All The Claims

1-86. (canceled)
87. An automotive windshield replacement method which comprises:
a) applying an adhesive to an automotive windshield andor an automobile body substrate, said adhesive comprising at least one urethane prepolymer formed from reaction materials comprising:
i) isophorone diisocyanate andor 4,4\u2032-diphenylmethanediisocyanate:
ii) an ethylene oxide-end-capped triol having a weight average molecular weight of about 4500 to about 5000; and
iii) hexanediol adipate

b) contacting the substrates together, within the working time of the adhesive, along at least a portion of the substrate(s) to which the adhesive has been applied; and
c) allowing the adhesive to bond the substrates together.
88. An automotive windshield replacement method according to claim 87, wherein said reaction materials further comprise at least one of a polypropylene glycol and a propylene oxide-end-capped triol.
89. An automotive windshield replacement method according to claim 88, wherein said reaction materials comprise a polypropylene glycol having a weight average molecular weight of about 3500 to about 4500.
90. An automotive windshield replacement method according to claim 87, wherein the adhesive (1) has a tensile strength of 1.0 MPa or greater when measured at a strain rate of 1 metersecond, (2) has a compression force of less than about 0.18 MPa when measured at 5\xb0 C., (3) provides a safe drive-away time according to U.S. Federal Motor Vehicle Safety Standards of one hour or less from application of the adhesive to the windshield andor automobile body, and (4) provides a working time of about 6 to about 15 minutes.
91. An automotive windshield replacement method which comprises:
a) applying an adhesive to an automotive windshield andor an automobile body substrate, said adhesive comprising at least two urethane prepolymers, the first said prepolymer formed from reaction materials comprising:
i) isophorone diisocyanate andor 4,4\u2032-diphenylmethanediisocyanate, and
ii) an ethylene oxide-end-capped triol having a weight average molecular weight of about 4500 to about 5000; and

the second said prepolymer formed from reaction materials comprising:
i) isophorone diisocyanate andor 4,4\u2032-diphenylmethanediisocyanate, and
ii) a thermoplastic polyesterpolyol;

b) contacting the substrates together, within the working time of the adhesive, along at least a portion of the substrate(s) to which the adhesive has been applied; and
c) allowing the adhesive to bond the substrates together.
92. An automotive windshield replacement method according to claim 90 wherein the reaction materials of said second prepolymer comprise hexanediol adipate.
93. An automotive windshield replacement method according to claim 92 wherein the reaction materials of said first prepolymer further comprise at least one of a polypropylene glycol and a propylene oxide-end-capped triol.
94. An automotive windshield replacement method according to claim 93, wherein said reaction materials of said first prepolymer comprise a polypropylene glycol having a weight average molecular weight of about 3500 to about 4500 comprise hexanediol adipate.
95. An automotive windshield replacement method according to claim 93, wherein said reaction materials of said first prepolymer comprise a propylene oxide-end-capped triol.
96. An automotive windshield replacement method according to claim 91 wherein the reaction materials of said first prepolymer further comprise at least one of a polypropylene glycol and a propylene oxide-end-capped triol.
97. An automotive windshield replacement method according to claim 96, wherein said reaction materials of said first prepolymer comprise a polypropylene glycol having a weight average molecular weight of about 3500 to about 4500.comprise hexanediol adipate.
98. An automotive windshield replacement method according to claim 96, wherein said reaction materials of said first prepolymer comprise a propylene oxide-end-capped triol.
99. An automotive windshield replacement method according to claim 91, wherein the adhesive (1) has a tensile strength of 1.0 MPa or greater when measured at a strain rate of 1 metersecond, (2) has a compression force of less than about 0.18 MPa when measured at 5\xb0 C., (3) provides a safe drive-away time according to U.S. Federal Motor Vehicle Safety Standards of one hour or less from application of the adhesive to the windshield andor automobile body, and (4) provides a working time of about 6 to about 15 minutes.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A reciprocating saw comprising:
a housing;
a rotary motor positioned inside the housing;
the housing comprising a first housing portion including a handle portion with a power switch for controlling the rotary motor, and a second housing portion rotatably mounted to and rotatable relative to the first housing portion about a first axis of rotation;
at least one of the first housing portion or the second housing portion having a radial groove formed thereon, the radial groove being centered substantially on the first axis of rotation, the other of the first housing portion or the second housing portion having a projection formed thereon engaging with the radial groove, the radial groove and the projection acting to axially lock the first housing portion relative to the second housing portion;
a reciprocating mechanism driven by the rotary motor, the reciprocating mechanism converting rotary motion of the rotary motor into reciprocating motion;
a reciprocating shaft having a reciprocating motion relative to the second housing portion, the reciprocating motion being driven by the reciprocating mechanism and defining a reciprocating motion axis, the first axis of rotation being substantially parallel to the reciprocating motion axis, the reciprocating shaft comprising:
a first end extending from the second housing portion, a blade holder capable of holding a saw blade mounted on the first end; and
a second end inside the housing and connected to the reciprocating mechanism;

