All The Claims

1. A method for preparing a porous carbon structure, the method comprising the steps of:
mixing a carbon precursor, a pyrolytic template, and a solvent, to prepare a spray solution, the carbon precursor being polyacrylamide; and
subjecting the spray solution either to spray pyrolysis or to spray drying and then spray pyrolysis,
wherein the pyrolytic template is pyrolyzed at a temperature range in which the carbon precursor is carbonized or at a temperature below the temperature range.
2. The method according to claim 1, wherein the carbon precursor contained in a carbon precursorpyrolytic template composite is carbonized and crystallized by pyrolysis, while the template is pyrolyzed to form a pore structure.
3. The method according to claim 1, wherein the pyrolytic template is selected from the group consisting of cationic surfactants, anionic surfactants, nonionic surfactants and amphoteric surfactants.
4. The method according to claim 3, wherein the cationic surfactants are selected from the group consisting of quaternary ammonium salts, imidazolium salts, pyridinium salts, quinolinium salts, isoquinolinium salts, polyethyleneimine, polyprolyleneimine, polyallylamine, polylysine and polyamine.
5. The method according to claim 3, wherein the anionic surfactants are selected from the group consisting of alkyl sulfates, alkyl sulfonates, alkyl carboxylates, alkylbenzene carboxylates and alkylbenzene sulfonates.
6. The method according to claim 3, wherein the nonionic surfactants are selected from the group consisting of polyethylene oxides (PEO), polypropylene oxides (PPO) and a poly(ethylene oxide)-(propylene oxide) block copolymers.
7. The method according to claim 1, wherein the pyrolysis is carried out in a temperature range of 300-1500\xb0 C.
8. The method according to claim 1, wherein the prepared carbon structure has an average size ranging from 20 nm to 1000 \u03bcm.
9. A method for preparing a porous carbon structure, the method comprising the steps of:
mixing a carbon precursor, a hard template and a solvent to prepare a spray solution, the hard template being a metal oxide;
subjecting the spray solution either to spray pyrolysis or to spray drying and then spray pyrolysis, to form a carbonized carbon structurehard template composite; and
removing the template from the carbonized carbon structurehard template composite.
10. The method according to claim 9, wherein the carbonized carbon structurehard template composite is treated with water, an acid or a base to remove the template, thus forming a pore structure.
11. The method according to claim 9, wherein the metal oxide is selected from the group consisting of silica, alumina and titania.
12. The method according to claim 9, wherein the carbon precursor is selected from the group consisting of phenol-aldehyde resin, urea-aldehyde resin, aniline-aldehyde resin, polyimide, polyacrylonitrile, polystryrene, polydivinylbenzene, polyvinylpyridine, polypyrrole, polythiophene, polyaniline, perfuryl alcohol, polyacrylamide, cellulose, sugar, sugar polymers, carbohydrates, and mixtures thereof.
13. The method according to claim 9, wherein the pyrolsis is carried out in a temperature range of 300-1500\xb0 C.
14. The method according to claim 9, wherein the prepared carbon structure has an average size ranging from 20 nm to 1000 \u03bcm.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for operating a wireless device in a network environment where the wireless device and a counterpart device exist, the method comprising:
determining a Relative Distance Value (RDV) between the wireless device and an object comprising the counterpart device via image capture using a camera; and
identifying the counterpart device using the determined RDV.
2. The method of claim 1, further comprising performing a function determined in advance between the wireless device and the counterpart device using the identified counterpart device.
3. The method of claim 2, wherein the function determined in advance between the wireless device and the counterpart device comprises at least one of an image view function, a multimedia play function, a data backup function, a data share function, a synchronization function, and a slide show function.
4. The method of claim 1, wherein determining the RDV comprises:
displaying a focus zone and a preview image corresponding to the captured image on a display unit;
when a shooting key is selected, determining whether an object image and a height of the focus zone coincide in the preview image;
when the object image and the height of the focus zone coincide in the preview image, capturing the object; and
when the object image and the height of the focus zone do not coincide in the preview image, indicating that the object image and the height of the focus zone do not coincide and requesting to match the object image and the height of the focus zone.
5. The method of claim 4, wherein the object image and the height of the focus zone are matched using at least one of a user’s position movement, an auto-focus function of a camera, and a zoom function of the camera.
6. The method of claim 5, wherein determining the RDV further comprises:
displaying an input window for receiving a device type of the counterpart device on a display unit; and
when the device type of the counterpart device is input via the input window, determining a height of the object based on the input device type and determining a shooting distance based on the height of the object, a focal length of the camera, and a height of an image sensor of the camera,
wherein the shooting distance D is determined using Equation below:
Shooting
\ue89e
\ue89e
distance
\ue89e
\ue89e
D

