1. An etching device for removing stubs of plated through holes of a substrate, the device comprising:
a lower plate defining a plurality of first through holes, the first through holes running through two opposite surfaces of the lower plate;
an upper plate configured for supporting the substrate, the upper plate being above the lower plate and defining a plurality of second through holes aligned with the respective first through holes, the first through holes running through two opposite surfaces of the lower plate, a diameter of the second through hole being larger than that of the first through hole;
a connecting mechanism connecting the upper plate and the lower plate together; and
a spraying mechanism comprising a pump and a plurality of spray tubes, the pump being configured for supplying an etchant to the spray tubes, a diameter of the spray tube being less than that of the second through hole, the spray tubes each extending through a corresponding first through hole and a corresponding second through hole, each of the spray tubes including a protruding portion protruding beyond the upper plate and configured for extending into the stub, the protruding portion defining at least one spraying opening, the at least one spraying opening being configured for spraying the etchant to the stub of the substrate.
2. The etching device of claim 1, wherein the diameter of the second through hole is in the range from 108% to 115% of the diameter of the first through hole.
3. The etching device of claim 1, wherein a diameter of the spray tube is equal to or larger than that of the first through hole.
4. The etching device of claim 1, wherein the spray tubes seal the respective first through holes.
5. The etching device of claim 1, wherein the lower plate includes a main body and an annular protrusion extending along a periphery of the main body, the main body comprising a first supporting surface, a first back surface, and at least one drainage hole exposed at both of the first supporting and the first back surfaces, the annular protrusion extending from the first supporting surface toward the upper plate, a retaining space being bounded by the annular protrusion and the first supporting surface, the at least one drainage hole being in communication with the retaining space.
6. The etching device of claim 5, wherein the upper plate comprises a second supporting surface and a second back surface opposite to the main body, the upper plate defines a number of threaded holes exposed at both of the second supporting and the second back surfaces, the connecting mechanism comprises a number of fasteners and a number of threaded retainers, the fasteners each are fixed on the main body and extend through a corresponding threaded hole, there are two threaded retainers screwed on each of the fasteners, one in contact with the second supporting surface, the other in contact with the second back surface.
7. The etching device of claim 5, wherein the connecting mechanism comprises at least one adhesive tape positioned between the annular protrusion and the periphery of the upper plate.
8. The etching device of claim 1, wherein the protruding portion comprises a side wall and a top wall connected with the side wall, the at least one spraying opening is defined in the side wall adjacent to the top wall.
9. The etching device of claim 8, wherein the at least one spraying opening comprises a number of spraying openings equiangularly arranged about a central body axis of the protruding portion.
10. The etching device of claim 8, wherein the at least one spraying opening comprises two spraying openings opposite to each other.
11. The etching device of claim 8, wherein the at least one spraying opening comprises a C-shaped spraying opening.
12. An etching device for removing stubs of plated through holes of a substrate, the device comprising:
a lower plate comprising a main body and an annular protrusion connected with a peripheral portion of the main body, the main body defining a plurality of first through holes, the first through holes running through two opposite surfaces of the main body;
an upper plate configured for supporting the substrate, the upper plate being above the main body and defining a plurality of second through holes aligned with the respective first through holes, the first through holes running through two opposite surfaces of the lower plate, a diameter of the second through hole being larger than that of the first through hole;
a connecting mechanism connecting the upper plate and the lower plate together; and
a spraying mechanism comprising a pump and a plurality of spray tubes, the pump being configured for supplying an etchant to the spray tubes, a diameter of the spray tube being less than that of the second through hole, the spray tubes each extending through a corresponding first through hole and a corresponding second through hole, the spray tubes sealing the respective first through holes, each of the spray tubes including a protruding portion protruding beyond the upper plate and configured for extending into the stub, the protruding portion defining at least one spraying opening, the at least one spraying opening being configured for spraying the etchant to the stub of the substrate.
13. The etching device of claim 12, wherein a diameter of the spray tube is equal to or larger than that of the first through hole.
14. The etching device of claim 12, wherein the spray tubes seal the respective first through holes.
15. The etching device of claim 12, wherein the protruding portion comprises a side wall and a top wall connected with the side wall, the at least one spraying opening is defined in the side wall adjacent to the top wall.
16. The etching device of claim 15, wherein the at least one spraying opening comprises a number of spraying openings equiangularly arranged about a central body axis of the protruding portion.
17. The etching device of claim 15, wherein the at least one spraying opening comprises two spraying openings opposite to each other.
18. The etching device of claim 15, wherein the at least one spraying opening comprises a C-shaped spraying opening.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of using a treatment balloon comprising:
positioning an immobilizing balloon proximally to a treatment region, wherein when inflated, said immobilizing balloon maintains its position;
inflating said immobilizing balloon;
positioning said treatment balloon in a treatment region wherein said step of positioning is performed relative to said immobilizing balloon;
inflating said treatment balloon; and
rotating said treatment balloon relative to said immobilizing balloon.
2. The method of claim 1 wherein said immobilizing balloon has protrusions designed to enhance the ability of said immobilizing balloon to maintain its position.
3. The method of claim 1 wherein said treatment balloon imparts a radial force.
4. The method of claim 3 wherein said radial force is used in placing a stent.
5. The method of claim 3 wherein said radial force is used in angioplasty.
6. The method of claim 1 wherein said treatment balloon imparts an axial force.
7. The method of claim 6 wherein said axial force is not applied in a retrograde direction.
8. The method of claim 1 further comprising:
positioning an occlusion balloon; and
inflating said occlusion balloon.
9. The method of claim 1 wherein said treatment balloon has protrusions designed to increase the capability of said treatment balloon to shear away an occlusion.
10. The method of claim 1 wherein said occlusion balloon occludes a first end of said treatment region, and wherein said immobilizing balloon occludes a second end of said treatment region.
11. A catheter system comprising:
an immobilizing balloon, wherein when inflated, said immobilizing balloon maintains its position;
an immobilizing balloon positioning system configured to position said immobilizing balloon proximally to a treatment region;
a first inflation system configured to inflate said immobilizing balloon;
a treatment balloon;
a treatment balloon positioning system configured to position said treatment balloon, relative to said immobilizing balloon, in a treatment region; and
a second inflation system configured to inflate said treatment balloon, wherein said treatment balloon is configured to rotate relative to said immobilizing balloon.
12. The catheter system of claim 11 wherein said immobilizing balloon has protrusions designed to enhance the ability of said immobilizing balloon to maintain its position.
13. The catheter system of claim 11 wherein said treatment balloon is configured to impart a radial force.
14. The catheter system of claim 13 wherein said radial force is used in placing a stent.
15. The catheter system of claim 13 wherein said radial force is used in angioplasty.
16. The catheter system of claim 11 wherein said treatment balloon is configured to impart an axial force.
17. The catheter system of claim 16 wherein said axial force is not applied in a retrograde direction.
18. The catheter system of claim 11 further comprising:
an occlusion balloon;
an occlusion balloon positioning system configured to position said occlusion balloon such that said treatment balloon is between said immobilizing balloon and said occlusion balloon; and
a third inflation system configured to inflate said occlusion balloon.
19. The catheter system of claim 11 wherein said treatment balloon has protrusions designed to increase the capability of said treatment balloon to shear away an occlusion.
20. The catheter system of claim 18 wherein said occlusion balloon is adapted to occlude a first end of said treatment region, and wherein said immobilizing balloon is adapted to occlude a second end of said treatment region.