1460707770-d8b812f7-5e6f-4989-bf61-83029307b44f

1. A rotational driving apparatus comprising:
a stepping motor supported by a housing;
an output shaft rotationally supported by the housing and driven by the stepping motor;
a rotational position detecting sensor for outputting a detected voltage in response to a rotational position of the output shaft; and
a position detecting means for detecting the rotational position of the output shaft in accordance with the detected voltage from the rotational position detecting sensor,
wherein the position detecting means comprises;
a means for determining that the output shaft is in a good operational order
when a first detected voltage of the output shaft at its first detection position (Step=0) and a second detected voltage of the output shaft at its second detection position (Step=n), to which the output shaft has been rotated by the stepping motor by a predetermined number of control pulses, are respectively within a predetermined error range; and
when a deferential voltage between the first and second detected voltages corresponding to the predetermined number of control pulses between the first and second detection positions is within a certain deferential voltage span.
2. A rotational driving apparatus according to claim 1,
wherein the certain deferential voltage span means a span from a first deferential voltage to a second deferential voltage, wherein the first deferential voltage is a deferential voltage between the maximum value of a second error range at the first detection position (step: 0) and the minimum value of the second error range (E2) at the second detection position (step:n), whereas the second deferential voltage is a deferential voltage between the minimum value of the second error range at the first detection position (step: 0) and the maximum value of the second error range at the second detection position (step:n).
3. A rotational driving apparatus according to claim 2,
wherein the error ranges are error ranges covering errors possibly included the detected voltages, and the second error range is narrower than the first error range.
4. A rotational driving apparatus according to one of claims 1 to 3,
wherein the first detection position is a reference position of the output shaft and the second detection position is a position which is a maximum position to which the output shaft can be rotated.
5. A rotational driving apparatus according to claim 1, further comprising:
a position initializing means for rotating the output shaft in a reverse direction until the output shaft impinges against a stopper and then rotating the same in a forward direction by a predetermined number of steps,
wherein the determining means detects, as the first detected voltage, the output voltage from the rotational position detecting sensor at an initial position of the output shaft before it will be rotated by the position initializing means,
the determining means further detects, as the second detected voltage, the output voltage from the rotational position detecting sensor at a position of the output shaft which has been rotated by the predetermined number of control pulses by the position initializing means, and
the determining means determines whether the output shaft is positioned at its reference position by determining the deferential voltage between the first and second detected voltages is within the certain deferential voltage span as a third error range.
6. A rotational driving apparatus according to claim 5, further comprises a return initializing means for rotating the output shaft in the reverse direction until the output shaft impinges against the stopper and then rotating the same in the forward direction until the output shaft comes to the reference position, when the determining means determines that the output shaft is not positioned at its reference position after the operation of the position initialing means.
7. A rotational driving apparatus according to claim 6, wherein the return initializing means calculates
a number of steps representing the present position of the output shaft, and
a necessary number of stepping pulses for rotating the output shaft in the reverse direction from the present position to such a position where the output shaft impinges against the stopper means,
based on the detected voltage from rotational position detecting sensor and a predetermined formula between a number of steps and a minimum value of the error range for the detected voltages.
8. A rotational driving apparatus according to claim 7, wherein
the return initializing means calculates a necessary number of stepping pulses for rotating the output shaft in the reverse direction from the present position to such a position where the output shaft becomes within the reference position error range,
the return initializing means drives the output shaft to rotate the same by such number of stepping pulses at a first rotational speed, and then to rotate the output shaft at a second rotational speed slower than the first rotational speed.
9. A rotational driving apparatus according to claim 8, wherein
the return initializing means increases amounts of electric current and electric voltage to be applied to the stepping motor by a predetermined values, when the output shaft will be rotated in the reverse direction at the first rotational speed.
10. A rotational driving apparatus according to claim 1, wherein the output shaft is operatively connected to the stepping motor through a multistage speed reduction gear mechanism.
11. A rotational driving apparatus according to claim 1, further comprising a spring means for urging the output shaft in one rotational direction.