=
Height
\ue8a0

(
H
)
\ue89e
\ue89e
of
\ue89e
\ue89e
object
Height
\ue8a0

(
h
)
\ue89e
\ue89e
of
\ue89e
\ue89e
image
\ue89e
\ue89e
sensor
\xd7
Focal
\ue89e
\ue89e
length
\ue89e
\ue89e
(
d
)

*
7. The method of claim 6, wherein the RDV is determined based on the determined shooting distance using the Equations below:
R
\ue89e
\ue89e
D
\ue89e
\ue89e
V

=
shooting
\ue89e
\ue89e
distance
\ue89e
\ue89e
D
image
\ue89e
\ue89e
proportional
\ue89e
\ue89e

const
.
\ue89e
\u025b

\xd7
focal
\ue89e
\ue89e
length
\ue89e
\ue89e
proportional
\ue89e
\ue89e

cont
.
\ue89e
\u03b7
image
\ue89e
\ue89e
proportional
\ue89e
\ue89e

const
.
\ue89e
\u025b
=
object
\ue89e
\ue89e
image
\ue89e
\ue89e
size
\ue89e
\ue89e

I
zone
focus
\ue89e
\ue89e
zone
\ue89e
\ue89e
size
\ue89e
\ue89e

F
zone
focal
\ue89e
\ue89e
length
\ue89e
\ue89e
proportional
\ue89e
\ue89e

const
.
\ue89e
\u03b7
=
shooting
\ue89e
\ue89e
focal
\ue89e
\ue89e
distance
\ue89e
\ue89e

