All The Claims

1-14. (canceled)
15. A turbine disc for a turbine, comprising
a first protrusion and a second protrusion,
wherein the first protrusion and the second protrusion are formed in such a way that a balancing weight is coupleable between the first protrusion and the second protrusion, and
wherein the first protrusion comprises a sealing section that is capable of sealing a fluid passage between the turbine disc and a further turbine part of the turbine.
16. The turbine disc of claim 15, further comprising
a first surface and a second surface,
wherein the first protrusion and the second protrusion are formed on at least one of the first surface or second surface.
17. The turbine disc of claim 16,
wherein the turbine disc is coupleable to the turbine in such a way that the first surface and the second surface are opposed surfaces in an axial direction of a shaft of the turbine.
18. The turbine disc of claim 17,
wherein the turbine disc is coupleable to the turbine in such a way that the first surface is orientated upstream with respect to a fluid flow of the turbine and the second surface is orientated downstream with respect to the fluid flow.
19. The turbine disc of claim 15,
wherein the sealing section comprises a single seal lip.
20. The turbine disc of claim 15,
wherein the sealing section comprises a labyrinth seal.
21. The turbine disc of claim 15,
wherein the first protrusion and the second protrusion are formed andor arranged in such a way that a recess between the first protrusion and the second protrusion is formed, and
wherein the recess is formed in such a way that the recess proceeds in a circumferential direction with respect to a shaft of the turbine, when the turbine disc is coupled to the turbine.
22. The turbine disc of claim 21,
wherein the recess is formed in such a way that the recess and the balancing weight are coupleable by a dovetail connection.
23. The turbine disc of claim 15,
wherein the first protrusion is located at a first position and the second protrusion is located at a second position,
wherein a first distance between the first position and a centre of the turbine disc is larger than a second distance between the second position and the centre of the turbine disc.
24. The turbine disc of claim 15,
wherein the first protrusion and the second protrusion are detachably mounted on the turbine disc.
25. The turbine disc of claim 15,
wherein the first protrusion and the second protrusion are integrally formed with the turbine disc.
26. The turbine disc of claim 16,
wherein the second surface is free of a balancing weight arrangement and a further sealing section.
27. A turbine, comprising:
a turbine part, and
a turbine disc according to claim 15,
wherein the turbine disc is coupleable to the turbine part in such a way that a sealing section of a first protrusion of the turbine disc seals a fluid passage between the turbine disc and the turbine part.
28. The turbine of claim 27,
wherein the turbine is a gas turbine.
29. A method of producing a turbine disc for a turbine, the method comprising:
forming a first protrusion and a second protrusion onto the turbine disc,
wherein the first protrusion and the second protrusion are formed in such a way that a balancing weight is coupleable between the first protrusion and the second protrusion, and
wherein the first protrusion comprises a sealing section that is capable of sealing a fluid passage between the turbine disc and a further turbine part of the turbine.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of fabricating an integrated circuit, the method comprising:
forming a top surface of a first region of the integrated circuit at a higher level than a top surface of a second region of the integrated circuit;
depositing a filler material over the top surface of the first region and over the top surface of the second region;
depositing a protective material over the filler; and
planarizing the filler material by performing a multi-part etch process, a first part of the multi-part etch process including an etch chemistry selective for the protective material, and a second part of the multi-part etch process including an etch chemistry selective for the filler material, wherein an etch rate of the protective material is higher than an etch rate of the filler material during the first part and wherein an etch rate of the filler material is higher than an etch rate of the protective material during the second part.
2. The method of claim 1, wherein the first region comprises lines separated by spaces, the filler material substantially filling the spaces.
3. The method of claim 1, wherein the protective material is thinner over the first region than over the second region.
4. The method of claim 3, wherein the protective material comprises a spin-on material.
5. The method of claim 3, further comprising removing substantially all of the protective material over the first region during the first part of the multi-part etch process, wherein at least a portion of the protective material remains over the second region upon completion of the first part of the multi-part etch process.
6. The method of claim 1, further comprising removing substantially all of the protective material during the second part of the multi-part etch process.
7. The method of claim 6, further comprising removing a portion of the first region during the second part of the multi-part etch process, wherein an etch rate for removing the first region during the second part of the multi-part etch process is substantially the same as an etch rate for removing the filler material during the second part of the multi-part etch process.
8. The method of claim 1, wherein the first region comprises pitch multiplied features, wherein the top surface of the first region comprises tops of the pitch multiplied features.
9. The method of claim 1, further comprising performing a chemical mechanical planarization subsequent to the second etch part of the multi-part etch process.
