1460708203-7c235497-9387-4b9e-b088-32f532474610

1. A method of processing a head slider having a bearing surface, the method comprising:
(a) selecting a material stress pattern to be applied to a working surface of the slider based on measured and desired contour shape parameters in a plurality of localized areas on the bearing surface, wherein the measured contour shape parameter within a first of the plurality of localized areas is weighted more heavily than those within the other localized areas.
2. The method of claim 1 and further comprising:
(b) measuring a plurality of contour shape parameters within each of the plurality of localized areas on the bearing surface.
3. The method of claim 2 wherein step (b) comprises:
(b)(1) measuring slopes of the localized area along first and second orthogonal axes within each of the localized areas; and
(b)(2) measuring a height of a point on the bearing surface within each of the localized areas.
4. The method of claim 1 wherein step (a) comprises:
(a)(1) forming a mathematical expression as a function of an overall deviation of a shape of the bearing surface from a desired shape based on local deviations of each of the contour shape parameters from the desired shape parameters within the corresponding localized areas; and
(a)(2) selecting the material stress pattern from a plurality of stress patterns in order to minimize the mathematical expression in (a)(1).
5. The method of claim 4 wherein (a)(1) comprises expressing the overall deviation as a weighted sum of squares of the local deviations.
6. The method of claim 4 and further comprising:
(a)(3) for each of the plurality of stress patterns, generating the local deviations of each of the shape parameters based on the measured shape parameter within the corresponding localized area and a predicted response of that shape parameter to the stress pattern.
7. The method of claim 1 wherein step (a)(1) comprises forming the mathematical expression as a further function a predicted deviation of a fly characteristic of the slider from a desired fly characteristic.
8. The method of claim 7 and further comprising:
(a)(3) for each of the plurality of stress patterns, generating the predicted deviation of the fly characteristic as a function of the shape parameters within each of the plurality of localized areas and the sensitivities of the fly characteristic to the shape parameters.
9. The method of claim 7 wherein step (a)(1) comprises forming the mathematical expression as a further function predicted deviations of a plurality of fly characteristics of the slider from a plurality of corresponding desired fly characteristics.
10. The method of claim 9 wherein at least one of the predicted deviations of the plurality of fly characteristics is weighted more heavily than the other of the predicted deviations of the plurality of fly characteristics.
11. The method of claim 9 wherein the plurality of fly characteristics comprises fly height and pitch and roll attitudes of the slider.
12. The method of claim 1 and further comprising:
(b) applying the material stress pattern to the working surface of the slider to induce a change in the shape parameters within the plurality of localized areas.
13. The method of claim 1 wherein the slider carries a transducer within the first localized area, which has the shape parameter that is weighted more heavily than the shape parameters within the other localized areas.
14. A method of processing a head slider having a bearing surface, the method comprising:
(a) receiving a measure of a contour shape parameter within each of a plurality of localized areas on the bearing surface;
(b) receiving a corresponding desired contour shape parameter for each of the plurality of localized areas;
(c) forming a mathematical expression as a function of an overall deviation of a shape of the bearing surface from a desired shape based on local deviations of the contour shape parameters from the corresponding desired shape parameters; and
(d) selecting a material stress pattern to be applied to a working surface of the slider from a plurality of stress patterns in order to reduce the mathematical expression.
15. The method of claim 14 and further comprising:
(e) applying the material stress pattern selected in (d) to the working surface of the slider to induce a localized shape change within the plurality of localized areas.
16. The method of claim 14 wherein the measured contour shape parameter within a first of the plurality of localized areas is weighted more heavily than those within the other localized areas during selection of the material stress pattern in (d).
17. The method of claim 14 wherein (a) comprises receiving a measure of a plurality of contour shape parameters within each of the plurality of localized areas on the bearing surface.
18. The method of claim 17 wherein the plurality of contour shape parameters comprises:
slope of the localized area along a first axis;
slope of the localized area along a second axis, which is orthogonal to the first axis; and
height of a point on the bearing surface within the corresponding localized area.
19. The method of claim 14 wherein (c) comprises expressing the overall deviation as a weighted sum of squares of the local deviations.
20. The method of claim 19 and further comprising:
(e) for each of the plurality of stress patterns, generating the local deviations of each of the measured shape parameters based on the measured shape parameter based on a predicted response of that shape parameter to the stress pattern.