d
s
basic
\ue89e
\ue89e
focal
\ue89e
\ue89e
distance
\ue89e
\ue89e

d
b
wherein the object image size Izone is the size of the object image, the focus zone size Fzone is a reference value of a vertical size of the object image, the basic focal distance db is a focal distance when there is no zoom-in or zoom-out, and the shooting focal distance ds is a focal distance used for actual shooting.
8. The method of claim 1, wherein identifying the counterpart device comprises:
determining whether an RDV that is within a predetermined error range of the determined RDV exists in a database; and
when the RDV that is within the predetermined error range of the determined RDV exists in the database, extracting a stored image of the counterpart device mapped to the RDV that is within the predetermined error range of the determined RDV from the database.
9. The method of claim 8, wherein extracting a stored image of the counterpart device comprises:
when a plurality of RDVs that are within the predetermined error range of the determined RDV exist in the database, collecting auxiliary information for identifying the counterpart device; and
extracting the stored image of the counterpart device mapped to the RDV that is within the predetermined error range of the determined RDV and the collected auxiliary information from the database,
wherein the auxiliary information comprises at least one of position information and bearings information.
10. The method of claim 8, further comprising, when the RDV that is within the predetermined error range of the determined RDV does not exist in the database, indicating that relevant counterpart device information is not registered.
11. The method of claim 1, further comprising registering a counterpart device to be connected for performing at least one specific function, by
mapping the determined RDV to a captured image of the object and storing the same.
12. The method of claim 11, further comprising:
determining whether a plurality of RDVs that are within the predetermined error range of the determined RDV exist in a database;
when a plurality of RDVs that are within the predetermined error range of the determined RDV exist in the database, collecting auxiliary information for identifying the counterpart device; and
mapping the determined RDV and the collected auxiliary information to the captured image of the counterpart device and storing the same,
wherein the auxiliary information comprises at least one of position information and bearings information.
13. An apparatus of a wireless device in a network environment where the wireless device and a counterpart device exist, the apparatus comprising:
a camera unit configured to capture an image of an object comprising the counterpart device; and
a counterpart device registration and connection manager configured to determine a Relative Distance Value (RDV) between the wireless device and the object via the captured image, and identifying the counterpart device using the determined RDV.
14. The apparatus of claim 13, wherein the counterpart device registration and connection manager is further configured to perform a function determined in advance between the wireless device and the counterpart device using the identified counterpart device.
15. The apparatus of claim 14, wherein the function determined in advance between the wireless device and the counterpart device comprises at least one of an image view function, a multimedia play function, a data backup function, a data share function, a synchronization function, and a slide show function.
16. The apparatus of claim 13, further comprising a display unit configured to display a focus zone and a preview image when capturing the image of the object,
wherein the counterpart device registration and connection manager is further configured to determine whether an object image and a height of the focus zone coincide in the preview image when a shooting key is selected, control the camera unit to capture the object and when the object image and the height of the focus zone coincide in the preview image, and when the object image and the height of the focus zone do not coincide in the preview image, indicate that the object image and the height of the focus zone do not coincide with each other and request to match the object image and the height of the focus zone.
17. The apparatus of claim 16, wherein the counterpart device registration and connection manager is further configured to match the object image and the height of the focus zone using at least one of a user’s position movement, an auto-focus function of a camera, and a zoom function of the camera.
18. The apparatus of claim 17, wherein the display unit is further configured to display an input window for receiving a device type of the counterpart device,
wherein the counterpart device registration and connection manager is further configured to, when the device type of the counterpart device is input via the input window, determine a height of the object based on the input device type, and determine a shooting distance based on the height of the object, a focal length of the camera, and a height of an image sensor of the camera, and
wherein the shooting distance is determined using Equation below:
Shooting
\ue89e
\ue89e
distance
\ue89e
\ue89e
D

=
Height
\ue8a0

(
H
)
\ue89e
\ue89e
of
\ue89e
\ue89e
object
Height
\ue8a0

(
h
)
\ue89e
\ue89e
of
\ue89e
\ue89e
image
\ue89e
\ue89e
sensor
\xd7
Focal
\ue89e
\ue89e
length
\ue89e
\ue89e
(
d
)

*
19. The apparatus of claim 18, wherein the RDV is determined based on the determined shooting distance using the Equations below:
R
\ue89e
\ue89e
D
\ue89e
\ue89e
V

=
shooting
\ue89e
\ue89e
distance
\ue89e
\ue89e
D
image
\ue89e
\ue89e
proportional
\ue89e
\ue89e

const
.
\ue89e
\u025b

\xd7
focal
\ue89e
\ue89e
length
\ue89e
\ue89e
proportional
\ue89e
\ue89e

cont
.
\ue89e
\u03b7
image
\ue89e
\ue89e
proportional
\ue89e
\ue89e

const
.
\ue89e
\u025b
=
object
\ue89e
\ue89e
image
\ue89e
\ue89e
size
\ue89e
\ue89e

I
zone
focus
\ue89e
\ue89e
zone
\ue89e
\ue89e
size
\ue89e
\ue89e

F
zone
focal
\ue89e
\ue89e
length
\ue89e
\ue89e
proportional
\ue89e
\ue89e

const
.
\ue89e
\u03b7
=
shooting
\ue89e
\ue89e
focal
\ue89e
\ue89e
distance
\ue89e
\ue89e

