1. A mucosa excising device using an endoscope comprising:
a snare wire having a loop portion at a distal end portion of the snare wire;
a substantially cylindrical cap including a cylindrical wall, and a holding mechanism configured to hold the loop portion of the snare wire along an inner peripheral surface of the cylindrical wall; and
an attachment portion which attaches the cap to an end portion of the endoscope,
wherein the holding mechanism has a plurality of engagement pieces and a plurality of corresponding portions which are arranged along the inner peripheral surface of the cylindrical wall, and engage the loop portion to hold the loop portion of the snare wire between the engagement pieces and the corresponding portions, said plurality of engagement pieces being inwardly protruding from the cylindrical wall and being respectively distanced from each other in a circumferential direction of the cylindrical wall;
wherein when the snare wire is drawn in a proximal direction, at least protruded ends of the engagement pieces are displaced in the proximal direction by the loop portion, thereby allowing the loop wire to be released from between the engagement pieces and the corresponding portions, so that the loop portion is disengaged from the holding mechanism.
2. The mucosa excising device using an endoscope according to claim 1, wherein at least one of each of the engagement pieces and each of the corresponding portions elastically depress the loop portion onto the corresponding portion or the engagement piece by an elastic force in a distal direction to hold the loop portion of the snare wire.
3. The mucosa excising device using an endoscope according to claim 1, wherein the cylindrical wall has an inner flange inwardly protruding from the cylindrical wall, and the engagement pieces are formed in the inner flange, each of the engagement pieces being sectioned from the corresponding portion by a pair of notches which are distanced in the circumferential direction and extended from an inner edge of the inner flange at an angle with the circumferential direction.
4. The mucosa excising device using an endoscope according to claim 3, wherein said each pair of the notches are formed to extend to the cylindrical wall through the inner flange.
5. The mucosa excising device using an endoscope according to claim 4, wherein the each of the engagement pieces is elastically deformed and caused to swivel, and the snare wire is pressed against the corresponding portion by an elastic return force of the engagement piece.
6. The mucosa excising device using an endoscope according to claim 4, wherein the corresponding portions have a flange provided to inwardly protrude from the cylindrical wall, the engagement piece has separation portions separated from each other by a notch portion formed in the inner flange, and the snare wire is supported between the flange and the separation portions.
7. The mucosa excising device using an endoscope according to claim 3, wherein the inner flange has a plurality of lateral notches extending in the circumferential direction, and said each pair of notches extend toward the cylindrical wall from both ends of each lateral notch.
8. The mucosa excising device using an endoscope according to claim 3, wherein a circular end portion of the cylindrical wall has a plurality of lateral notches extending in the circumferential direction between the inner flange and the cylindrical wall, and said each pair of notches extend toward the cylindrical wall from both ends of each lateral notch.
9. The mucosa excising device using an endoscope according to claim 3, wherein said plurality of notches include vertical notches extending at a substantially right angle.
10. The mucosa excising device using an endoscope according to claim 3, wherein said plurality of engagement pieces are arranged in the same interval in the circumferential direction.
11. The mucosa excising device using an endoscope according to claim 3, wherein each of the engagement pieces and each of the corresponding portions directly contact opposite sides of the end portion of the snare wire to hold the end portion therebetween.
12. The mucosa excising device using an endoscope according to claim 1, wherein each of the engagement pieces is movable to swivel to a side where a circular end portion of the cylindrical wall is positioned with respect to the corresponding portion, and the engagement piece holds the snare wire between its outer surface and one surface of the corresponding portion when caused to swivel.
13. The mucosa excising device using an endoscope according to claim 1, wherein the engagement pieces and the corresponding portions are alternately arranged in the circumferential direction of the circular end portion.
14. The mucosa excising device using an endoscope according to claim 1, further comprising: a snare sheath into which the snare wire is inserted; a flexible tube which has an opening on an end side, the opening communicating with the inner side of the cylindrical wall which is arranged outside the insertion portion of the endoscope when the cap is attached to the endoscope, and is used to insert the snare sheath in which the snare is inserted therethrough; and a fixture for fixing the snare sheath to prevent the snare sheath from moving in an axial direction of the snare sheath against the flexible tube, to be capable of being released, the fixture being provided in the vicinity of a base end portion of the flexible tube.
15. The mucosa excising device using an endoscope according to claim 1, wherein at least the protruded ends of the engagement pieces are deformable such that the displacement thereof is due to an elastic deformation.