21. The method of claim 14 wherein (c) comprises forming the mathematical expression as a further function a predicted deviation of a fly characteristic of the slider from a desired fly characteristic.
22. The method of claim 21 and further comprising:
(e) for each of the plurality of stress patterns, generating the predicted deviation of the fly characteristic as a function of predicted responses of the measured shape parameters within each of the plurality of localized areas and the sensitivities of the fly characteristic to the predicted responses.
23. The method of claim 21 wherein (c) comprises forming the mathematical expression as a further function predicted deviations of a plurality of fly characteristics of the slider from a plurality of corresponding desired fly characteristics.
24. The method of claim 21 wherein at least one of the predicted deviations of the plurality of fly characteristics is weighted more heavily than the other of the predicted deviations of the plurality of fly characteristics during selection of the material stress pattern in (d).
25. The method of claim 23 wherein the plurality of fly characteristics comprises fly height and pitch and roll attitudes of the slider.
26. An apparatus for processing a head slider having a bearing surface, the apparatus comprising:
means for selecting a material stress pattern to be applied to a working surface of the slider based on measured and desired contour shape parameters in a plurality of localized areas on the bearing surface, wherein the measured contour shape parameter within a first of the plurality of localized areas is weighted more heavily than those within the other localized areas; and
means for applying the material stress pattern to the working surface of the slider to induce a localized shape change in the plurality of localized areas.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method comprising generating a signal that causes communication between a first node in a network and a second node in said network to traverse a second path in said network in lieu of a first path in said network;
wherein said network comprises one or more application-layer gateways; and
wherein said first path does not include any of said application-layer gateways; and
wherein said second path includes one of said application-layer gateways.
2. The method of claim 1 wherein said network comprises one or more Internet Protocol routers, and wherein communication between said first node and said second node is redirected along said second path without any participation by said Internet Protocol routers.
3. The method of claim 1 wherein said nodes are Internet Protocol endpoints and said application-layer gateways are Internet Protocol telephony gateways.
4. The method of claim 1 wherein said signal is generated in response to a decrease in the quality of service of said first path.
5. The method of claim 1 wherein said signal is generated in response to an indication that said second path provides better quality of service than said first path.
6. The method of claim 1 wherein said signal is generated in response to the detection of a problem in said network.
7. The method of claim 1 further comprising selecting an application-layer gateway for said second path from said one or more application-layer gateways.
8. A method comprising redirecting a call between a first node and a second node so that said call traverses a second path in lieu of a first path;
wherein said first node and said second node are in a network comprising one or more application-layer gateways; and
wherein said first path is a path in said network that
(i) connects said first node and said second node, and
(ii) does not include any of said application-layer gateways; and

wherein said second path is a path in said network that
(i) connects said first node and said second node, and
(ii) includes one of said application-layer gateways.
9. The method of claim 8 wherein said network comprises one or more Internet Protocol routers, and wherein said call is redirected without any participation by said Internet Protocol routers.
10. The method of claim 8 wherein said nodes are Internet Protocol endpoints and said application-layer gateways are Internet Protocol telephony gateways.
11. The method of claim 8 wherein the redirection is in response to a decrease in the quality of service of said first path.
12. The method of claim 8 wherein the redirection is in response to an indication that said second path provides better quality of service than said first path.
13. The method of claim 8 wherein the redirection is in response to the detection of a problem in said network.
14. The method of claim 8 further comprising selecting an application-layer gateway for said second path from said one or more application-layer gateways.
15. A method comprising:
monitoring the quality of service of a first path in a network by which a first node in said network and a second node in said network are currently communicating; and
when a condition pertaining to the quality of service of said first path is satisfied, generating a signal that causes communication between said first node and said second node to traverse a second path in said network in lieu of said first path;
wherein said network comprises one or more application-layer gateways; and
wherein said first path does not include any of said application-layer gateways; and
wherein said second path includes one of said application-layer gateways.
16. The method of claim 15 wherein said network comprises one or more Internet Protocol routers, and wherein communication between said first node and said second node is redirected along said second path without any participation by said Internet Protocol routers.
17. The method of claim 15 wherein said nodes are Internet Protocol endpoints and said application-layer gateways are Internet Protocol telephony gateways.
