All The Claims

1. A solid micro components separation device comprising a stage,
a well having a certain specific volume on the stage,
a base fixed on the stage, and
an actuator connecting the base and the well; wherein
the well can contain at least two kinds of different components.
2. The components separation device of claim 1; wherein
the well has a cavity of a certain specific volume, the cavity contains a mixture of a plurality of components, the mixture is separated into respective components when the well is vibrated by the actuator.
3. The components separation device of claim 1; wherein
the well is driven by the actuator to move on a plane parallel to the stage in a rotating direction.
4. The components separation device of claim 3; wherein
the actuator is formed by a fixed comb-teeth electrode connected to the base and an opposing electrode consisting of movable comb-teeth electrode connected to the well.
5. The components separation device of claim 3; wherein
the movable comb-teeth electrode is led to the stage through a common electrode which is formed of one of the metals among gold, chromium, titanium and platinum.
6. The components separation device of claim 3; wherein
the stage is further provided with a central axis connecting the well and the stage, and a plurality of the opposing electrodes.
7. The components separation device of claim 6; wherein
one of the opposing electrodes and the other opposing electrode are applied respectively with different voltages cyclically so that the actuator vibrates the well in the rotating direction with the central axis as the center of revolution.
8. The components separation device of claim 1; wherein
the well is driven by the actuator to move on a plane parallel to the stage in the crosswise directions.
9. The components separation device of claim 1; wherein
the actuator comprises a piezoelectric element layer.
10. The components separation device of claim 9; wherein
the actuator is formed in a laminated structure having a silicon substrate and the piezoelectric element layer, the piezoelectric element layer has a piezoelectric layer provided at the respective surfaces with an upper electrode and a lower electrode.
11. The components separation device of claim 10; wherein
the lower electrode is formed of platinum or titanium,
the piezoelectric layer is formed of lead zirconate titanate, and
the upper electrode is formed of gold, platinum, titanium or chromium.
12. The components separation device of claim 1; wherein
the actuator has a meander shape.
13. The components separation device of claim 1; wherein
the well is made of silicon material, the stage is made of glass material.
14. A method for manufacturing components separation device comprising the steps of
etching a glass substrate to form a glass cavity, a glass base and a central axis,
forming a common electrode of a certain specific pattern on the central axis and the glass cavity, which common electrode being made of one of the metals among a group consisting of gold, chromium, titanium and platinum,
bonding a silicon substrate on the glass substrate by the direct bonding method, and
etching the bonded silicon substrate; wherein
the process of etching the silicon substrate is for providing a well having a silicon cavity of a certain specific volume and a movable comb-teeth electrode on the glass cavity, and a fixed comb-teeth electrode on the glass base.
15. A method for manufacturing components separation device comprising the steps of
etching a glass substrate to form a glass cavity and a glass base,
bonding a silicon substrate on the glass substrate by the direct bonding method,
forming a lower electrode, a piezoelectric layer and an upper electrode, in the order, on the bonded silicon substrate,
patterning the upper electrode, piezoelectric layer and lower electrode by an etching process, and
providing the well and a supporting member on glass cavity by etching the silicon substrate.
16. A method of separating solid micro components, using a components separation device comprising a stage, a well having a certain specific volume on the stage, a glass base fixed on the stage, and an actuator connecting the glass base and the well, the well having a silicon cavity of a certain specific volume; wherein
a sample consisting of solid components and liquid components contained in the well is vibrated by the actuator, and different components contained in the sample contained in the well are brought to uneven distribution and separated into respective components.
17. The method of separating solid micro components recited in claim 16, wherein the liquid component of sample is blood plasma, while the solid component is cells.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A connector for digital bands, comprising:
a plurality of connect pins spaced apart from each other in a direction, passing through the digital band made of a plurality of digital yarns to fix the digital bands, and electrically connected with the digital bands;
a lower housing that fixes the digital bands and the connect pins to a lower part with one end of each of the connect pins exposed through a lower surface;
an upper housing coupled with an upper part of the lower housing to fix the digital bands and the connect pins; and
wherein the lower housing comprises an exposed planar bottom surface, and wherein the connect pins comprise a bottommost surface coplanar with the bottom surface of the lower housing.
2. The connector of claim 1, wherein the connect pins correspond to the digital yarns to be connected to the digital yarns and are electrically connected to metal units formed in the digital yarns.
