. A sense amplifier comprising:
a negative capacitance circuit connected between a pair of data lines communicating differential input signals;
a current bias circuit that provides a bias current to the negative capacitance circuit;
a voltage bias circuit that provide a bias voltage to the pair of data lines; and
a comparator that receives differential output signals corresponding to the differential input signals as loaded by the negative capacitance circuit and generates a corresponding data output signal.
2. The sense amplifier of claim 1, wherein the comparator is a differential-to-single-ended amplifier.
3. The sense amplifier of claim 1, wherein at least one of a capacitance of the negative capacitance circuit and a level of the bias current is determined by at least one externally provided control codes.
4. The sense amplifier of claim 3, wherein the negative capacitance circuit comprises:
a capacitor bank including a plurality of capacitances selectively switched inout of the capacitor bank in response to one of the at least one externally provided control codes; and
a pair of cross-connected transistors connected between the capacitor bank and the pair of data lines.
5. The sense amplifier of claim 3, wherein the current bias circuit comprises:
a current source that generates a reference current determined in accordance with one of the at least one externally provided control codes; and
a current mirror that provides the bias current by mirroring the reference current.
6. The sense amplifier of claim 3, wherein the at least one externally provided control codes comprises a first control code and a second control code,
the negative capacitance circuit comprises; a capacitor bank including a plurality of capacitances selectively switched inout of the capacitor bank in response to the first control code, and a pair of cross-connected transistors connected between the capacitor bank and the pair of data lines, and
the current bias circuit comprises; a current source that generates a reference current determined in accordance with the second control code, and a current mirror that provides the bias current by mirroring the reference current.
7. An image sensor comprising:
a pixel providing a pixel signal;
an analog-to-digital conversion (ADC) circuit that converts the pixel signal to differential input signals; and
a pair of data lines communicating the differential input signals;
a sense amplifier that senses and amplifies a voltage difference between the differential input signals, wherein the sense amplifier comprises;
a negative capacitance circuit connected between the pair of data lines;
a current bias circuit that provides a bias current to the negative capacitance circuit;
a voltage bias circuit that provide a bias voltage to the pair of data lines; and
a comparator that receives differential output signals corresponding to the differential input signals as loaded by the negative capacitance circuit and generates a corresponding data output signal.
8. The image sensor of claim 7, further comprising:
a timing controller that provides a first control code setting a capacitance of the negative capacitance circuit and a second control code setting a level of the bias current.
9. The image sensor of claim 7, further comprising:
a replica sense amplifier connected between the pair of data lines to match an impedance of the sense amplifier as connected between the pair of data lines.
10. The image sensor of claim 9, wherein the replica sense amplifier comprises:
a negative capacitance circuit having substantially the same configuration as the negative capacitance circuit in the sense amplifier;
a current bias circuit having substantially the same configuration as the current bias circuit in the sense amplifier; and
a voltage bias circuit having substantially the same configuration as the voltage bias circuit in the sense amplifier.
11. The image sensor of claim 10, wherein the replica sense amplifier is connected between the pair of data lines at one end of the pair of data lines and the sense amplifier is connected between the pair of data lines at another end of the pair of data lines opposite the replica sense amplifier.
12. The image sensor of claim 10, further comprising:
a timing controller that provides a first control code setting a capacitance of the negative capacitance circuit and a second control code setting a level of the bias current.
13. An image processing apparatus comprising:
a lens;
an image sensor configured to convert an optical signal received via the lens into corresponding electrical image data; and
a processor that controls operation of the image sensor,
wherein the image sensor comprises:
a pixel that provides a pixel signal;
an analog-to-digital (ADC) conversion circuit that converts the pixel signal into differential input signals; and
a sense amplifier that senses and amplifies a voltage difference between the differential input signals as communicated to the sense amplifier by a pair of data lines, wherein the sense amplifier comprises;
a negative capacitance circuit connected between the pair of data lines;
a current bias circuit that provides a bias current to the negative capacitance circuit;
a voltage bias circuit that provides a bias voltage to the pair of data lines; and
a comparator that receives differential output signals corresponding to the differential input signals as loaded by the negative capacitance circuit and generates a corresponding data output signal.
14. The image processing apparatus of claim 13, wherein the sense amplifier further comprises; a timing controller that provides a first control code setting a capacitance of the negative capacitance circuit and a second control code setting a level of the bias current.
15. The image processing apparatus of claim 14, wherein the sense amplifier further comprises; a replica sense amplifier connected between the pair of data lines to match an impedance of the sense amplifier as connected between the pair of data lines.
16. The image processing apparatus of claim 15, wherein the replica sense amplifier is connected between the pair of data lines at one end of the pair of data lines and the sense amplifier is connected between the pair of data lines at another end of the pair of data lines opposite the replica sense amplifier.
17. The image processing apparatus of claim 13, wherein the image processing apparatus is a digital single-lens reflex (DSLR) camera.