16. A mucosa excising device using an endoscope comprising:
a snare wire having a loop portion at a distal end portion of the snare wire;
a substantially cylindrical cap having a circular end portion including a holding mechanism configured to hold the loop portion of the snare wire such that all portions of the loop portion are held interior of the circular end portion; and
an attachment portion which attaches the cap to an end portion of an endoscope,
wherein the holding mechanism has a plurality of engagement portions which are provided along the circular end portion of the cap and distanced from each other in a circumferential direction, and each engagement portion has an engagement piece and a corresponding portion configured to hold the loop portion of the snare wire in an elastic manner therebetween so that the loop portion is positioned to be parallel to the circular distal end portion along a circular inner surface of the cylindrical cap;
wherein when the snare wire is drawn in a proximal direction, at least protruded ends of the engagement pieces are displaced in the proximal direction b the loop portion, thereby allowing the loop wire to be released from between the engagement portions and the corresponding portions, so that the loop portion is disengaged from the holding mechanism.
17. The mucosa excising device using an endoscope according to claim 16, wherein at least the protruded ends of the engagement pieces are deformable such that the displacement thereof is due to an elastic deformation.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A monitoring device (10) for a laser machining device (12) for machining a workpiece (18), comprising:
one or more sensor or sensors (20, 22) that monitor one or more process signals (24) of the laser machining device (12) in a three-dimensional spatial section (26) associated with the workpiece (18), whereby the sensor or sensors (20, 22) transmit signal data to a computing unit (28) so that a warning device or switch off device (28) for one or more laser beams coupled to the computing unit may be activated if the process signal or signals (24) in the spatial section (26) exceed or fall below a prescribed threshold value, wherein the sensor or sensors (20, 22) are independent of the laser machining device (12);
a low-energy laser pointer (40); and
a diffractive grid with which the laser beam of the laser pointer (40) is expanded to form a strip structure or grid structure that is projected into the spatial section (26).
2. The monitoring device according to claim 1, characterized in that the sensor or sensors (20, 22) are positioned so as to be stationary relative to the workpiece (18).
3. The monitoring device according to claim 1, characterized in that the sensor or sensors (20, 22) are configured so as to be moveable relative to the workpiece (18).
4. The monitoring device according to claim 3, characterized in that the sensor or sensors (20, 22) are positioned so as to be stationary relative to the workpiece (18) as said workpiece (18) is machined by the laser machining device (12).
5. The monitoring device according to claim 1, characterized in that the sensor or sensors (20, 22) are selected from the group consisting of: optical sensors and acoustic sensors.
6. The monitoring device according to claim 1, characterized in that the process signal (24) is an optical signal and the sensor or sensors (20, 22) are correspondingly configured as optical sensors.
7. The monitoring device according to claim 6, characterized in that the sensor or sensors (20, 22) are tuned to the laser-specific wavelength of the laser beams (13).
8. The monitoring device according to claim 6, characterized in that one or more diaphragms are coupled to the sensor or sensors (20, 22).
9. The monitoring device according to claim 6, characterized in that at least one attenuation filter that has been tuned to the wavelength of the laser beam (13) of the laser machining device (12) is provided in front of the sensor or sensors (20, 22).
10. The monitoring device according to claim 6, characterized in that the sensor or sensors (20, 22) are configured as CCD or CMOS sensors that acquire an image and only part of the image acquired by each of the sensors (20, 22) is read out or evaluated.
11. The monitoring device according to claim 1, characterized in that the process signal (24) is an acoustic signal and that the sensor or sensors (20, 22) are then correspondingly configured as acoustic sensors.
12. The monitoring device according to claim 1, characterized in that reference points (38\u2032, 38\u2033, 38\u2033\u2032) that can be detected by the sensor or sensors (20, 22) are provided in the spatial section (26).
13. The monitoring device according to claim 1, wherein the low-energy laser pointer (40) can be positioned so as to be stationary relative to the workpiece (18).
14. The monitoring device according to claim 1, characterized in that the process signal (24) is acquired directly from the laser beam (13) or indirectly from a machining site (30) of the workpiece (18).
15. The monitoring device according to claim 1, characterized in that data (34) for one or more trajectories (14, 16) for travel of the one or more laser beams (13) is preprogrammed in the computing unit (32).
16. The monitoring device according to claim 1, characterized in that the laser machining device (12) is surrounded by laser-protection walls and the monitoring device (10) switches off the laser beam (13) by means of a switch-off device (28) to protect the laser protection walls.
17. The monitoring device according to claim 6, characterized in that one or more optical systems are coupled to the sensor or sensors (20, 22).
18. A monitoring system for a laser machining device, comprising:
one or more sensors independently operable from the laser machining device, wherein said sensor(s) monitor one or more process signals in a three-dimensional spatial section associated with a workpiece processed by one or more laser beams emitted by the laser machining device;
one or more attenuation filters to darken images detected by the one or more sensors;
a warning device or switch-off device for the one or more laser beams, said warning device or switch-off device being activated if a process signal or process signals in the spatial section either exceed or fall below a prescribed threshold value; and
a laser pointer generating a light point or having a diffractive grid with which the laser beam of the laser pointer is expanded to form a strip structure or grid structure, wherein said light point, strip structure or grid structure is projected into the spatial section for detection by the sensor(s) to calibrate the sensor(s) before the laser machining device begins machining the workpiece.