3. The connector of claim 1, wherein the connect pins further comprise piercing units fixing the digital yarns and extending units connected to the piercing units to be extended to the outside of the lower housing.
4. The connector of claim 3, wherein each of the piercing units comprises two vertical columns such that the digital yarns are inserted there between to fix the digital yarns.
5. The connector of claim 4, wherein a distance between the columns is shorter than a cross-sectional diameter of the metal units of the digital yarns.
6. The connector of claim 1, wherein the connect pins are arranged in zigzag fashion.
7. The connector of claim 1, wherein each of the digital bands is made by taping upper and lower ends of the plurality of digital yarns or by combining the same with fabrics.
8. The connector of claim 1, wherein one of the lower housing and the upper housing further comprises at least one protrusion formed on a surface of the lower housing or the upper housing to be coupled with the digital bands.
9. The connector of claim 1, wherein the lower housing comprises through holes in a lower part thereof so that the connect pins penetrate the through holes and are exposed to a lower surface of the lower housing through the through holes.
10. The connector of claim 1, wherein the lower housing comprises an exposed planar rearward surface, and wherein the connect pins comprise a terminal end aligned with the rearward surface of the lower housing.
11. A receptacle, comprising:
a plurality of conductive patterns, each one end of which is connected to an external circuit, and an entirety of a structure for each conductive pattern comprising a single and continuous structure with each one end exposed and spaced from the receptacle;
a lower housing including a plurality of through holes penetrated by the other ends of the conductive patterns to support the other ends of the conductive patterns from a lower part of the lower housing;
an upper housing coupled with an upper part of the lower housing to define a space between the upper housing and the lower housing;
wherein a digital band connector connected to digital bands is inserted into the space so that the digital band connector is electrically connected to the conductive patterns; and
wherein the lower housing comprises a bottommost surface and wherein the conductive patterns comprise a bottommost surface coplanar with the bottommost surface of the lower housing.
12. The receptacle of claim 11, wherein each of the lower housing and the upper housing comprises a step such that the digital band connector is fixed to the step.
13. The receptacle of claim 12, further comprising rubber rings provided along the steps of the lower housing and the upper housing.
14. The receptacle of claim 11, wherein each of the conductive patterns extends horizontally outside of the lower housing.
15. A connector assembly, comprising:
a digital band connector including:
a plurality of connect pins spaced apart from each other in a direction to fix digital bands made of a plurality of digital yarns and to be electrically connected with the digital bands;
a lower housing that fixes the digital bands and the connect pins in a lower part with one end of each of the pins exposed through a lower surface; and
an upper housing coupled with an upper part of the lower housing to fix the digital bands and the connect pins; and

a receptacle including:
a plurality of conductive patterns, each one end of which is connected to an external circuit and the other ends of which are electrically connected to the connect pins;
a lower housing having a plurality of through holes penetrated by the other ends of the conductive patterns to support the other ends of the conductive patterns from a lower part; and
an upper housing coupled with an upper part of the lower housing to define a space, in which the digital band connector is positioned, between the upper housing and the lower housing.
16. The connector assembly of claim 15, wherein the connect pins of the digital band connector are connected to the digital yarns to correspond to the digital yarns and are electrically connected to metal units formed in the digital yarns.
17. The connector assembly of claim 15, wherein one of the upper housing or the lower housing of the digital band connector comprises at least one protrusion formed on a surface of the lower housing or the upper housing that contacts the digital bands.
18. The connector assembly of claim 15, wherein the digital band connector further comprises coupling jaws formed in the lower housing and the upper housing, and the receptacle comprises steps formed in the lower housing and the upper housing so that the coupling jaws are fixed to the steps.
19. The connector assembly of claim 18, wherein the receptacle further comprises rubber rings provided along the steps.
20. The connector assembly of claim 15, wherein each one of the conductive patterns comprises an arcuate portion in direct contact with each one of the connect pins.

1. An integrated device for diagnostic analyses used to verify the presence of bacteria in at least a biological sample mixed with a eugonic culture broth, in order to identify at least the type of bacteria, and to test a series of antibiotics, selected from a group of antibiotics characteristic at least for said type of bacteria identified, identifying those effective to determine the antibiotic therapy, the device comprising inside an integrated structure, first optical examination means, having a laser emitter, able to verify the presence of bacteria, by observing the related growth curve, to define corresponding positive biological samples, and to identify at least the type, by observing the development of the bacterial growth over time of bacteria present in said positive biological samples, in order to define said group of antibiotics, and second examination means able to verify the sensitive or resistant response of each positive biological sample to a series of antibiotics of said group of antibiotics defined by said first examination means.