12. A rotational driving apparatus according to claim 1,
wherein the rotational driving apparatus is connected to a steering angle sensor for a steering wheel of a motor vehicle so that a steering control signal is transmitted from the steering angle sensor to the rotational driving apparatus, and
wherein the output shaft of the rotational driving apparatus is operatively connected to headlights of the motor vehicle so that an optical axis of the headlights will be moved in response to a steering angle of the steering wheel.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A catalyst component which consists of the orthorhombic phase of a mixed metal oxide of the formula
AaVbNcXdOe
wherein A is at least one element selected from the group consisting of Mo and W, N is at least one element selected from the group consisting of Te and Se, and X is at least one element selected from the group consisting of Nb, Ta, Ti, Al, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ni, Pt, Bi, B, In, Ce As, Ge, Sn, Li, Na, K, Rb, Cs, Fr, Be, Mg, Ca, Sr, Ba, Ra, Hf, Pb, P, Pm, Eu, Gd, Dy, Ho, Er, Tm, Yb, Lu, Au, Ag, Re, Pr, Zn, Ga, Pd, Ir, Nd, Y, Sm, Tb, Br, Cu, Sc, Cl, F and I,
wherein, when a1, b0.01 to 1, c0.01 to 1, d0.01 to 1 and e is dependent on the oxidation state of the other elements.
2. A process for preparing an orthorhombic phase mixed metal oxide catalyst, said process comprising:
(a) admixing compounds of elements A, V, N and X and at least one solvent to form a solution,
wherein A is at least one element selected from the group consisting of Mo and W, N is at least one element selected from the group consisting of Te, Se and Sb, and X is at least one element selected from the group consisting of Nb, Ta, Ti, Al, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ni, Pt, Bi, B, In, Ce, As, Ge, Sn, Li, Na, K, Rb, Cs, Fr, Be, Mg, Ca, Sr, Ba, Ra, Hf, Pb, P, Pm, Eu, Gd, Dy, Ho, Er, Tm, Yb, Lu, Au, Ag, Re, Pr, Zn, Ga, Pd, Ir, Nd, Y, Sm, Tb, Br, Cu, Sc, Cl, F and I,
wherein A, V, N and X are present in such amounts that the atomic ratio of A:V:N:X is a:b:c:d, and
wherein, when a1, b0.01 to 1, c0.01 to 1 and d0.01 to 1;

(b) admixing a seeding effective amount of an orthorhombic phase mixed metal oxide seed, substantially free of hexagonal phase mixed metal oxide, with said solution to form a seeded solution,
(c) removing said at least one solvent from said seeded solution to form a catalyst precursor; and
(d) calcining said catalyst precursor to obtain said orthorhombic phase mixed metal oxide catalyst.
3. The process for preparing an orthorhombic phase mixed metal oxide catalyst according to claim 2, wherein N is at least one element selected from the group consisting of Te and Se.
4. The process for preparing an orthorhombic phase mixed metal oxide catalyst according to claim 2, wherein said orthorhombic phase mixed metal oxide seed, substantially free of hexagonal phase mixed metal oxide, is prepared by the process comprising:
(i) providing a mixed metal oxide having the empirical formula
AaVbNcXdOe
wherein A is at least one element selected from the group consisting of Mo and W, N is at least one element selected from the group consisting of Te, Se and Sb, and X is at least one element selected from the group consisting of Nb, Ta, Ti, Al, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ni, Pt, Bi, B, In, Ce, As, Ge, Sn, Li, Na, K, Rb, Cs, Fr, Be, Mg, Ca, Sr, Ba, Ra, Hf, Pb, P, Pm, Eu, Gd, Dy, Ho, Er, Tm, Yb, Lu, Au, Ag, Re, Pr, Zn, Ga, Pd, Ir, Nd, Y, Sm, Tb, Br, Cu, Sc, Cl, F and I, and
wherein, when a1, b0.01 to 1, c0.01 to 1, d0.01 to 1 and e is dependent on the oxidation state of the other elements;

(ii) contacting said mixed metal oxide with a liquid contact member selected from the group consisting of organic acids, alcohols, inorganic acids and hydrogen peroxide to form a contact mixture; and
(iii) recovering insoluble material from said contact mixture to obtain said orthorhombic phase mixed metal oxide seed substantially free of hexagonal phase mixed metal oxide.
