All The Claims

1. An integrated circuit having power management comprising:
processing circuitry for executing instructions;
at least one memory array coupled to the processing circuitry for providing data to the processing circuitry; and
control circuitry coupled to the at least one memory array, the control circuitry removing electrical connectivity of the at least one memory array to a supply voltage terminal by firstly disabling all accesses to the at least one memory array and secondly removing electrical power to all of the at least one memory array to reduce leakage current in the at least one memory array.
2. The integrated circuit of claim 1 further comprising:
one or more supporting memory arrays coupled to the at least one memory array, the one or more supporting memory arrays providing a support function to operate the at least one memory array, the control circuitry keeping the one or more supporting memory arrays selectively powered up when electrical power is removed to all of the at least one memory array depending upon whether all data in the at least one memory array must be marked as unusable upon restoring power to the at least one memory array.
3. The integrated circuit of claim 1 wherein the control circuitry further comprises:
a switch having a first terminal coupled to the supply voltage terminal and a second terminal coupled to a power plane terminal of the at least one memory array, the switch further comprising a control terminal for receiving a control signal that determines when the switch is conductive.
4. The integrated circuit of claim 3 wherein the control signal is provided in response to either execution of at least one instruction by the processing circuitry or in response to receipt by the processing circuitry of a power down signal.
5. The integrated circuit of claim 4 further comprising:
a configuration register for storing a control value that determines whether the control signal is provided in response to execution of the at least one instruction or in response to the power down signal.
6. The integrated circuit of claim 1 further comprising:
a plurality of memory arrays, each of the plurality of memory arrays being coupled to the control circuitry and being able to be independently entirely powered off to reduce transistor leakage current.
7. The integrated circuit of claim 1 further comprising:
a system memory coupled to the processing circuitry, wherein the control circuitry synchronizes the system memory by flushing the at least one memory array of stored data and physically halts the processing circuitry prior to removing power to the at least one memory array.
8. The integrated circuit of claim 1 further comprising:
a system memory coupled to the processing circuitry, wherein contents of the at least one memory array are synchronized with the system memory and wherein the at least one memory array comprises a copy-back cache that is configured as a write-through cache so that the contents of the at least one memory array are always synchronized with the system memory.
9. The integrated circuit of claim 1 further comprising:
a system memory coupled to the processing circuitry, wherein the control circuitry synchronizes the system memory by flushing the at least one memory array of stored data prior to disabling accesses to the at least one memory array under control of the processing circuitry for executing instructions and removing power to the at least one memory array.
10. The integrated circuit of claim 9 further comprising:
a control register coupled to the at least one memory array, the control register storing a command signal provided by the processing circuitry for executing instructions, the command signal disabling accesses to the at least one memory array.
11. The integrated circuit of claim 1 further comprising:
a control register within the control circuitry, the control register receiving and storing a command signal from the processing circuitry for executing instructions that functions to restore power to the at least one memory array, the control circuitry further comprising an array controller that marks all data entries in the at least one memory array with a predetermined bit value prior to the array controller enabling accesses to the at least one memory array.
12. The integrated circuit of claim 1 wherein the control circuitry restores power to the at least one memory array in response to a power up signal and marks all data entries in the at least one memory array as unusable prior to restarting the circuitry for executing instructions.
13. The integrated circuit of claim 1 wherein the control circuitry further comprises monitoring logic that observes memory accesses of the at least one memory array during removing electrical power to all of the at least one memory array, the monitoring logic limiting powering up of the at least one memory array in response to one or more memory requests until a predetermined criteria is met.
14. The integrated circuit of claim 13 wherein the monitoring logic uses differing predetermined criteria depending upon a sequence of instructions executed by the processing circuitry.
15. An integrated circuit having power management comprising:
processing circuitry for executing instructions;
a plurality of memory bit cells contained within a memory array, the plurality of memory bit cells being coupled to a power supply terminal for creating a first power plane;
memory array peripheral circuitry that is peripheral to the plurality of memory bit cells, the memory array peripheral circuitry being selectively coupled to the power supply terminal for creating a second power plane that is independent of the first power plane; and
control circuitry coupled to the memory array peripheral circuitry that is peripheral to the plurality of memory bit cells, the control circuitry selectively removing electrical connectivity to the power supply terminal of the memory array peripheral circuitry that is peripheral to the plurality of memory bit cells.
16. The integrated circuit of claim 15 wherein the control circuitry provides a control signal to selectively remove electrical connectivity, the control signal being provided in response to either execution of at least one instruction by the processing circuitry or in response to receipt by the processing circuitry of a power down signal.
17. The integrated circuit of claim 15 wherein the control circuitry halts the processing circuitry prior to removing power from the power supply terminal.
18. The integrated circuit of claim 15 wherein the control circuitry disables access to the plurality of memory bit cells prior to removing electrical connectivity to the power supply terminal of the memory array peripheral circuitry that is peripheral to the plurality of memory bit cells.
19. The integrated circuit of claim 15 further comprising monitoring logic that observes memory accesses of the memory array during removing electrical power to the memory array peripheral circuitry that is peripheral to the plurality of memory bit cells, the monitoring logic limiting powering up of the memory array peripheral circuitry in response to one or more memory requests until a predetermined criteria is met.
20. The integrated circuit of claim 19 wherein the monitoring logic uses differing predetermined criteria depending upon a sequence of instructions executed by the processing circuitry.
21. A method for reducing leakage current in an integrated circuit comprising:
providing a first power plane of circuitry, the first power plane of circuitry comprising an array of memory cells; and
