All The Claims

1. A very high repetition rate gas discharge laser system in a MOPA configuration comprising:
a master oscillator gas discharge laser system producing a beam of oscillator laser output light pulses at a very high pulse repetition rate;
at least two power amplification gas discharge laser systems receiving laser output light pulses from the master oscillator gas discharge laser system and each of the at least two power amplification gas discharge laser systems amplifying some of the received laser output light pulses at a pulse repetition that is a fraction of the very high pulse repetition rate equal to one over the number of the at least two power amplification gas discharge laser systems to form an amplified output laser light pulse beam at the very high pulse repetition rate.
2. The apparatus of claim 1 further comprising:
the at least two power amplification gas discharge laser systems comprises two power amplification gas discharge laser systems.
3. The apparatus of claim 1 further comprising:
the at least two power amplification gas discharge lasers systems are positioned in series with respect to the oscillator laser output light pulse beam.
4. The apparatus of claim 2 further comprising:
the at least two power amplification gas discharge lasers systems are positioned in series with respect to the oscillator laser output light pulse beam.
5. The apparatus of claim 3 further comprising:
the master oscillator gas discharge laser system fires at a pulse repetition rate of x\u22674000 Hz;
each power amplification gas discharge laser fires at \xbd x.
6. The apparatus of claim 4 further comprising: the master oscillator gas discharge laser system fires at a pulse repetition rate of x\u22674000 Hz;
each power amplification gas discharge laser fires at \xbd x.
7. The apparatus of claim 3 further comprising:
the master oscillator gas discharge laser system fires at a pulse repetition rate of x\u22675000 Hz;
each power amplification gas discharge laser fires at \xbd x.
8. The apparatus of claim 4 further comprising:
the master oscillator gas discharge laser system fires at a pulse repetition rate of x\u22675000 Hz;
each power amplification gas discharge laser fires at \xbd x.
9. The apparatus of claim 5 further comprising:
a beam delivery unit connected to the laser light output of the power amplification laser system and directing to output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
10. The apparatus of claim 6 further comprising:
a beam delivery unit connected to the laser light output of the power amplification laser system and directing to output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
11. The apparatus of claim 7 further comprising:
a beam delivery unit connected to the laser light output of the power amplification laser system and directing to output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
12. The apparatus of claim 8 further comprising:
a beam delivery unit connected to the laser light output of the power amplification laser system and directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
13. A lithography tool comprising:
a very high repetition rate gas discharge laser system in a MOPA configuration comprising:
a master oscillator gas discharge laser system producing a beam of oscillator laser output light pulses at a very high pulse repetition rate;
at least two power amplification gas discharge laser systems receiving laser output light pulses from the master oscillator gas discharge laser system and each of the at least two power amplification gas discharge laser systems amplifying some of the received laser output light pulses at a pulse repetition that is a fraction of the very high pulse repetition rate, equal to one over the number of the at least two power amplification gas discharge laser systems, to form an amplified output laser light pulse beam at the very high pulse repetition rate.
14. The apparatus of claim 13 further comprising:
the at least two power amplification gas discharge laser systems is two power amplification gas discharge laser systems.
15. The apparatus of claim 13 further comprising:
the at least two power amplification gas discharge lasers systems are positioned in series with respect to the oscillator laser output light pulse beam.
16. The apparatus of claim 14 further comprising:
the at least two power amplification gas discharge lasers systems are positioned in series with respect to the oscillator laser output light pulse beam.
17. The apparatus of claim 15 further comprising:
the master oscillator gas discharge laser system fires at a pulse repetition rate of x\u22674000 Hz;
each power amplification gas discharge laser fires at \xbd x.
18. The apparatus of claim 16 further comprising:
the master oscillator gas discharge laser system fires at a pulse repetition rate of x\u22674000 Hz;
each power amplification gas discharge laser fires at \xbd x.
19. The apparatus of claim 15 further comprising:
the master oscillator gas discharge laser system fires at a pulse repetition rate of x\u22675000 Hz;
each power amplification gas discharge laser fires at \xbd x.
20. The apparatus of claim 16 further comprising:
the master oscillator gas discharge laser system fires at a pulse repetition rate of x\u22675000 Hz;
each power amplification gas discharge laser fires at \xbd x.