d
s
basic
\ue89e
\ue89e
focal
\ue89e
\ue89e
distance
\ue89e
\ue89e

d
b
wherein the object image size Izone is the size of the object image, the focus zone size Fzone is a reference value of a vertical size of the object image, the basic focal distance db is a focal distance when there is no zoom-in or zoom-out, and the shooting focal distance ds is a focal distance used for actual shooting.
20. The apparatus of claim 13, wherein the counterpart device registration and connection manager is further configured to determine whether an RDV that is within a predetermined error range of the determined RDV exists in a database, and when the RDV that is within a predetermined error range of the determined RDV exists in the database, extract a stored image of the counterpart device mapped to the RDV from the database.
21. The apparatus of claim 20, wherein the counterpart device registration and connection manager is further configured to, when a plurality of RDVs that are within the predetermined error range of the determined RDV exist in the database, collect auxiliary information for identifying the counterpart device, and extract the stored image of the counterpart device mapped to the RDV that is within the predetermined error range of the determined RDV and the collected auxiliary information from the database, wherein the auxiliary information comprises at least one of position information and bearings information.
22. The apparatus of claim 20, wherein the counterpart device registration and connection manager is further configured to, when the RDV that is within the predetermined error range of the determined RDV does not exist in the database, indicate that relevant counterpart device information is not registered.
23. The apparatus of claim 13, wherein the counterpart device registration and connection manager is further configured to register a counterpart device to be connected for performing at least one specific function by mapping the determined RDV to a captured image of the counterpart device and storing the same.
24. The apparatus of claim 23, wherein the counterpart device registration and connection manager is further configured to determine whether a plurality of RDVs that are within the predetermined error range of the determined RDV exist in a database, collect auxiliary information for identifying the counterpart device when a plurality of RDVs that are within the predetermined error range of the determined RDV exist in the database, and map and store the determined RDV and the collected auxiliary information to the captured image of the counterpart device,
wherein the auxiliary information comprises at least one of position information and bearings information.