2. An integrated device as in claim 1, wherein a desired quantity of each positive biological sample is directly mixed with at least an antibiotic of said series of antibiotics, in order to verify the sensitivity or resistance of the bacterium to said antibiotic with respect to a desired quantity of said positive or reference sample, which is not mixed with any antibiotic.
3. An integrated device as in claim 1, comprising first and second containing means arranged inside said integrated structure, wherein said second containing means define a first and a second zone of analysis, said first examination means being associated at least with said first zone of analysis and said second examination means being associated with said second zone of analysis.
4. An integrated device as in claim 3, wherein said first containing means are able to contain a plurality of test tubes inside each of which a pure biological sample is present, cooling means being associated with said containing means in order to ensure the correct preservation of said pure biological samples.
5. An integrated device as in claim 3, wherein said second containing means comprise a heating unit able to heat said biological samples in order to promote the bacterial growth.
6. An integrated device as in claim 3, comprising selection means able to pick up a desired quantity of a pure biological sample contained in a test tube in order to dispense said desired quantity into a specific container containing eugonic broth and arranged in said first zone of analysis, associated with said first examination means.
7. An integrated device as in claim 6, wherein said selection means are able to pick up a desired quantity of a determinate positive biological sample contained in a container, arranged in said first zone of analysis, so as to divide said desired quantity into a plurality of first and second containers arranged in said second zone of analysis.
8. An integrated device as in claim 7, wherein said selection means cooperate with means to standardize the bacterial concentration present in the suspension taken.
9. An integrated device as in claim 8, wherein said standardization means comprise a photometer able to detect the turbidity of the suspension and to classify the concentration thereof according to the McFarland scale.
10. An integrated device as in claim 7, wherein an antibiotic of said group of antibiotics characteristic for at least said type of bacteria identified by said first examination means is introduced inside each of said second containers, wherein said determinate positive or reference biological sample is present substantially exclusively inside each of said first containers.
11. An integrated device as in claim 10, wherein said second examination means are able to compare the development of the bacterial charge of the biological samples contained in every container of said second plurality of containers with the development of the bacterial charge of the corresponding determinate positive biological sample contained in said first containers.
12. An integrated device as in claim 1, wherein each of said first and second examination means comprises said emitter means to emit electromagnetic radiations, and detection means to detect said electromagnetic radiations which pass through said container.
13. An integrated device as in claim 12, wherein the detection means of said first examination means include at least two fixed sensor elements, wherein the detection means of said second examination means include at least a movable sensor element.
14. An integrated device as in claim 12, wherein the detection means of the first and second examination means include at least a movable sensor element.
15. An integrated device as in claim 13, wherein said fixed sensor elements are arranged respectively at about 90\xb0 and 150\xb0 with respect to said emitter means and along a circumference at center of which said container is arranged.
16. An integrated device as in claim 1, further comprising, in said integrated structure, third examination means able to examine the positive biological samples in order to evaluate the correctness of the examination performed by the first examination means or the second examination means.
17. An integrated device as in claim 16, wherein said third examination means comprise devices able to analyze the spectral content of a gas produced by every positive biological sample.
18. An integrated device as in claim 6, wherein said selection means comprise mechanisms to move at least a pick-up and dispensing needle.
19. An integrated device as in claim 18, further comprising, in said integrated structure, a washing and sterilizing device, to wash and sterilize said pick-up and dispensing needle.
20. An integrated device as in claim 6, comprising reading means able to identify each of said containers, in order to correlate each of said containers to the biological sample contained therein and to the patient from whom said biological sample was taken.
21. An integrated device as in claim 6, further comprising a control unit able to at least memorize the displacements, the samples and the dispensing performed by means of said selection means.
22. An integrated device as in claim 1, comprising, in said first analysis zone, a plate defining a plurality of recesses each of which is able to be filled with the bacterial suspension and a relative antibiotic in order to select the most suitable antibiotic for the specific bacterium.