5. The process for preparing an orthorhombic phase mixed metal oxide catalyst according to claim 4, wherein said liquid contact member is an aqueous solution of oxalic acid.
6. The process for preparing an orthorhombic phase mixed metal oxide catalyst according to claim 2, wherein said orthorhombic phase mixed metal oxide seed, substantially free of hexagonal phase mixed metal oxide, is prepared by the process comprising:
(a) admixing compounds of elements A, V, N and X and at least one solvent to form a first mixture,
wherein A is at least one element selected from the group consisting of Mo and W, N is at least one element selected from the group consisting of Te, Se and Sb, and X is at least one element selected from the group consisting of Nb, Ta, Ti, Al, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ni, Pt, Bi, B, In, Ce, As, Ge, Sn, Li, Na, K, Rb, Cs, Fr, Be, Mg, Ca, Sr, Ba, Ra, Hf, Pb, P, Pm, Eu, Gd, Dy, Ho, Er, Tm, Yb, Lu, Au, Ag, Re, Pr, Zn, Ga, Pd, Ir, Nd, Y, Sm, Tb, Br, Cu, Sc, Cl, F and I,
wherein A, V, M and X are present in such amounts that the atomic ratio of A:V:M:X is a:b:c:d, and
wherein, when a1, b0.01 to 1, c0.01 to 1 and d0.01 to 1;

(b) removing said at least one solvent from said first mixture to form a first precursor;
(c) calcining said first precursor to form a first calcined precursor;
(d) contacting said first calcined precursor with a liquid contact member selected from the group consisting of organic acids, alcohols, inorganic acids and hydrogen peroxide to form a contact mixture; and
(e) recovering insoluble material from said contact mixture to obtain said orthorhombic phase mixed metal oxide seed, substantially free of hexagonal phase mixed metal oxide.
7. The process for preparing an orthorhombic phase mixed metal oxide catalyst according to claim 6, wherein said liquid contact member is an aqueous solution of oxalic acid.
8. A process for producing an unsaturated carboxylic acid which comprises subjecting an alkane, or a mixture of an alkane and an alkene, to a vapor phase catalytic oxidation reaction in the presence of an orthorhombic phase mixed metal oxide catalyst, produced by the process of claim 2.
9. A process for producing an unsaturated nitrile which comprises subjecting an alkane, or a mixture of an alkane and an alkene, and ammonia to a vapor phase catalytic oxidation reaction in the presence of an orthorhombic phase mixed metal oxide catalyst, produced by the process of claim 3.

1460707767-dd5d86ab-f158-4c60-bb69-aaf9b05637dd

1. A Picture Archiving and Communications System, comprising:
an imaging modality subsystem configured to produce medical images;
a PACS workstation communicatively coupled with the imaging modality subsystem to process data corresponding to the medical images; and
a database subsystem communicatively coupled with the imaging modality subsystem and the PACS workstation to process the medical images and the data corresponding to the medical images.
2. A Picture Archiving and Communications System as in claim 1, wherein the database subsystem uses two-phase commit processing to store the medical images.
3. A Picture Archiving and Communications System as in claim 1, wherein the database subsystem stores the medical images so as to provide atomicity, consistency, isolation and durability (ACID) characteristics.
4. A Picture Archiving and Communications System as in claim 1, wherein the database subsystem is a distributed system.
5. A Picture Archiving and Communications System as in claim 1, wherein the database subsystem includes an exception handler to process the medical images and the data corresponding to the medical images responsive to a failure of two-phase commit processing.