21. The apparatus of claim 15 further comprising:
a beam delivery unit connected to the laser light output of the power amplification laser system and directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
22. The apparatus of claim 16 further comprising:
a beam delivery unit connected to the laser light output of the power amplification laser system and directing to output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
23. The apparatus of claim 17 further comprising:
a beam delivery unit connected to the laser light output of the power amplification laser system and directing to output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
24. The apparatus of claim 18 further comprising:
a beam delivery unit connected to the laser light output of the power amplification laser system and directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
25. A laser produced plasma EUV light source comprising:
a very high repetition rate gas discharge laser system in a MOPA configuration comprising:
a master oscillator gas discharge laser system producing a beam of oscillator laser output light pulses at a very high pulse repetition rate;
at least two power amplification gas discharge laser systems receiving laser output light pulses from the master oscillator gas discharge laser system and each of the at least two power amplification gas discharge laser systems amplifying some of the received laser output light pulses at a pulse repetition that is a fraction of the very high pulse repetition rate, equal to one over the number of the at least two power amplification gas discharge laser systems, to form an amplified output laser light pulse beam at the very high pulse repetition rate.
26. The apparatus of claim 25 further comprising:
the at least two power amplification gas discharge laser systems is two power amplification gas discharge laser systems.
27. The apparatus of claim 25 further comprising:
the at least two power amplification gas discharge lasers systems are positioned in series with respect to the oscillator laser output light pulse beam.
28. The apparatus of claim 26 further comprising:
the at least two power amplification gas discharge lasers systems are positioned in series with respect to the oscillator laser output light pulse beam.
29. The apparatus of claim 27 further comprising:
the master oscillator gas discharge laser system fires at a pulse repetition rate of x\u22674000 Hz;
each power amplification gas discharge laser fires at \xbd x.
30. The apparatus of claim 28 further comprising:
the master oscillator gas discharge laser system fires at a pulse repetition rate of x\u22674000 Hz;
each power amplification gas discharge laser fires at \xbd x.
31. The apparatus of claim 27 further comprising:
the master oscillator gas discharge laser system fires at a pulse repetition rate of x\u22675000 Hz;
each power amplification gas discharge laser fires at \xbd x.
32. The apparatus of claim 28 further comprising:
the master oscillator gas discharge laser system fires at a pulse repetition rate of x\u22675000 Hz;
each power amplification gas discharge laser fires at \xbd x.
33. The apparatus of claim 29 further comprising:
a beam delivery unit connected to the laser light output of the power amplification laser system and directing to output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
34. The apparatus of claim 30 further comprising:
a bean delivery unit connected to the laser light output of the power amplification laser system and directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam potting and direction control.
35. The apparatus of claim 31 further comprising:
a beam delivery unit connected to the laser light output of the power amplification laser system and directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
36. The apparatus of claim 32 further comprising:
a beam delivery unit connected to the laser light output of the power amplification laser system and directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
37. A method of producing a very high repetition rate gas discharge laser system in a MOPA configuration comprising:
utilizing a master oscillator gas discharge laser system, producing a beam of oscillator laser output light pulses at a very high pulse repetition rate;
utilizing at least two power amplification gas discharge laser systems, receiving laser output light pulses from the master oscillator gas discharge laser system and, in each of the at least two power amplification gas discharge laser systems, amplifying some of the received laser output light pulses at a pulse repetition that is a fraction of the very high pulse repetition rate equal to one over the number of the at least two power amplification gas discharge laser systems to form an amplified output laser light pulse beam at the very high pulse repetition rate.
38. The method of claim 37 further comprising:
the at least two power amplification gas discharge laser systems comprises two power amplification gas discharge laser systems.
39. The method of claim 37 further comprising:
the at least two power amplification gas discharge lasers systems are positioned in series with respect to the oscillator laser output light pulse beam.
40. The method of claim 38 further comprising:
the at least two power amplification gas discharge lasers systems are positioned in series with respect to the oscillator laser output light pulse beam.