23. An integrated device as in claim 22, comprising means to detect the turbidity able to detect the kinetics of growth or inhibition in each of said recesses containing the bacterial suspension and a relative antibiotic.
24. An integrated device as in claim 22, wherein a chemical reagent is added to the bacterial suspension in at least some of said recesses, the device comprising means to detect the combination of colors produced by said chemical reagents in order to discriminate the bacterial species according to the resulting combination of colors.
25. A method for diagnostic analyses used to verify the presence of bacteria in at least a biological sample mixed with a eugonic culture broth, in order to identify at least the type of bacteria, and to test a series of antibiotics, selected from a group of antibiotics characteristic at least for said type of bacteria identified, identifying those effective to determine the antibiotic therapy, the method comprising the following steps:
a first examination step during which the content of a plurality of biological samples is examined by means of an optical examination device comprising at least a laser emitter, to verify the presence of bacteria to define a plurality of positive biological samples, and to identify at least the type of bacteria to define said group of antibiotics;
a second examination step, during which, if the result of the first examination step is affirmative, the sensitive or resistant response is verified of each positive biological sample to a series of antibiotics of said group of antibiotics defined in said first examination step.
26. A method as in claim 25, wherein during said second examination step each positive biological sample is mixed with at least an antibiotic of said series of antibiotics, in order to verify the sensitivity or resistance of the bacterium to said antibiotic with respect to a positive reference sample, to which no antibiotic has been added.
27. A method as in claim 25, further comprising a first selection step performed before said first examination step, during which a desired quantity of a pure biological sample is taken, contained in a respective test tube arranged in first containing means, and is dispensed in a container, arranged in second containing means, and containing said eugonic broth so as to promote the bacterial growth.
28. A method as in claim 25, further comprising a second selection step, performed after said first examination step and before said second examination step, during which a desired quantity of a specific positive biological sample is taken, enriched by the presence of grown bacteria, in order to divide it said desired quantity into a plurality of second containers inside each of which an antibiotic of said group of antibiotics is provided characteristic at least for said types of bacteria.
29. A method as in claim 25, further comprising a verification step after said first examination step, to verify the correct identification of the type of bacteria as resulting from said first examination step, which provides to mix a reagent substance with one or more of said biological samples, and to analyze the reaction times of each of said biological samples with said reagent substance.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. Power semiconductor module, comprising
at least one semiconductor chip which has a first main electrode side and a second main electrode side opposite the first main electrode side, the first main electrode side making thermal and electrical contact with the first base plate, and the second main electrode side making thermal and electrical contact with a second base plate,
a first cooling device with a first main electrode connecting element and a heat sink, the first main electrode connecting element making thermal and electrical contact with the side of the first base plate facing away from the first main electrode side, and the heat sink making thermal contact with the side of the first main electrode connecting element facing away from the first main electrode side, and
a second cooling device which makes thermal contact with the side of the second base plate facing away from the second main electrode.side, wherein the power semiconductor module has a housing in which at least one semiconductor chip and the first and second cooling device are located and wherein the heat sink of the first cooling device is supported against the housing.
2. Power semiconductor module as claimed in claim 1, wherein the first main electrode connecting element is electrically insulated relative to the housing.
3. Power semiconductor module as claimed in claim 1, wherein the heat sink of the first cooling device is electrically insulated relative to the housing.
4. Power semiconductor module as claimed in claim 2, wherein the heat sink of the first cooling device makes electrical contact with the first main electrode connecting element.
5. Power semiconductor module as claimed in claim 1, wherein the heat sink of the first cooling device is electrically insulated relative to the first main electrode connecting element.
6. Power semiconductor module as claimed in claim 1, wherein the heat sink of the first cooling device has cooling ribs.
7. Power semiconductor module as claimed in claim 1, wherein the second cooling device comprises a heat sink which makes thermal contact with the side of the second main electrode connecting element which faces away from the second main electrode side.
8. Power semiconductor module as claimed in claim 7, wherein the heat sink of the second cooling device is supported against the housing.
9. Power semiconductor module as claimed in claim 7, wherein the second main electrode connecting element is electrically insulated relative to the housing.
10. Power semiconductor module as claimed in claim 7, wherein the heat sink of the second cooling device is electrically insulated relative to the housing.
11. Power semiconductor module as claimed in claim 9, wherein the heat sink of the second cooling device makes electrical contact with the second main electrode connecting element.