wherein the rotation of the second housing portion causes the blade holder to rotate in unison therewith; and
wherein the first housing portion comprises a stationary housing portion, and a rotatable housing portion rotatably mounted to the stationary housing portion to rotate about a second axis of rotation substantially normal to the first axis of rotation.
2. The reciprocating saw of claim 1 wherein the electric motor is mounted to the first housing portion and rotates relative to the second housing portion in unison with the first housing portion.
3. The reciprocating saw of claim 1 further comprising:
an adjustable shoe mounted to the second housing portion, the mounted position of the adjustable shoe relative to the second housing portion being adjustable in a direction substantially parallel to the reciprocating motion axis.
4. The reciprocating saw of claim 3 wherein the mounted position of the adjustable shoe can be adjusted without the use of any tool.
5. A reciprocating saw comprising:
a first housing having a handle portion and a motor portion for mounting a rotary electric motor;
a second housing rotationally mounted to the first housing;
a third housing rotationally mounted to the second housing;
a reciprocating shaft extending out from the third housing, the reciprocating shaft having a reciprocating motion defining a reciprocating motion axis; wherein
the second housing is rotationally mounted to the first housing about a first axis of rotation substantially perpendicular to the reciprocating motion axis; and the third housing is rotationally mounted to the second housing about a second axis of rotation substantially parallel to the reciprocating motion axis.
6. The reciprocating saw of claim 5 wherein the third housing rotates endlessly in either direction about the second axis of rotation.
7. The reciprocating saw of claim 5 further comprising:
a radial flange centered on the second axis of rotation formed on one of the second housing or third housing and extending at least part way around the second axis of rotation;
a locking piece detachably mounted to the other of the second housing or third housing; and
wherein the locking piece engages the radial flange thereby blocking appreciable axial movement of the third housing away from the second housing.
8. The reciprocating saw of claim 5 wherein the second housing is formed substantially of aluminum through a die casting process.
9. The reciprocating saw of claim 5 wherein the third housing is formed substantially of aluminum through a die casting process.
10. The reciprocating saw of claim 5 wherein the second housing and the third housing are each formed substantially of aluminum through a die casting process.
11. The reciprocating saw of claim 5 further comprising:
a first boot mounted to the second housing;
a second boot mounted to the third housing;
wherein the first boot and the second boot are formed of an electrically insulating material.
12. The reciprocating saw of claim 11 wherein the first and the second boot are formed from thermoplastic elastomer.
13. The reciprocating saw of claim 11 wherein the first boot completely surrounds the exterior of the second housing and the second boot completely surrounds the exterior of the third housing thereby preventing a user’s hand from directly contacting the second or third housing.
14. A method of fastening first and second housing portions of a power tool where the first and second housing portions rotate relative to one another, the method comprising:
assembling the first and second housing portions together so that bearing surfaces formed on each are engaged with one another; and
mounting one or more detachable locking pieces onto one of the first or second housing portions so that the locking pieces engage a surface formed on the other of the first or second housing portions thereby permitting relative rotational movement between the first and second housing portions about an axis of rotation and blocking relative axial movement of the first housing portion away from the second housing portion
wherein mounting one or more locking pieces onto one of the first or second housing portions further comprises pushing the locking pieces into an interference fit with the one of the first or second housing portions.
15. The method of claim 14 wherein:
the first housing portion is a portion of a housing of a reciprocating saw comprising a handle portion and at least partially enclosing a motor for driving the reciprocating saw;
the second housing portion is a portion of a housing of a reciprocating saw at least partially enclosing a reciprocating shaft which defines a reciprocating motion axis; and
the axis of rotation is generally perpendicular to the reciprocating motion axis of the reciprocating shaft.
16. The method of claim 14 wherein:
the first housing portion is a portion of a housing of a reciprocating saw comprising a handle portion and at least partially enclosing a motor for driving the reciprocating saw;
the second housing portion is a portion of a housing of a reciprocating saw at least partially enclosing a reciprocating shaft which defines a reciprocating motion axis; and
the axis of rotation is generally parallel to the reciprocating motion axis of the reciprocating shaft.
17. A method of fastening first and second housing portions of a power tool where the first and second housing portions rotate relative to one another, the method comprising:
assembling the first and second housing portions together so that bearing surfaces formed on each are engaged with one another; and
mounting one or more detachable locking pieces onto one of the first or second housing portions so that the locking pieces engage a surface formed on the other of the first or second housing portions thereby permitting relative rotational movement between the first and second housing portions about an axis of rotation and blocking relative axial movement of the first housing portion away from the second housing portion;
wherein the one or more locking pieces comprise one or more pins.
18. The method of claim 17 wherein mounting one or more locking pieces onto one of the first or second housing portions further comprises:
positioning at least one O-ring around each of the one or more pins; and
positioning each of the one or more pins with an attached O-ring into a respective bore formed in the one of the first or second housing portions so that each O-ring is interposed between the respective pin and bore thereby aiding to retain the position of the pin in the bore.
19. The method of claim 18 wherein the one or more pins comprise a first pin and a second pin.
20. The method of claim 19 wherein:
the first housing portion is a portion of a housing of a reciprocating saw comprising a handle portion and at least partially enclosing a motor for driving the reciprocating saw;
the second housing portion is a portion of a housing of a reciprocating saw at least partially enclosing a reciprocating shaft which defines a reciprocating motion axis; and
the axis of rotation is generally perpendicular to the reciprocating motion axis of the reciprocating shaft.
21. The method of claim 19 wherein:
the first housing portion is a portion of a housing of a reciprocating saw comprising a handle portion and at least partially enclosing a motor for driving the reciprocating saw;
the second housing portion is a portion of a housing of a reciprocating saw at least partially enclosing a reciprocating shaft which defines a reciprocating motion axis; and
the axis of rotation is generally parallel to the reciprocating motion axis of the reciprocating shaft.