41. The method of claim 37 further comprising:
utilizing a beam delivery unit connected to the laser light output of the power amplification laser system, directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
42. The method of claim 38 further comprising:
utilizing a beam delivery unit connected to the laser light output of the power amplification laser system, directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
43. The method of claim 39 further comprising:
utilizing a beam delivery unit connected to the laser light output of the power amplification laser system, directing to output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
44. The method of claim 40 further comprising:
utilizing a beam delivery unit connected to the laser light output of the power amplification laser system, directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
45. A method of performing integrated circuit lithography comprising:
utilizing a method for producing a very high repetition rate gas discharge laser system in a MOPA configuration comprising the steps of:
utilizing a master oscillator gas discharge laser system, producing a beam of oscillator laser output light pulses at a very high pulse repetition rate;
utilizing at least two power amplification gas discharge laser systems, receiving laser output light pulses from the master oscillator gas discharge laser system and, in each of the at least two power amplification gas discharge laser systems, amplifying some of the received laser output light pulses at a pulse repetition that is a fraction of the very high pulse repetition rate equal to one over the number of the at least two power amplification gas discharge laser systems to form an amplified output laser light pulse beam at the very high pulse repetition rate.
46. The method of claim 45 further comprising:
the at least two power amplification gas discharge laser systems comprises two power amplification gas discharge laser systems.
47. The method of claim 45 further comprising:
the at least two power amplification gas discharge lasers systems are positioned in series with respect to the oscillator laser output light pulse beam.
48. The method of claim 46 further comprising:
the at least two power amplification gas discharge lasers systems are positioned in series with respect to the oscillator laser output light pulse beam.
49. The method of claim 45 further comprising:
utilizing a beam delivery unit connected to the laser light output of the power amplification laser system, directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
50. The method of claim 46 further comprising:
utilizing a beam delivery unit connected to the laser light output of the power amplification laser system, directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
51. The method of claim 47 further comprising:
utilizing a beam delivery unit connected to the laser light output of the power amplification laser system, directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
52. The method of claim 48 further comprising:
utilizing a beam delivery unit connected to the laser light output of the power amplification laser system, directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
53. A method of producing EUV light utilizing a laser produced plasma comprising:
utilizing a very high repetition rate gas discharge laser system in a MOPA configuration comprising:
utilizing a master oscillator gas discharge laser system, producing a beam of oscillator laser output light pulses at a very high pulse repetition rate;
utilizing at least two power amplification gas discharge laser systems, receiving laser output light pulses from the master oscillator gas discharge laser system and, in each of the at least two power amplification gas discharge laser systems, amplifying some of the received laser output light pulses at a pulse repetition that is a fraction of the very high pulse repetition rate equal to one over the number of the at least two power amplification gas discharge laser systems to form an amplified output laser light pulse beam at the very high pulse repetition rate.
54. The method of claim 53 further comprising:
the at least two power amplification gas discharge laser systems comprises two power amplification gas discharge laser systems.
55. The method of claim 54 further comprising:
the at least two power amplification gas discharge lasers systems are positioned in series with respect to the oscillator laser output light pulse beam.
56. The apparatus of claim 55 further comprising:
the at least two power amplification gas discharge lasers systems are positioned in series with respect to the oscillator laser output light pulse beam.
57. The method of claim 53 further comprising:
utilizing a beam delivery unit connected to the laser light output of the power amplification laser system, directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
58. The method of claim 54 further comprising:
utilizing a beam delivery unit connected to the laser light output of the power amplification laser system, directing to output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
59. The meted of claim 55 further comprising:
utilizing a beam delivery unit connected to the laser light output of the power amplification laser system, directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
60. The method of claim 56 further comprising:
utilizing a beam delivery unit connected to the laser light output of the power amplification laser system, directing an output of the power amplification laser system to an input of a light utilization tool and providing at least beam pointing and direction control.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1.-9. (canceled)
10. A floating-caliper disc brake of a motor vehicle
with a component fixed to the vehicle,
with a floating caliper (2) and
with at least two pin guides (10, 20) for the displaceable arrangement of the floating caliper (2) at the component fixed to the vehicle, each of the pin guides having a guiding portion and a pin and being attached with a first end (12) by means of the pin (11, 21, 21\u2032, 41) to the component fixed to the vehicle or at the floating caliper (2), respectively, while being arranged with a second end (13) provided by the guiding portion (15, 29, 39), in a displaceable manner, in a bore (4) of the floating caliper (2) or of the component fixed to the vehicle,
with a first pin guide (10) for the transmission of brake circumferential forces and a second pin guide (20) for positioning the floating caliper (2) perpendicular to its direction of displacement,
wherein the second pin guide (20) includes a multipart guide pin (21, 21\u2032, 41), with a pin (22, 22\u2032, 42), an elastic sleeve (23, 45, 50, 55) encompassing the pin (22, 22\u2032, 42), and with a sliding bushing (28, 28\u2032, 38) encompassing the elastic sleeve (23, 45, 50, 55).