10. The method of claim 1, further comprising forming pitch multiplied features over the planarized filler material.
11. A method for fabricating an integrated circuit, the method comprising:
forming a top surface of a first region of the integrated circuit at a higher level than a top surface of a second region of the integrated circuit;
depositing a first material over the top surface of the first region and over the top surface of the second region;
depositing a second material over the first material, the second material having a greater thickness over the second region than over the first region; and
subjecting the first and second materials to a planarization process, comprising:
performing a first etch, wherein an etch rate for removing the second material during the first etch is higher than an etch rate for removing the first material during the first etch, and wherein at least a portion of the second material remains over the second region upon completion of the first etch.
12. The method of claim 11, wherein the planarization process further comprises performing a second etch, an etch rate for removing the second material during the second etch being lower than an etch rate for removing the first material during the second etch.
13. The method of claim 12, further comprising removing substantially all of the second material during the second etch, wherein a top surface of the first region upon completion of the second etch and a top surface of the first material over the second region upon completion of the second etch have a substantially same height.
14. The method of claim 13, further comprising removing a portion of the first region during the second etch, wherein an etch rate for removing the portion of the first region during the second etch is substantially the same as the etch rate for removing the first material during the second etch.
15. The method of claim 12, further comprising performing a chemical mechanical planarization subsequent to the second etch.
16. The method of claim 11, further comprising removing substantially all of the second material over the first region during the first etch.
17. The method of claim 11, wherein the second material comprises a spin-on material.
18. The method of claim 11, wherein the first region comprises lines in a memory array, the lines being separated by spaces.
19. The method of claim 18, wherein the first material comprises a filler material substantially filling the spaces between the lines.
20. The method of claim 11, wherein the first region comprises pitch multiplied features, wherein the top surface of the first region comprises tops of the pitch multiplied features.

1. An endoscope sheath comprising:
a relatively inelastic sheath body, the relatively inelastic sheath body having a proximal sheath end longitudinally separated from a distal sheath end and defining a sheath lumen,
a scope aperture located at the proximal sheath end in fluid communication with the sheath lumen and configured to admit an elongate endoscope body into the sheath lumen,
a sheath tip located at the distal sheath end, at least a portion of the sheath tip being configured to permit energy transmission therethrough and being located longitudinally adjacent to an endoscope lens when the elongate endoscope body is located within the sheath lumen,
an evacuation fitting in fluid communication with the sheath lumen and configured for selective removal of fluid from the sheath lumen, and
an elongate secondary tube having a proximal secondary tube end longitudinally separated from a distal secondary tube end and defining a secondary lumen, at least a portion of the secondary lumen extending substantially parallel to the sheath lumen.
2. The endoscope sheath of claim 1, wherein the evacuation fitting includes a valve having a pilot balloon coupled thereto.
3. The endoscope sheath of claim 1, wherein the sheath body is formed from a first material and the sheath tip is formed from a second material.
4. The endoscope sheath of claim 3, wherein the first material is polytetrafiuoroethylene.
5. The endoscope sheath of claim 4, wherein the second material is silicone rubber.
6. The endoscope sheath of claim 3, wherein the elongate secondary tube is formed from the first material.
7. The endoscope sheath of claim 1, wherein the elongate secondary tube is secured to the relatively inelastic sheath body.
8. The endoscope sheath of claim 1, wherein the distal secondary tube end is positioned adjacent to the distal sheath end and has an aperture in fluid communication with the secondary lumen.
9. The endoscope sheath of claim 1, wherein the secondary tube is sized to receive a second medical device.
10. The endoscope sheath of claim 1, wherein a handle fitting is positioned at the proximal sheath end, the handle fitting being configured to create a fluidtight seal between elongate endoscope body and the endoscope sheath.
11. The endoscope sheath of claim 1 , further comprising an elongate third tube having a proximal third tube end longitudinally separated from a distal third tube end and defining a third lumen, at least a portion of the third lumen extending substantially parallel to the sheath lumen.
12. A method of using an endoscope sheath, comprising:
inserting an endoscope body into a lumen of an elongate tubular body of the endoscope sheath,
creating a fluidtight seal between the endoscope body and the elongate tubular body, and
removing fluid from between the endoscope body and the elongate tubular body to bring the elongate tubular body into contact with the endoscope body.
13. The method of claim 12, wherein the elongate tubular body of the endoscope sheath is relatively inelastic.
14. The method of claim 13, wherein removing fluid from between the endoscope body and the elongate tubular body includes creating negative pressure within the lumen of the elongate tubular body.
15. The method of claim 12, wherein inserting the endoscope body into the lumen of the elongate tubular body includes placing a distal end of the endoscope body in contact with the distal end of the elongate tubular body.