1. The process for coating solid particles with at least one hot-melt agent, according to which:
the solid particles are fluidized in a spiralling, ascending current of air making it possible to obtain a homogeneous separated distribution of the particles in the air bed, the temperature of the air bed being lower than the melting temperature of the hot-melt agent,
the molten hot-melt agent is then sprayed onto the particles, in the form of atomized droplets, said droplets being distributed in a spray cone contained in a region of air, the temperature of which makes it possible to maintain, throughout said spraying, a hot-melt agent temperature which is substantially equal to the melting temperature thereof, the spraying being carried out in an ascending manner in the same direction as and tangentially to the path of the solid particles,
finally, when the coating is finished, the coated particles obtained are cooled so as to solidify the hot-melt agent around the particles.
2. The process as claimed in claim 1, characterized in that the solid particle is heat-sensitive and has a melting point close to, but higher than, that of the hot-melt agent.
3. The process as claimed in claim 1, characterized in that the diameter of the solid particles is less than 200 micrometers, advantageously between 30 and 180 micrometers.
4. The process as claimed in claim 1, characterized in that the temperature of the air bed is chosen so as to maintain the solid particle at a temperature which is below the melting temperature of the hot-melt agent, and which advantageously has a value close to 20 C. lower than the melting temperature of the hot-melt agent.
5. The process as claimed in claim 1, characterized in that the air pressure for atomizing the hot-melt agent is set, beforehand, between 0.3 bar and 5 bar, advantageously between 1 and 2 bar.
6. The process as claimed in claim 1, characterized in that the temperature of the region of air surrounding the spray cone in which the atomized droplets are maintained is advantageously chosen between or 5 C. with respect to the melting temperature of the hot-melt agent.
7. The process as claimed in claim 1, characterized in that the pressure of the region of air surrounding the spray cone containing the atomized droplets is less than 1.5 bar, advantageously equal to 0.5 bar.
8. The process as claimed in claim 1, characterized in that the temperature of the air for atomizing the hot-melt agent is a maximum of 10 C. higher than the melting temperature of said agent.
9. The process as claimed in claim 1, characterized in that the rate of spraying the hot-melt agent is between 5 and 50 gminute.
10. The process as claimed in claim 1, characterized in that the coating represents from 1 to 25% by weight, depending on the objective sought.
11. The process as claimed in claim 1, characterized in that the solid particle is an active principle chosen from the group comprising:
hydrochlorothiazide, acetazolamide, acetylsalicylic acid, allopurinol, alprenolol, amiloride, an anti-arrhythmia agent, an antibiotic, an antidiabetic, an anti-epileptic, anti-clotting agents, an antimycotic agent, atenolol, bendroflumethiazide, benzbromarone, benzthiazide, betamethasone and the esters thereof, a bronchodilator, buphenine, bupranolol, chlordiazepoxide, chloroquine, chlorothiazide, chlorpromazine, chlortalidone, clenbuterol, clomipramine, clonidine, co-dergocrine, cortisone, and the esters thereof, dexamethasone, and the esters thereof, dextropropoxyphene, diazepam, diazoxide, diclofenac, diclofenamide, digitalis glycoside, dihydralazine, dihidroergotamine, diltiazem, metal salts, ergotamine, ethacrynic acid, ethinyloestradiol, ethoxyzolamide, fenoterol, fludrocortinone, and the esters thereof, fluphenazine, furosemide, gallopamil, guanethidine, a hormone, hydrocortisone, and the esters thereof, hydroflumethiazide, an immunosuppressor, ibuprofen, imipramine, indomethacin, levodopa, a lithium salt, a magnesium salt, medroxyprogesterone acetate, menadione, methaqualone, 8-methoxypsoralen, methylclothiazide, methyldopa, methylprednisolone, methylestosterone, methylthiouracil, methylxanthine, metipranodol, molsidomine, morphine, naproxen, nicergoline, nifedipine, norfenefrine, oxyphenbutazone, papaverine, parmathasone, and the esters thereof, pentobarbital, perphenazine, phenobarbital, phenylbutazone, phytomenadione, pirenzepine, polythiazide, prazosine, prednisolone, and the esters thereof, prednisone, and the esters thereof, probenecid, propranolol, propylthiouracil, rescinnamine, reserpine, secbutabarbital, secobarbital, spironolactone, sulphasalazine, sulphonamide, thioridazine, triamcinolone, and the esters thereof, triamteren, trichlormethiazide, trifluoperazine, trifluopromazine, a tubercular static agent, verapamil, a virustatic agent, a zytostatic agent, bromocriptine, bromopride, carbidopa, carbocromen, quinine, chlorprothixene, cimetidine, clofibrate, cyclizine, desipramine, disulphiram, domperidone, doxepin, fenbufen, flufenamine acid, flunarizine, gemfibrocil, haloperidol, ketoprofen, labetalol, lorazepam, mefenamine acid, melperone, metoclopramide, nortriptyline, noscapine, oxprenolol, oxymetholone, pentazocine, pethidine, stanozolol, sulindac, sulpiride, tiotixene.
12. The process as claimed in claim 1, characterized in that the hot-melt agent is a lipid based on free fatty acids andor on fatty acid esters.
13. The process as claimed in claim 12, characterized in that the lipid comprises at least one partial ester of alcohol with at least one fatty acid.