11. The floating-caliper disc brake as claimed in claim 10,
wherein the first pin guide (10) includes a one-piece carrier pin (11).
12. The floating-caliper disc brake as claimed in claim 11,
wherein the carrier pin (11) at its first end (12) is defined by way of a conical surface (17) at the component fixed to the vehicle or at the floating caliper (2), respectively.
13. The floating-caliper disc brake as claimed in claim 10,
wherein the guiding portion (15) of the first pin guide (10) and the guiding portion (29, 39) of the second pin guide (20) have the same outside diameter.
14. The floating-caliper disc brake as claimed in claim 10,
wherein the multipart guide pin (21, 21\u2032, 41) has a conical surface (27, 27\u2032, 37) at the first end.
15. The floating-caliper disc brake as claimed in claim 10,
wherein the elastic sleeve (23, 45, 50, 55) is provided on at least an inside or an outside surface with an appropriate profiling (25, 47, 51, 57) for an adjustment of an elastic effect perpendicular to the direction of displacement.
16. The floating-caliper disc brake as claimed in claim 10,
wherein the elastic sleeve (23), at least in sections, is composed of an elastic material, in particular rubber material.
17. The floating-caliper disc brake as claimed in claim 10,
wherein the elastic sleeve is designed as a tolerance sleeve (45, 50, 55), which is made of a material of low elastic properties at least in sections, and permits a limited elastic deformation in a radial direction due to its appropriate configuration.
18. The floating-caliper disc brake as claimed in claim 10,
wherein the elastic sleeve (23, 45, 50, 55) permits a limited elastic deformation in a radial direction with respect to the pin axis, and includes a radial stop.

1. A disposable lawn bag designed for easy removal of leaves and other law debris comprising:
a flexible garbage bag, said bag having a closed end and an open end, one or more stakes for supporting said open end of said bag in an open portion, such that when said stakes are spread apart tautly and the ends of said stakes are inserted into the ground, said bag is flush to the ground and its open end is held open for ease in raking leave and lawn debris into said bag.
2. The disposable bag described in claim 1 wherein:
said bag is made of various thickness of disposable plastic material and is in a variety of sizes depending on the job it is being used for.
3. The disposable bag described in claim 1 wherein:
each said bag includes a slot on opposite borders of its opening which allows for support stakes to be held, when the ends of said stakes are spread apart tautly and inserted into the ground, said bag will be held o pen and sit flush against the ground.
4. The disposable bag described in claim 1 wherein:
said stakes can be made out of a variety of materials including, plastic, wood, metal, cardboard, aluminum, rubber and paper.
5. The disposable bag described in claim 1 wherein:
said stakes are straight, hinged, collapsible or telescopic.
6. A disposable bag described in claim 1 wherein:
said bag has an enclosed stake, said stake can form a U-shape when the two ends of said stake are inserted into the ground to hold said bag flush to the ground and in an open position for ease in raking leave and law debris.
7. A disposable bag described in claim 1 wherein:
said opening of said bag is in the form of a square, rectangular, or trapezoidal shape when the two ends of said stakes are inserted into the ground, and will hold the bag flush to the ground and open for ease in raking leaves and lawn debris.
8. A disposable bag described in claim 1 wherein:
said flexible gag has one or more enclosed stakes to form a triangular shape when the two ends of said stakes are inserted into the ground to hold the bag flush to the ground and open for ease in raking leaves and lawn debris.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A device layout tool, comprising:
a diffusion layer, wherein the diffusion layer is configured to define diffusion structures;
a gate electrode layer, wherein the gate electrode layer is configured to define gate electrode structures, wherein the gate electrode layer is over the diffusion layer, wherein the gate electrode layer and the diffusion layer are configured to define a three dimensional (3D) gate structure covering a fin structure, wherein the fin structure has three exposed surfaces; and
three defect-describing layers, wherein each of the three defect-describing layers is configured to define locations of gate defects relative to one of the three exposed surfaces of the fin structure,
wherein the device layout tool is part of a fault modeling tool, and wherein the three defect-describing layers are configured to defined a location of defects for fault injection.