12. Power semiconductor module as claimed in claim 7, wherein the heat sink of the second cooling device is electrically insulated relative to the second main electrode connecting element.
13. Power semiconductor module as claimed in claim 7, wherein the heat sink has cooling ribs.
14. Power semiconductor module as claimed in claim 1, wherein the power semiconductor module has at least two semiconductor chips and at least two first and two second base plates, at least one semiconductor chip at a time on its main electrode sides making thermal and electrical contact with a first and second base plate, and the respective first main electrode connecting elements making electrical contact with one another or the respective first main electrode connecting elements being made as a common first main electrode connecting element.
15. Power semiconductor module as claimed in claim 14, wherein in the case of a common first main electrode connecting element the common first main electrode connecting element is made as a main electrode terminal board which has tapers between the areas in which at least two semiconductor chips have made contact.
16. Power semiconductor module as claimed in claim 1, wherein the power semiconductor module has at least two semiconductor chips and at least two first and two second base plates, at least one semiconductor chip at a time on its main electrode sides making thermal and electrical contact with a first and second base plate, and the respective second main electrode connecting elements making electrical contact with one another or the respective second main electrode connecting elements being made as a common second main electrode connecting element.
17. Power semiconductor module as claimed in claim 16, wherein in the case of a common second main electrode connecting element the common second main electrode connecting element is made as a main electrode terminal board which has tapers between the areas in which at least two semiconductor chips have made contact.
18. Power semiconductor module as claimed in claim 14, wherein at least one semiconductor chip located between the first and second base plate is connected in parallel to at least one second semiconductor chip which is located between another first and second base plate.
19. Power semiconductor module as claimed in claim 14, wherein at least one semiconductor chip located between the first and second base plate is connected antiparallel to at least one second semiconductor chip located between another first and second base plate.
20. Power semiconductor module as claimed in claim 14, wherein at least one semiconductor chip located between the first and second base plate is series-connected to at least one second semiconductor chip located between another first and second base plate.
21. Power semiconductor module as claimed in claim 1, wherein the housing comprises a first housing part and a second housing part, at least one semiconductor chip being surrounded with its first and its second main electrode side at least partially by one housing part at a time, and wherein between the first cooling device and the first housing part there is a flexible element which can be pressed together.
22. Power semiconductor module as claimed in claim 1, wherein the housing comprises a first housing part and a second housing part, at least one semiconductor chip being surrounded with its first and its second main electrode side at least partially by one housing part at a time, and wherein between the second cooling device and the second housing part there is a flexible element which can be pressed together.
23. Power semiconductor module as claimed in claim 21, wherein the flexible element which can be pressed together is a spring element, especially an elastomer, polymer, plastic metal or gas compression spring element.
24. Power semiconductor module as claimed in claim 1, wherein the housing is made in one part.
25. Power semiconductor module as claimed in claim 1, wherein the housing is made elastic.
26. Power semiconductor module as claimed in claim 1, wherein the housing comprises a first housing part and a second housing part, at least one semiconductor chip being surrounded with its first and its second main electrode side at least partially by one housing part at a time, and wherein the first andor second housing part is made elastic.
27. Power semiconductor module as claimed in claim 1, wherein at least one semiconductor chip has a control terminal which leads away parallel with respect to the first or the second main electrode side of the pertinent semiconductor chip.
28. Power semiconductor module as claimed in claim 27, wherein the power semiconductor module comprises a circuit board, the circuit board is located in the plane of at least one semiconductor chip and the control terminal makes electrical contact with the circuit board.
29. Power semiconductor module as claimed in claim 8, wherein the housing comprises a first housing part and a second housing part, at least one semiconductor chip being surrounded with its first and its second main electrode side at least partially by one housing part at a time, and wherein the cooling ribs are made elastic.
30. Power semiconductor module as claimed in claim 13, wherein the housing comprises a first housing part and a second housing part, at least one semiconductor chip being surrounded with its first and its second main electrode side at least partially by one housing part at a time, mid wherein the cooling ribs are made elastic.
31. Power semiconductor module as claimed in claim 1, wherein the heat sink of the first cooling device and the first main electrode connection element are made in one piece.
32. Power semiconductor module as claimed in claim 7, wherein the heat sink of the second cooling device mid the second main electrode connection element are made in one piece.