16. The method of claim 12, further comprising applying a lubricant to one of the endoscope body and the elongate tubular body.
17. A medical device sheath comprising:
a relatively inelastic body, the relatively inelastic body having a proximal end longitudinally separated from a distal end and defining a first lumen,
an aperture located at the proximal end in fluid communication with the lumen and configured to admit a medical device body into the first lumen,
a sheath tip located at the distal end, the sheath tip being configured to permit energy transmission therethrough and being located longitudinally adjacent to a medical device end when the medical device body is located within the first lumen, and
an elongate secondary tube defining a secondary lumen,
wherein a plurality of apertures are defined at the distal end of the relatively inelastic body, and at least one of the apertures is in fluid communication with the secondary lumen of the elongate secondary tube.
18. The medical device sheath of claim 17, further comprising an evacuation fitting in fluid communication with the first lumen and configured for selective removal of fluid from the first lumen.
19. The medical device sheath of claim 18, the evacuation fitting including a valve having a pilot balloon coupled thereto in fluid communication with the first lumen.
20. The medical device sheath of claim 17, wherein the plurality of apertures are arranged in a circular pattern.
21. An endoscope sheath comprising:
a relatively inelastic sheath body, the relatively inelastic sheath body having a proximal sheath end longitudinally separated from a distal sheath end and defining a sheath lumen;
a scope aperture located at the proximal sheath end in fluid communication with the sheath lumen and configured to admit an elongate endoscope body into the sheath lumen;
a sheath tip located at the distal sheath end, at least a portion of the sheath tip being configured to permit energy transmission therethrough and being located longitudinally adjacent to an endoscope lens when the elongate endoscope body is located within the sheath lumen; and
an evacuation fitting in fluid communication with the sheath lumen and configured for selective removal of fluid from the sheath lumen.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for reducing flicker, comprising:
generating an adjusted rectified voltage in response to a TRIAC signal from a TRIAC dimmer;
generating a switching current in response to the adjusted rectified voltage being greater than a first reference voltage;
decreasing the switching current in response to the adjusted rectified voltage becoming less than the first reference voltage;
generating a first control signal in response to the adjusted rectified voltage becoming less than the first reference voltage;
decreasing a second reference voltage in response to the first control signal; and
turning off the TRIAC dimmer in response to decreasing the switching current.
2. The method of claim 1, wherein decreasing the switching current in response to the adjusted rectified voltage includes decreasing the switching current to zero.
3. The method of claim 1, wherein generating a switching current in response to the adjusted rectified voltage being greater than a first reference voltage comprises:
asserting a pulse control signal in response to the adjusted rectified voltage being greater than the first reference voltage; and
generating a switch control signal at a control terminal of a switching device in response to asserting the pulse control signal.
4. The method of claim 3, further including generating a pulse train in response to asserting the pulse control signal and generating the switch control signal at the control terminal of the switching device in response to the pulse train.
5. The method of claim 3, wherein decreasing the switching current in response to the adjusted rectified voltage becoming equal to the first reference voltage includes de-asserting the pulse control signal and turning off the switching device in response to de-asserting the pulse control signal.
6. The method of claim 1, further including generating a load current in response to the adjusted rectified voltage becoming less than a second reference voltage.
7. The method of claim 6, wherein the second reference voltage is less than the first reference voltage.
8. The method of claim 1, further including generating a load current after turning off the TRIAC dimmer.
9. A method for mitigating flicker, comprising:
generating a rectified voltage in response to a TRIAC signal from a TRIAC;
generating an adjusted rectified voltage from the rectified voltage;
generating a switching signal in response to comparing the adjusted rectified voltage with a first predetermined voltage;
decreasing the switching current in response to the adjusted rectified voltage becoming less than the first reference voltage;
generating a first control signal in response to the adjusted rectified voltage becoming less than the first reference voltage;
decreasing a second reference voltage in response to the first control signal; and
turning off the TRIAC in response to the rectified voltage reaching a first predetermined voltage.
10. The method of claim 9, wherein generating the switching signal comprises generating one of a pulse train or a logic low voltage.
11. The method of claim 10, further including decreasing a TRIAC current in response to the switching signal being a logic low voltage.
12. The method of claim 11, wherein turning off the TRIAC in response to the decreasing the rectified voltage reaching a predetermined voltage includes turning off the TRIAC in response to decreasing the TRIAC current.
13. The method of claim 9, further including activating a switching circuit in response to the rectified voltage reaching a second predetermined voltage, the second predetermined voltage less than the first predetermined voltage.