18. The method of claim 15 further comprising monitoring the quality of service of one or more additional paths in said network by which said first node and said second node are capable of communicating.
19. The method of claim 15 wherein said condition is that the value of a quality-of-service metric for said first path is below a threshold.
20. The method of claim 15 wherein said condition is that the value of a quality-of-service metric for said second path exceeds the value of said quality-of-service metric for said first path by a difference threshold.

1460708195-c483bbcc-22ce-40d1-acc3-d80c65429da8

1. A circuit board connected to a connector, the connector comprising a connection port arranged to receive an object to be connected and a plurality of contact portions located at upper and lower positions of the connection port, wherein any of the contact portions at one of the upper and lower positions and any of the contact portions at the other position face each other in a vertical direction, and each contact portion is connected electrically to the opposite contact portion, the circuit board comprising:
a base substrate;
a first wiring layer located on a first principal surface of the base substrate; and
a second wiring layer located on a second principal surface of the base substrate; wherein
first terminals connected to the first wiring layer are provided on the first principal surface, and second terminals connected to the second wiring layer are provided on the second principal surface, and
the first terminals and the second terminals come into contact with any of the contact portions and are arranged so as not to overlap each other in the vertical direction.
2. The circuit board according to claim 1, wherein dummy terminals that are insulated electrically from the first wiring layer and the second wiring layer are provided on both principal surfaces of the base substrate, and the dummy terminals are located in a region that is on the opposite side of the base substrate relative to a region where the first terminals or the second terminals are provided.
3. The circuit board according to claim 1, wherein the base substrate is flexible, and the circuit board is a flexible printed circuit board.
4. The circuit board according to claim 1, wherein electronic components are mounted on the first principal surface so as to be connected electrically to the first wiring layer, and different electronic components from those electronic components are mounted on the second principal surface so as to be connected electrically to the second wiring layer.
5. A connection structure comprising:
a connector; and
a circuit board, the connector and the circuit board being connected to define the connection structure; wherein
the connector includes a connection port arranged to receive the circuit board and a plurality of contact portions located at upper and lower positions of the connection port;
any of the contact portions at one of the upper and lower positions and any of the contact portions at the other position face each other in a vertical direction;
each contact portion is connected electrically to the opposite contact portion;
the circuit board includes a base substrate, a first wiring layer located on a first principal surface of the base substrate, and a second wiring layer located on a second principal surface of the base substrate;
first terminals connected to the first wiring layer are provided on the first principal surface, and second terminals connected to the second wiring layer are provided on the second principal surface, and
the first terminals and the second terminals come into contact with any of the contact portions and are arranged so as not to overlap each other in the vertical direction.
6. The connection structure according to claim 5, wherein dummy terminals that are insulated electrically from the first wiring layer and the second wiring layer are provided on both principal surfaces of the base substrate, and the dummy terminals are located in a region that is on the opposite side of the base substrate relative to a region where the first terminals or the second terminals are provided.
7. The connection structure according to claim 5, wherein the base substrate is flexible, and the circuit board is a flexible printed circuit board.
8. The connection structure according to claim 5, wherein electronic components are mounted on the first principal surface so as to be connected electrically to the first wiring layer, and different electronic components from those electronic components are mounted on the second principal surface so as to be connected electrically to the second wiring layer.
9. An apparatus comprising the connection structure according to claim 5.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A developing device for applying powder to a latent image carrying member to develop latent images on the latent image carrying member, comprising:
a transport member disposed in opposition to the latent image carrying member, and having a plurality of transport electrodes for generating electric fields to transport powder;
voltage supply means for applying n phase (where n is a positive integer equal to or greater than 2) voltage to the transport electrodes; and
transport member surface potential determination means for determining the surface potential of the transport member, wherein
the voltage supply means applies the n phase voltage to the transport electrodes so that the surface potential on the transport member is between the potential of the image portions and the potential of the non-image portions of the latent image carrying member.
2. The developing device as claimed in claim 1, wherein when latent image forming and developing are repeated to successively develop powder in different colors on the same latent image carrying member, the voltage supply means applies the n phase voltage to the transport electrodes so that the surface potential on the transport member is between the potential of the image portions and the potential of the non-image portions of the latent image carrying member in respect of the powder of each color.