providing a second power plane of circuitry, the second power plan of circuitry comprising a processor and control circuitry, the control circuitry removing electrical connectivity of the array of memory cells to a supply voltage terminal by firstly disabling all accesses to the array of memory cells and secondly removing electrical power to all of the array of memory cells to reduce leakage current in the array of memory cells.
22. The method of claim 21 further comprising:
providing at least one supporting array of memory cells in either the first power plane of circuitry or the second power plane of circuitry for providing support functions to the array of memory cells, wherein when the at least one supporting array of memory cells is in the first power plane of circuitry, the supporting array of memory cells is not powered down when the second power plane of circuitry is powered down thereby keeping a record of validity status of bits in the array of memory cells.
23. The method of claim 21 further comprising:
one or more additional power planes of circuitry coupled to the first power plane of circuitry, the one or more additional power planes of circuitry comprising additional arrays of memory cells in which each additional array may be separately and completely powered down independently of whether the second power plane of circuitry is powered.
24. A method of power management in an integrated circuit comprising:
executing instructions with a processor;
providing a plurality of memory bit cells contained within a memory array, the plurality of memory bit cells being coupled to a power supply terminal for creating a first power plane;
providing memory array peripheral circuitry that is peripheral to the plurality of memory bit cells;
selectively coupling the memory array peripheral circuitry that is peripheral to the plurality of memory bit cells to the power supply terminal for creating a second power plane that is independent of the first power plane;
coupling control circuitry to the memory array peripheral circuitry that is peripheral to the plurality of memory bit cells; and
selectively removing electrical connectivity to the power supply voltage terminal of the memory array peripheral circuitry that is peripheral to the plurality of memory bit cells.
25. The method of claim 24 further comprising:
observing memory accesses of the plurality of memory bit cells during removing of electrical power to the memory array peripheral circuitry that is peripheral to the plurality of memory bit cells; and
limiting powering up of the memory array peripheral circuitry that is peripheral to the plurality of memory bit cells in response to one or more memory requests until a predetermined criteria is met.
26. The method of claim 25 further comprising:
using differing predetermined criteria depending upon a sequence of instructions executed by the processor.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A clamping connection for an interchangeable mandrel (1) and drive shaft (13) of a riveting tool characterised in that it comprises a connecting casing (15) to which the end of the drive shaft (13) is fastened on one side, while on the other side there is an open cavity in the casing (15), adapted for inserting the end of the interchangeable mandrel (1), in a transverse direction, until its expanded end part is inside the cavity and its axis lies along the axis of the drive shaft (13) and the casing (15), where the interchangeable mandrel (1) in this position is moveable in the direction of the common axis by the action of a pressure element across engaging, rolling surfaces arranged on the front surface of the expanded end part of the interchangeable mandrel (1) and on the adjacent surface of the pressure element, to the clamped position where the interchangeable mandrel (1) is gripped by its expanded end part in the cavity of the casing (15) by means of a correspondingly shaped surface, arranged in the cavity of the casing (15), with the possibility of axial movement and secured against rotation.
2. A clamping connection according to claim 1, characterised in that the cavity of the casing (15) is a through cavity and has a cylindrical part furnished with a thread for screwing on the drive shaft (13), which cylindrical part is stepped down on the inside to a smaller diameter, thereby creating a stopping surface for the contacting pressure element, the cylindrical part of the cavity joins the part with the rectangular section for guiding the interchangeable mandrel (1), which also has a rectangular section in its corresponding part, the passage between these two parts of the cavity being arranged as a stop for the correspondingly shaped contact surface of the expanded end part of the interchangeable mandrel (1), and the casing (15) at the same time is furnished with a radial slot reaching into its cavity, which runs the length of the casing (15) and in the part of the cavity with the rectangular section has basically the same rectangular section and then expands so that its width is greater by its clearance than the section of the expanded end part of the interchangeable mandrel (1), while the length of the part of the interchangeable mandrel (1) with rectangular section is greater than the distance of the free end of the casing (15) from the expansion of its radial slot.
3. A clamping connection according to claim 1 or 2, characterised in that the pressure element comprises a pressure spring (19), located in the axial recess of the drive shaft (13) together with a pressure pin (16), the end of which, reaching into the cavity of the casing (15), has an expansion in the shape of a head with front rolling surface, where the head in its withdrawn end position reaches the seat formed by the shaped shoulder in the cavity of the casing (15).
4. A clamping connection according to claim 2, characterised in that the pressure element comprises a pressure spring (19), located in the cavity of the casing (15) and fitting tightly against a ball, freely positioned in this cavity of the casing (15), which in its withdrawn end position reaches the seat formed by the shaped shoulder in the cavity of the casing (15), the diameter of the ball being greater than the width of the transverse radial slot of the casing (15).
5. A clamping connection according to claim 3, characterised in that the head of the pressure pin (16) is spherical.
6. A clamping connection according to any of claims 2 to 5, characterised in that the interchangeable mandrel (1) is formed with a pin at one end furnished with a thread for connecting with the rivet and at the other end with a terminal clamping head, which on the side adjacent to the shaft of the pin has an engaging surface, basically vertical to the axis of the pin, and on the other side a spherical rolling surface, while for part of its length the pin is furnished with a bilateral shoulder running symmetrically in the direction of the axis, so that in this part it has a basically rectangular section, corresponding to the rectangular section of the part of the cavity of the casing (15) in which, in the clamped position during operation of the riveting tool, it is slidingly but not rotatingly guided.
7. Use of the clamping connection according to any of claims 1 to 6 for hand-held riveting tools, where the casing (15) with interchangeable mandrel (1) is placed in the front nozzle (4), to which is fixed an interchangeable extension (2) with staying front surface for riveting, and together with the nozzle (4) is tightly inserted in the extension (6) of the sliding pressure mandrel (22), which is arranged for engagement with the controlling levers (12) of the tool.