1. A manufacturing method for a semiconductor device comprising the steps of:
(a) preparing a lead frame including a die pad that contains a chip mounting surface, a plurality of suspension leads that support the die pad, a plurality of first leads that are mounted at the periphery of the die pad, a plurality of second leads whose lengths are shorter than the respective first leads, and a common lead that is mounted between the die pad and the second leads as seen from a plan view;
(b) mounting a semiconductor chip formed with a plurality of electrode pads over the main surface over the chip mounting surface of the die pad;
(c) coupling electrically by way of a plurality of wires, each of the electrode pads of the semiconductor chip, the common lead, and the first leads and the second leads;
(d) sealing the common lead, the semiconductor chip, and the wires with resin so that a portion of each of the first and second leads and the common lead are exposed from the sealing body; and
(e) cutting a plurality of outer leads that are exposed from the sealing body from the lead frame;
wherein, in the step (c):
a first wire among the wires electrically couples the electrode pad and the first lead,
a second wire among the wires passes over the common lead and electrically couples the electrode pad and any lead of the second leads,
a third wire among the wires passes over the common lead and also electrically couples the electrode pad and any of the another second leads at a loop height higher than the second wire, and
the second wire is mounted closer than the third wire in the common lead region corresponding to the common lead, relative to the standard suspension lead at the position matching the gate for supplying resin during the resin sealing among the suspension leads.
2. The manufacturing method for a semiconductor device according to claim 1,
wherein, in the step (c):
a fourth wire having a loop height lower than the second wire is mounted near the second wire on the standard suspension lead side of the second wire in the common lead region in order to electrically couple to a common lead.
3. The manufacturing method for a semiconductor device according to claim 2,
wherein, in the step (c):
the electrode pad for the semiconductor chip where no wire is coupled is mounted on the standard suspension lead side of the fourth wire in the common lead region.
4. The manufacturing method for a semiconductor device according to claim 3,
wherein, in the step (c):
the second wire is electrically coupled to the second lead at a position on the end nearest the standard suspension lead in the common lead region.
5. The manufacturing method for a semiconductor device according to claim 1,
wherein, in the step (c):
a fourth wire is mounted adjacent to the second wire in the common lead region, and also nearer the standard suspension lead than the second wire by setting a loop height of the fourth wire lower than the second wire, and the fourth wire is electrically coupled to the common lead.
6. The manufacturing method for a semiconductor device according to claim 2,
wherein, in the step (c):
a fifth wire having a loop height lower than the fourth wire is electrically coupled to the die pad.
7. The manufacturing method for a semiconductor device according to claim 1,
wherein the wire includes material whose main constituent is copper.
8. A semiconductor device comprising:
a die pad that includes a chip mounting surface;
a plurality of first leads that are mounted at the periphery of the die pad;
a plurality of second leads whose length is shorter than the respective first leads;
a common lead that is mounted between the die pad and the second leads as seen from a plan view;
a semiconductor chip that is mounted over the chip mounting surface of the die pad, and where a plurality of electrode pads are formed over the main surface of the chip;
a plurality of first wires that electrically couple the electrode pads of the semiconductor chip and the first leads;
a plurality of second wires or third wires that electrically couple the electrode pads of the semiconductor chip and the second leads;
a sealing body that seals a portion of the die pad, the common lead, the semiconductor chip, and the first, second, and third wires; and
a plurality of outer leads that are exposed from the sealing body,
wherein the second and the third wire are respectively formed to pass over the common lead,