3. The developing device as claimed in claim 1, wherein when developing the powder for the second and subsequent colors, the voltage supply means applies the n phase voltage to the transport electrodes so that the surface potential on the transport member is between the potential of the image portions that has been reduced by the charge of the previously developed powder and the potential of the non-image portions of the latent image carrying member.
4. The developing device as claimed in claim 1, wherein when developing the powder for the second and subsequent colors, the voltage supply means applies the n phase voltage to the transport electrodes so that the surface potential on the transport member is between the potential of the image portions, for which the charge on the previously developed powder has been increased by charging that is carried out prior to writing the latent image, and the potential of the non-image portions, of the latent image carrying member.
5. The developing device as claimed in claim 1, wherein when developing the powder for the second and subsequent colors, the voltage supply means applies the n phase voltage to the transport electrodes so that the surface potential on the transport member is between the potential of the image portions that has been reduced by the charge of the previously developed powder and the charge on the powder that has been increased by charging that is carried out prior to writing the latent image, and the potential of the non-image portions of the latent image carrying member.
6. The developing device as claimed in claim 1, wherein the electric field that moves the powder is a progressive wave electric field.
7. The developing device as claimed in claim 1, wherein the wave form of the voltage applied to the electrodes of the transport member is a wave form obtained by superimposing a direct current bias onto a pulse voltage.
8. The developing device as claimed in claim 1, wherein surface potential V on the transport member, when the surface potential V on the mth time (where m is a positive integer) in an order that powder is applied to the latent image carrying member is Vm, satisfies Vm>Vm+1.
9. A process cartridge which has at least a developing device for developing latent images on a latent image carrying member by applying powder to the latent image carrying member, and which can be freely inserted into and removed from a main body of an image forming apparatus, the process cartridge comprising:
a transport member disposed in opposition to the latent image carrying member and having a plurality of transport electrodes that generate electric fields to transport powder;
voltage supply means for applying n phase (where n is a positive integer equal to or greater than 2) voltage to the transport electrodes; and
transport member surface potential determination means for determining the surface potential of the transport member, wherein
the voltage supply means applies the n phase voltage to the transport electrodes so that the surface potential on the transport member is between the potential of the image portions and the potential of the non-image portions of the latent image carrying member.
10. An image forming apparatus comprising either a developing device that applies powder to a latent image carrying member to develop latent images on the latent image carrying member, or a process cartridge, wherein
the developing device comprises:
a transport member disposed in opposition to the latent image carrying member and having a plurality of transport electrodes that generate electric fields to transport powder;
voltage supply means for applying n phase (where n is a positive integer equal to or greater than 2) voltage to the transport electrodes; and
transport member surface potential determination means for detetermining the surface potential of the transport member, wherein
the voltage supply means applies the n phase voltage to the transport electrodes so that the surface potential on the transport member is between the potential of the image portions and the potential of the non-image portions of the latent image carrying member, and
the process cartridge comprises at least the developing device, and can be freely inserted into and removed from the main body of the image forming apparatus.
11. The image forming apparatus as claimed in claim 10, further comprising potential control means for controlling the surface potential on the transport member of the developing device so that the surface potential is a value between the potential of the image portions and the potential of the non-image portions of the latent image carrying member.
12. The image forming apparatus as claimed in claim 10, wherein the transport voltage applied to the transport member of the developing device is a wave form in which a pulse voltage and a direct current bias are superimposed, and the transport voltage is controlled by adjusting the value of the direct current bias.
13. A color image forming apparatus which comprises a plurality of process cartridges including at least a developing device for developing latent images on a latent image carrying member by applying powder to the latent image carrying member, and which can be freely inserted into and removed from the main body of the image forming apparatus, wherein
the developing device comprises:
a transport member disposed in opposition to the latent image carrying member and having a plurality of transport electrodes that generate electric fields to transport powder;
voltage supply means for applying n phase (where n is a positive integer equal to or greater than 2) voltage to the transport electrodes; and
transport member surface potential determination means for determining the surface potential of the transport member, wherein
the voltage supply means applies the n phase voltage to the transport electrodes so that the surface potential on the transport member is between the potential of the image portions and the potential of the non-image portions of the latent image carrying member.