1. A structural foundation for use in expansive or other soil comprising:
a. a foundational element wherein the foundational element further comprises:
i. a vertical wall, wherein said vertical wall further comprises:
1. a top;
2. a bottom; and
3. an outside edge;

ii. a slab on a soil surface, wherein the slab further comprises an outer edge;

b. wherein the top of the vertical wall contacts the slab;
c. wherein the outside edge of the vertical wall faces away from the slab;
d. wherein the outside edge of the vertical wall is positioned underneath the slab such that the outside edge of the vertical wall and the outer edge of the slab fall within a vertical plane; and
e. wherein the bottom of the vertical wall extends a distance below the slab on the soil surface and prevents moisture from migrating beyond the vertical wall under the foundational element.
2. The structural foundation of claim 1 wherein the slab further comprises a topside wherein the top of the vertical wall extends out of the soil surface and the top of the vertical wall is level with the topside of the slab.
3. The structural foundation of claim 1 wherein the slab further comprises an underside wherein the top of the vertical wall contacts the underside of the slab.
4. The structural foundation of claim 1 wherein the vertical wall is comprised of concrete.
5. The structural foundation of claim 1 wherein the vertical wall further comprises steel reinforcements.
6. The structural foundation of claim 1 wherein the vertical wall further comprises fibers.
7. The structural foundation of claim 1 wherein the vertical wall further comprises waterproofing additives such that the vertical wall is impervious to water.
8. The structural foundation of claim 1 wherein the vertical wall further comprises a liner on its outside edge.
9. The structural foundation of claim 1 wherein the vertical wall and the slab are one monolithic piece.
10. A foundation for use in expansive or other soil comprising:
a. a vertical wall, wherein said vertical wall further comprises:
i. a top;
ii. a bottom; and
iii. an outside edge;