6. A Picture Archiving and Communications System as in claim 1, wherein the data corresponding to the medical images includes at least one of a subset of patient name, exam information, timestamp, patient medical record, image meta data, image version, image size, image quality, color depth, edit history, user identification, and audit information.
7. A Picture Archiving and Communications System as in claim 1, wherein the database subsystem is configured to ensure transactional integrity of the medical images and the data corresponding to the medical images by use of commitrollback processing in which a transaction results in commit processing if possible and rollback processing if commit processing fails.
8. A method of transactionally storing medical images and routing workflows for the medical images, comprising:
communicating the medical images to a database;
communicating data corresponding to the medical images to the database; and
processing the medical images and the data corresponding to the medical images to store the medical images and the data corresponding to the medical images in the database with transactional integrity.
9. A method as in claim 8, wherein the step of processing includes two-phase commit processing to store the medical images.
10. A method as in claim 8, wherein the step of processing includes atomicity, consistency, isolation and durability (ACID) characteristics.
11. A method as in claim 8, further comprising the step of distributing the database among a plurality of servers.
12. A method as in claim 8, wherein the processing includes exception handling to process the medical images and the data corresponding to the medical images responsive to a failure of two-phase commit processing.
13. A method as in claim 8, wherein the data corresponding to the medical images includes at least one of a subset of patient name, exam information, timestamp, patient medical record, image meta data, image version, image size, image quality, color depth, edit history, user identification, and audit information.
14. A method as in claim 8, wherein processing includes commitrollback processing in which a transaction results in commit processing if possible and rollback processing if commit processing fails.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A semiconductor device comprising:
a first pad arranged on a semiconductor chip and designed to be used for bonding;
a second pad arranged on the semiconductor chip and designed to be used for both bonding and probing; and
a third pad arranged on the semiconductor chip and electrically connected to the first pad and designed to be used for probing.
2. The semiconductor device according to claim 1, wherein the first pad is arranged on an inner position of the semiconductor chip compared to the second pad and the third pad.
3. The semiconductor device according to claim 2, wherein the first pad and the third pad are electrically connected to a first inputoutput buffer arranged on the semiconductor chip, and
the second pad is electrically connected to a second inputoutput buffer arranged on the semiconductor chip.
4. The semiconductor chip according to claim 1, wherein the first pad is arranged on an inputoutput buffer area of the semiconductor device, and
the second pad and the third pad are arranged on an outside of the inputoutput buffer area.
5. The semiconductor device according to claim 1, wherein the first pad is arranged on an inputoutput buffer area of the semiconductor device, and
the second pad and the third pad are arranged on the inputoutput buffer area and near a terminal on the inputoutput buffer area compared to the first pad, and
the semiconductor device further includes:
a stress absorbing layer arranged below the second pad and the third pad.
6. The semiconductor device according to claim 5, wherein the first pad, the second pad and the third pad are arranged on a top layer of a multi layer interconnection structure, and
the stress absorbing layer is an interconnection layer which is not used as a part of an electrical circuit or an interlayer insulation film being thicker than an interlayer insulator existing below the first pad.
7. The semiconductor device according to claim 1, wherein an area of the third pad is smaller than an area of the first pad in area.
8. The semiconductor device according to claim 4, wherein the inputoutput buffer area includes a plurality of macro cells, and
the first pad is arbitrary one of a plurality of first pads, and each of the plurality of macro cells is connected to more than two of the plurality of first pads.
9. The semiconductor device according to claim 1, wherein the second pad is arranged to a longer direction of the second pad being directed to be parallel to a moving direction of a probe in probing the second pad; and
the third pad is arranged to a longer direction of the third pad being directed to be parallel to a moving direction of the probe in probing the third pad.
10. A semiconductor device comprising:
a first pad arranged on a semiconductor chip and electrically connected to a first inputoutput buffer arranged on the semiconductor chip;
a second pad and electrically connected to a second inputoutput buffer and arranged on an outer position of the semiconductor chip compared to the first pad; and
a third pad and electrically connected to the first inputoutput buffer and arranged on an outer position of the semiconductor chip compared to the first pad.