wherein the loop height of the second wire is lower than the loop height of the third wire, and
wherein the heights of the common lead and the tips at the die pad side of each of the second leads, are the same.
9. The semiconductor device according to claim 8,
wherein the first, the second, and the third wire include a material whose main constituent is copper.
10. The semiconductor device according to claim 9,
wherein the rear side of the die pad is exposed at the rear side of the sealing body.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A plasma display panel, comprising:
a scan electrode and a sustain electrode parallel with each other on a front substrate;
a data electrode on a back substrate positioned orthogonally to the scan electrode and the sustain electrode, the back substrate facing the front substrate with a discharge space therebetween;
and
a first discharge space and a second discharge space between the front substrate and the back substrate partitioned apart by a barrier rib, wherein
a main discharge cell for performing a discharge with the scan electrode, the sustain electrode and the data electrode is in the first discharge space, a dielectric layer is on the back substrate in the second discharge space covering the data electrode, a priming electrode, independent of the data electrode, is on the dielectric layer so that the priming electrode is parallel to the scan electrode and the sustain electrode, and a priming discharge cell for performing a discharge with the scan electrode and the priming electrode is in the second discharge space, with different voltage signals applied to the priming electrode and the data electrode.
2. The plasma display panel according to claim 1, wherein
the barrier rib is a longitudinal rib part extending in the direction orthogonal to the scan electrode and the sustain electrode, and a lateral rib part forming a gap part of continuous groove shape parallel with the scan electrode and the sustain electrode, and
the gap part forms the second discharge space.
3. A method for manufacturing a plasma display panel, comprising:
forming a main discharge cell in a first discharge space, the main discharge cell comprising:
a scan electrode and a sustain electrode parallel with each other on a front substrate;
a data electrode on a back substrate positioned orthogonally to the scan electrode and the sustain electrode, the back substrate facing the front substrate with a discharge space therebetween; and
the first discharge space and a second discharge space are between the front substrate and the back substrate partitioned apart by a barrier rib, and the main discharge cell for performing a discharge with the scan electrode, the sustain electrode and the data electrode;

forming a dielectric layer on the back substrate in the second discharge space covering the data electrode;
forming a priming electrode, independent of the data electrode, on the dielectric layer parallel to the scan electrode and the sustain electrode, with different voltage signals applied to the priming electrode and the data electrode; and
forming a priming discharge cell in the second discharge space, the priming discharge cell performing a discharge with the priming electrode and the scan electrode,
forming the second discharge space comprising:
forming the dielectric layer continuously in a longitudinal direction orthogonal at least to the data electrode; and
forming the priming electrode continuous on the dielectric layer.
4. The method for manufacturing the plasma display panel according to claim 3, wherein
forming the dielectric layer comprises filling dielectric paste into the second discharge space by discharging the dielectric paste at least through a nozzle.
5. The method for manufacturing the plasma display panel according to claim 4 further comprising continuously filling the dielectric layer after the barrier rib is patterned on the back substrate.
6. The method for manufacturing the plasma display panel according to claim 5, wherein
the barrier rib and the dielectric layer concurrently undergo firing and solidification.
7. The method for manufacturing the plasma display panel according to claim 3, wherein
forming the priming electrode comprises filling electrode material paste into the second discharge space by discharging the electrode material paste at least through a nozzle.