18. A method of operating a sense amplifier, the method comprising:
receiving differential input signals via a pair of data lines in a negative capacitance circuit;
amplifying a voltage difference between differential output signals corresponding to the differential input signals as loaded by the negative

capacitance circuit using a differential-to-single-ended amplifier to generate a corresponding data output signal;
providing a bias voltage to the pair of data lines using a voltage bias circuit;
providing a bias current to the negative capacitance circuit using a current bias circuit;
defining a capacitance of the negative capacitance circuit in accordance a first control code provided to the sense amplifier; and
defining a level of the bias current is accordance with a second control code provided to the sense amplifier.
19. The method of claim 18, wherein the differential input signals are defined during a predetermined time period by a single data bit stored in a single bit Static Random Access Memory (SRAM).

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A container assembly comprising an open-ended container and a closure system therefor including:
(i) flexible membrane closing the open end of the container;
(ii) a seal between the flexible membrane and the container; and
(iii) a rigid closure mounted on the container having a resiliently deformable member juxtaposed to the flexible membrane, the resiliently deformable member pressing the flexible membrane against the container in the vicinity of the seal, thereby reinforcing the seal sufficiently to withstand pressures generated on heating of the contents of the container.
2. A container assembly according to claim 1 wherein the container and the rigid closure include a respective cam and follower, relative movement between the cam and follower in a predetermined direction causing the rigid closure and the container to approach one another, thereby increasing the pressure exerted by the resiliently deformable member on the flexible membrane.
3. A container assembly according to claim 2 wherein the cam and follower include co-operating screw threads formed respectively on the container and the rigid closure.
4. A container assembly according to any preceding claim wherein the container includes a neck having an annular flange defining the said seal, the resilient member being substantially congruent with the flange whereby the resilient member presses the flexible membrane against the flange.
5. A container assembly according to claim 2 or any claim dependent therefrom, wherein the rigid closure includes a laminar member and an annular skirt depending downwardly therefrom, the cam or the follower being provided on an inner wall of the skirt.
6. A container assembly according to claim 5 wherein the laminar member is a circular disc, the skirt depending from the outer periphery thereof.
7. A container assembly according to claim 5 or claim 6 wherein the laminar member is spaced from the flexible membrane by a distance less than the maximum possible extension of the flexible member towards the laminar member.
8. A container assembly according to any preceding claim wherein the resiliently deformable member comprises a foamed material secured to the rigid closure.
9. A container according to any preceding claim wherein the flexible membrane comprises a metal foil or a plastic film with a functional barrier layer adhesively secured on the container neck.
10. A container assembly according to any of claims 4 to 9 wherein the container neck is generally cylindrical.
11. A container assembly according to any preceding claim including a lifting tab hingeably secured to the flexible membrane by the same material as that of the flexible membrane.
12. A container assembly according to any preceding claim in which the container is a metal, plastic or composite can.
13. A container assembly according to claim 12 wherein the rigid cap supports of the body of the can in a radial direction.
14. A method of forming a container assembly according to claim 2, comprising the steps of:
(i) securing a flexible membrane on the open end of the container by use of adhesives or heat-sealing, thereby forming a seal;
(ii) engaging the cam and follower of a rigid closure and the container with one another; and
(iii) moving the rigid closure and the container relative to one another to cause relative movement between the cam and follower in the predetermined direction, thereby causing the resiliently deformable member to press the flexible membrane against the container in the vicinity of the seal sufficiently to maintain the seal against pressures generated in the container on heating of its contents.
15. A method according to claim 14 wherein the container has a neck including the step of securing the said flexible membrane on the open end of the said container neck by use of a heat-sealing method such as heat contact, ultrasonic, induction or hot air heating.
16. A method according to claim 14 wherein the step of moving the rigid closure and the container relative to one another includes rotating the rigid closure and the container relative to one another.
17. A method according to claim 14 or claim 16 wherein the container has a neck and wherein the step of adhesively securing the flexible membrane on the open end of the container includes the sub steps of applying adhesive material to the flexible membrane andor the container neck; engaging the flexible membrane and the container neck with one another to define the seal; and curing the adhesive material.
18. A method according to claim 17 wherein the substep of curing the adhesive material includes heating thereof.
19. A method of packaging a food product, comprising the steps of placing the food product in an open ended container; closing the open end of the container with a container closure to provide a container assembly according to any of claims 1 to 13; and heating the container assembly and the food product therein, the container closure system maintaining the seal between the flexible membrane and the container during such heating.
20. A method of packaging a food product comprising the steps of closing an open end of a container having two open ends with a closure to provide a container assembly according to any of claims 1 to 13; placing a food product in the container; closing the other open end of the container by flanging a container end thereto; and heating the container and the food product therein, the container closure system maintaining the seal between the flexible membrane and the container during such heating.
21. A method according to claim 19 or claim 20 wherein the step of heating includes cooking the food product in the container.