b. a foundation wherein the foundation further comprises:
i. a slab on a soil surface, wherein the slab further comprises:
1. a topside;
2. an underside; and
3. an outer edge;

ii. a footing below the soil surface, wherein the footing further comprises:
1. a topside;
2. an underside; and
3. an outer edge;
c. wherein the underside of the slab contacts the topside of the footing creating the foundation that supports a structure built on the topside of the slab;
d. wherein the top of the vertical wall contacts the underside of the footing;
e. wherein the outside edge of the vertical wall, the outer edge of the slab, and the outer edge of the footing fall within a vertical plane; and
f. wherein the bottom of the vertical wall extends a distance below the soil surface and prevents moisture from migrating beyond the vertical wall under the foundation.
11. The foundation of claim 10 wherein the vertical wall is poured integral to the footing.
12. The foundation of claim 10 wherein the foundation further comprises a stem.
13. The foundation of claim 10 wherein the vertical wall is comprised of concrete.
14. The foundation of claim 10 wherein the vertical wall is comprised of grout mix.
15. The foundation of claim 10 wherein the vertical wall further comprises waterproofing additives such that the vertical wall is impervious to water.
16. The foundation of claim 10 wherein the vertical wall further comprises a liner on its outside edge.
17. The foundation of claim 10 wherein the vertical wall and foundation are one monolithic piece.
18. The foundation of claim 10 wherein the footing and slab are one monolithic piece.
19. A method of creating a foundation for use in expansive or other soil comprising the steps of:
a. excavating an area where a foundation will be poured wherein the foundation further comprises;
i. a slab on a soil surface wherein the slab further comprises an outer edge; and
ii. a footing below the soil surface wherein the footing further comprises an outer edge;

b. digging an excavation in line with the outer edge of the footing a distance below the footing where a vertical wall will be poured wherein the vertical wall further comprises a top and a bottom and an outside edge wherein the outside edge faces away from the slab;
c. cleaning the excavation for the vertical wall;
d. pouring the vertical wall wherein the outside edge of the vertical wall is positioned underneath the slab such that the outside edge of the vertical wall, the outer edge of the slab, and the outer edge of the footing fall within a vertical plane and the top of the vertical wall contacts the footing and the bottom of the vertical wall extends a distance below the soil surface and prevents moisture from migrating beyond the vertical wall under the foundation.
20. The method of claim 19 wherein the vertical wall is concrete.
21. The method of claim 19 wherein the vertical wall is a grout mix.
22. The method of claim 19 further comprising the step of adding a waterproofing additive to the vertical wall such that it is impervious to water.
23. The method of claim 19 wherein the vertical wall further comprises a liner on its outside edge.
24. A method of creating a structural foundation for use in expansive or other soil comprising the steps of:
a. digging an excavation below a soil surface to create a vertical wall wherein the vertical wall further comprises a top and a bottom and an outside edge;
b. cleaning the excavation for the vertical wall;
c. filling the cleaned excavation with a material to create the vertical wall wherein the outside edge of the vertical wall, the outer edge of the slab and the outer edge of the footing fall within a vertical plane and the top of the vertical wall contacts the footing and the bottom of the vertical wall extends a distance below the soil surface and prevents moisture from migrating beyond the vertical wall under the foundation and supports a structure.
25. The method of claim 24 wherein the material used to create the vertical wall is concrete.
26. The method of claim 24 further comprising the step of adding a waterproofing additive to the vertical wall such that it is impervious to water.
27. The method of claim 24 wherein the vertical wall further comprises a liner on its outside edge.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