14. The process as claimed in claim 13, characterized in that the lipid is chosen from the group comprising esters of palmitostearic acid and of alcohol, and esters of behenic acid and of alcohol.
15. A coated solid particle which can be obtained using the process which is the subject of claim 1.
16. A solid particle coated with a coating agent comprising at least one partial ester of alcohol with at least one fatty acid, characterized in that the particle size before coating is less than 400 micrometers, advantageously less than 200 micrometers, and in that the coating represents between 1 and 25% by weight of the coated particle.
17. The particle as claimed in claim 16, characterized in that the coating represents from 2 to 8% by weight of the coated particle.
18. The particle as claimed in claim 16, characterized in that it is heat-sensitive and has a melting point which is close to, but higher than, that of the hot-melt agent.
19. The particle as claimed in claim 16, characterized in that the particle is an active principle chosen from the group comprising:
hydrochlorothiazide, acetazolamide, acetylsalicylic acid, allopurinol, alprenolol, amiloride, an anti-arrhythmia agent, an antibiotic, an antidiabetic, an anti-epileptic, anti-clotting agents, an antimycotic agent, atenolol, bendroflumethiazide, benzbromarone, benzthiazide, betamethasone and the esters thereof, a bronchodilator, buphenine, bupranolol, chlordiazepoxide, chloroquine, chlorothiazide, chlorpromazine, chlortalidone, clenbuterol, clomipramine, clonidine, co-dergocrine, cortisone, and the esters thereof, dexamethasone, and the esters thereof, dextropropoxyphene, diazepam, diazoxide, diclofenac, diclofenamide, digitalis glycoside, dihydralazine, dihidroergotamine, diltiazem, metal salts, ergotamine, ethacrynic acid, ethinyloestradiol, ethoxyzolamide, fenoterol, fludrocortinone, and the esters thereof, fluphenazine, furosemide, gallopamil, guanethidine, a hormone, hydrocortisone, and the esters thereof, hydroflumethiazide, an immunosuppressor, ibuprofen, imipramine, indomethacin, levodopa, a lithium salt, a magnesium salt, medroxyprogesterone acetate, menadione, methaqualone, 8-methoxypsoralen, methylclothiazide, methyldopa, methylprednisolone, methylestosterone, methylthiouracil, methylxanthine, metipranodol, molsidomine, morphine, naproxen, nicergoline, nifedipine, norfenefrine, oxyphenbutazone, papaverine, parmathasone, and the esters thereof, pentobarbital, perphenazine, phenobarbital, phenylbutazone, phytomenadione, pirenzepine, polythiazide, prazosine, prednisolone, and the esters thereof, prednisone, and the esters thereof, probenecid, propranolol, propylthiouracil, rescinnamine, reserpine, secbutabarbital, secobarbital, spironolactone, sulphasalazine, sulphonamide, thioridazine, triamcinolone, and the esters thereof, triamteren, trichlormethiazide, trifluoperazine, trifluopromazine, a tubercular static agent, verapamil, a virustatic agent, a zytostatic agent, bromocriptine, bromopride, carbidopa, carbocromen, quinine, chlorprothixene, cimetidine, clofibrate, cyclizine, desipramine, disulphiram, domperidone, doxepin, fenbufen, flufenamine acid, flunarizine, gemfibrocil, haloperidol, ketoprofen, labetalol, lorazepam, mefenamine acid, melperone, metoclopramide, nortriptyline, noscapine, oxprenolol, oxymetholone, pentazocine, pethidine, stanozolol, sulindac, sulpiride, tiotixene.
20. The particle as claimed in claim 16, characterized in that the partial ester of alcohol with at least one fatty acid is chosen from the group comprising esters of palmitostearic acid and of alcohol, and esters of behenic acid and of alcohol.
21. A composition which integrates the coated particles which are the subjects of claim 16.
22. An ibuprofen particle coated with a coating agent, characterized in that the uncoated particle size is less than 200 micrometers, and in that the coating agent comprises at least one partial ester of alcohol with at least one fatty acid and represents between 1 and 25% by weight of the coated particle, advantageously between 2 and 8%.
23. The particle as claimed in claim 22, characterized in that the coating agent is chosen from the group comprising esters of palmitostearic acid and of alcohol, and esters of behenic acid and of alcohol.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An integrated circuit package, comprising:
a first chip having a first side and a second side, the first and second sides having a first plurality of conductive pads formed thereon, at least one conductive pad on the first side being electrically connected to a conductive pad on the second side, the first side containing active circuitry of the first chip;
a first layer formed directly on the second side and having a first cutout, wherein the first layer comprises a polymer material;
a second chip disposed in the first cutout;
a dielectric second layer formed directly on the first layer and the second chip and having a second cutout;
a third chip disposed in the second cutout;
a third dielectric layer formed directly on the second layer and the third chip; and
an interconnect formed in the one or more of the first, second or third layers to electrically connect at least one conductive pad of the first plurality of conductive pads to one or more of the second and third chips.
2. The integrated circuit package of claim 1, wherein the interconnect further comprises a second plurality of conductive pads on an exposed surface of one or more of the first, second or third layers.
3. The integrated circuit package of claim 1, further comprising:
a second interconnect disposed in the first layer, the second interconnect electrically connected to conductive pads of the first plurality of conductive pads on the first side, the second interconnect including third conductive pads on an exposed surface of the first layer.
4. The integrated circuit package of claim 1, wherein the second and third layers comprise a polymer material.
5. The integrated circuit package of claim 1, further comprising:
a first plurality of conductive bumps electrically connected to conductive pads on the first side of the first chip; and
a second plurality of conductive bumps on at least one exposed surface of one or more of the first, second or third layers, the first chip being disposed between the first and second plurality of conductive bumps.
6. The integrated circuit package of claim 5, further comprising a ball grid array structure coupled to the first plurality of conductive bumps.
7. The integrated circuit package of claim 5, wherein the second plurality of conductive bumps to provide test access points.
8. The integrated circuit package of claim 1, wherein the second chip is joined to the first chip to form a flip-chip structure.
9. The integrated circuit package of claim 1, wherein the interconnect comprises metal deposited in a electroless deposition process.
10. The integrated circuit package of claim 1, wherein the first, second and third chips are thinned chips.
11. The integrated circuit package of claim 1, wherein the first, second and third chips are part of a single wafer before being singulated together in a single package.
12. The integrated circuit package of claim 1, wherein the second chip has a thickness of about 75 \u03bcm.
13. The integrated circuit package of claim 1, wherein the third chip has a thickness of about 50 \u03bcm.
14. An integrated circuit package, comprising:
a first chip having a first side and a second side, the first and second sides having a first plurality of conductive pads formed thereon, at least one conductive pad on the first side being electrically connected to a conductive pad on the second side, the first side containing active circuitry of the first chip;
a first layer formed directly on the second side and having a first hole, wherein the first layer comprises a polymer material;
a second chip disposed in the first hole;
a second dielectric layer formed directly on the second chip and having a second hole;
a third chip disposed in the second hole;
a third dielectric layer formed directly on the third chip; and
an interconnect formed in the one or more of the first, second or third layers to electrically connect at least one conductive pad of the first plurality of conductive pads to one or more of the second and third chips.
15. The integrated circuit package of claim 14, wherein the interconnect further comprises a second plurality of conductive pads on an exposed surface of one or more of the first, second or third layers.
16. The integrated circuit package of claim 14, further comprising:
a second interconnect disposed in the first layer, the second interconnect electrically connected to conductive pads of the first plurality of conductive pads on the first side, the second interconnect including third conductive pads on an exposed surface of the first layer.
17. The integrated circuit package of claim 14, further comprising:
a first plurality of conductive bumps electrically connected to conductive pads on the first side of the first chip; and
a second plurality of conductive bumps on at least one exposed surface of one or more of the first, second or third layers, the first chip being disposed between the first and second plurality of conductive bumps.
18. An integrated circuit package, comprising:
a first chip having a first side and a second side, the first and second sides having a first plurality of conductive pads formed thereon, at least one conductive pad on the first side being electrically connected to a conductive pad on the second side, the first side containing active circuitry of the first chip;
a first layer formed directly on the second side and having a first hole, wherein the first layer comprises a polymer material;
a second chip disposed in the first hole, wherein the second chip is in contact with the second side;
a second dielectric layer formed directly on the second chip and having a second hole;
a third chip disposed in the second hole, wherein the third chip is in contact with the second chip;
a third dielectric layer formed directly on the third chip; and
an interconnect formed in the one or more of the first, second or third layers to electrically connect at least one conductive pad of the first plurality of conductive pads to one or more of the second and third chips.
19. The integrated circuit package of claim 18, wherein the interconnect further comprises a second plurality of conductive pads on an exposed surface of one or more of the first, second or third layers.
20. The integrated circuit package of claim 18, further comprising:
a second interconnect disposed in the first layer, the second interconnect electrically connected to conductive pads of the first plurality of conductive pads on the first side, the second interconnect including third conductive pads on an exposed surface of the first layer.
21. The integrated circuit package of claim 14 wherein the second and third layers comprise a polymer material.
22. The integrated circuit package of claim 18 wherein the second and third layers comprise a polymer material.