2. The device layout tool of claim 1, wherein the three defect-describing layers are configured to define the location of gate defects relative to the three exposed surfaces of the fin structure.
3. The device layout tool of claim 1, wherein the gate defects are selected from the group consisting of opens, point defects, or a combination thereof.
4. The device layout tool of claim 1, wherein each of the three defect-describing layers is configured to use coordinates to define the location and size of a defect.
5. The device layout tool of claim 1, wherein each of the three defect-describing layers is configured to use ratios representing a relative location of a defect to a width and a length of the gate electrode layer associated with the one of the three exposed surfaces of the fin structure corresponding to the defect-describing layer to represent the location of the defect.
6. The device layout tool of claim 5, wherein the location if the defect is close to an edge of the fin structure the values of the ratios are close to 0 or 1.
7. The device layout tool of claim 1, wherein two exposed surfaces of the three exposed surfaces of the fin are substantially perpendicular to a third exposed surface of the three exposed surfaces.
8. A device layout tool, comprising:
a diffusion layer, wherein the diffusion layer is configured to define diffusion structures;
a gate electrode layer, wherein the gate electrode layer is configured to define gate electrode structures, wherein the gate electrode layer is over the diffusion layer, wherein the gate electrode layer and the diffusion layer are configured to define a three dimensional (3D) gate structure covering a fin structure, wherein the fin structure has three exposed surfaces; and
a defect-describing layer, wherein the defect-describing layer is configured to define locations of gate defects relative to the three exposed surfaces of the fin structure.
9. The device layout tool of claim 8, wherein the defect-describing layer includes coordinate information of the gate defects, the coordinate information reflects which of the three exposed surfaces the gate defects are associated with.
10. The device layout tool of claim 8, wherein the gate defects are selected from the group consisting of opens, point defects, or a combination thereof.
11. The device layout tool of claim 9, wherein an effective width of the fin structure is configured to define the locations of the gate defects, and wherein the effective width of the fin structure is equal to a width of the fin structure plus two times a height of the fin structure.
12. The device layout tool of claim 11, wherein the device layout too is configured to determine an exposed surface of the three exposed surfaces associated with a particular defect based on a coordinate of a particular defect being in a particular range.
13. The device layout tool of claim 8, wherein the defect-describing layer is configured to use ratios representing a relative location of a defect to an effective width and a length of the fin structure to represent the location and an associated exposed surface of the defect, wherein the effective width is equal to a width of the fin structure plus two times a height of the fin structure.
14. The device layout tool of claim 8, wherein the device layout tool is part of a fault modeling tool, and wherein the three defect-describing layers are configured to defined a location of defects for fault injection.
15. A method of fault simulation, comprising:
providing geometric description and device property parameters of transistors, wherein the transistors include fin field-effect transistors (finFETs);
providing geometric description of injected faults, wherein the injected faults are described by one or more defect-describing layers, wherein the one of more defect-describing layers are used to define locations of gate defects relative to three exposed surfaces of a three-dimensional (3D) fin structure;
providing test vectors, test parameters and test devices; and
performing a device simulation, using a device tool, to generate simulation results with injected faults, wherein the device layout tool is part of a fault modeling tool, and wherein the one or more defect-describing layers are configured to defined a location of defects for fault injection.
16. The method of fault simulation of claim 15, further comprising:
performing device simulation to generate simulation results without an injected fault; and
comparing the simulation results without the injected fault with the simulation results with injected faults to identify detectable faults.
17. The method of fault simulation of claim 16, further comprising:
storing the identified detectable faults, associated test vectors, associated test devices, and associated simulation results in a database.
18. The method of fault simulation of claim 16, further comprising:
providing new faults for new fault injection for fault simulation.
19. The method of fault simulation of claim 16, further comprising:
providing new test vectors, new test parameters, and new test devices for additional fault simulation.
20. The method of claim 15, wherein providing the geometric description of injected faults comprises using a single defect-describing layer, and the single defect-describing layer is used to define the locations of the gate defects for all three exposed surfaces of the 3D fin structure.