We claim:

1. A method of making a non-linear optical polymer layer, comprising:
(a) providing a liquid polymer precursor mixture containing a plurality of non-linear optical molecules;
(b) flash evaporating the liquid polymer precursor mixture forming an evaporate; and
(c) continuously cryocondensing the evaporate on a cool substrate forming a cryocondensed polymer precursor layer and cross linking the cryocondensed polymer precursor layer thereby forming the non-linear optical polymer layer.
2. The method as recited in claim 1, wherein flash evaporating comprises:
(a) supplying a continuous liquid flow of the liquid polymer precursor mixture into a vacuum environment at a temperature below both the decomposition temperature and the polymerization temperature of the liquid polymer precursor mixture;
(b) continuously atomizing the liquid polymer precursor mixture into a continuous flow of droplets;
(c) continuously vaporizing the droplets by continuously contacting the droplets on a heated surface having a temperature at or above a boiling point of the liquid polymer precursor mixture, but below a pyrolysis temperature, forming the evaporate.
3. The method as recited in claim 2, wherein the droplets are selected from non-linear optical molecules alone, non-linear optical molecules surrounded by base polymer precursor, or base polymer precursor alone.
4. A method as recited in claim 2, wherein the droplets range in size from about 1 micrometer to about 50 micrometers.
5. The method as recited in claim 1, wherein the cross linking is selected from ultraviolet cross linking, electron beam cross linking, x-ray cross-linking, glow discharge ionization cross linking, and spontaneous thermally induced cross linking.
6. The method as recited in claim 1, wherein flash evaporating comprises:
supplying a continuous liquid flow of the liquid polymer precursor mixture into a vacuum environment at a temperature below both the decomposition temperature and the polymerization temperature of the liquid polymer precursor mixture; and
continuously directly vaporizing the liquid flow of the liquid polymer precursor mixture by continuously contacting the liquid polymer precursor mixture on a heated surface having a temperature at or above a boiling point of the liquid polymer precursor mixture, but below a pyrolysis temperature, forming the evaporate.
7. The method as recited in claim 1, further comprising passing the evaporate past a glow discharge electrode prior to cryocondensing, wherein the cross linking is by glow discharge ionization.
8. The method as recited in claim 1, wherein the liquid polymer precursor mixture is a mixture of a base polymer precursor and the plurality of non-linear optical molecules.
9. The method as recited in claim 8, wherein the base polymer precursor is selected from (meth)acrylate polymer precursors, styrene polymer precursors, methyl styrene polymer precursors, epoxy polyamine polymer precursors, phenolic polymer precursors, allyl polymer precursors, alkyne polymer precursors, and phenyl acetylene polymer precursors, and combinations thereof.
10. The method as recited in claim 8, wherein the base polymer precursor is a (meth)acrylate polymer precursor selected from polyethylene glycol diacrylate 200, polyethylene glycol diacrylate 400, polyethylene glycol diacrylate 600, tripropyleneglycol diacrylate, tetraethylene glycol diacrylate, tripropylene glycol monoacrylate, and caprolactone acrylate, and combinations thereof.
11. The method as recited in claim 1, wherein the non-linear optical molecules are selected from dimethylamino nitrostilbene, methyl nitroanaline, and urea, and combinations thereof.
12. The method as recited in claim 1, wherein the substrate is electrically biased thereby poling the cryocondensed polymer precursor layer prior to cross linking.
13. The method as recited in claim 1, wherein the substrate is electrically grounded.
14. The method as recited in claim 1, wherein the substrate is electrically floating.
15. The method as recited in claim 1, wherein the non-linear optical molecules are sufficiently small that the settling rate of the non-linear optical molecules within the liquid polymer precursor mixture is several times greater than the amount of time to transport a portion of the liquid polymer precursor mixture from a reservoir to an atomization nozzle.
16. The method as recited in claim 1, further comprising agitating the liquid polymer precursor mixture.
17. The method as recited in claim 1, wherein the non-linear optical molecules have a volume less than about 5000 cubic micrometers.
18. The method as recited in claim 1, wherein the non-linear optical molecules have a volume less than about 4 cubic micrometers.