All The Claims

1. An electronic circuit including a first semiconductor device and a second semiconductor device on a mounting substrate, wherein
the first semiconductor device includes external terminals of a plurality of bits,
the second semiconductor device includes external terminals of a plurality of bits, a semiconductor chip having a plurality of connecting electrodes, and assembling lines which connect the external terminals of a plurality of bits and the plurality of connecting electrodes of the semiconductor chip of the second semiconductor device,
the mounting substrate includes a plurality of mounting substrate lines which are connected in common with external terminals of a plurality of bits of the first semiconductor device and external terminals of a plurality of bits of the second semiconductor device for every bit,
the mounting substrate lines have lengths thereof from the external terminals of the first semiconductor device to the external terminals of the second semiconductor device made unequal for respective bits,
the assembling lines of the second semiconductor device have made lengths thereof unequal for respective bits, and
the unequal lengths of the mounting substrate lines have a relationship which offsets the unequal lengths of the assembling lines.
2. An electronic circuit according to claim 1, wherein the first semiconductor device is formed of a synchronous memory, the second semiconductor device is formed of a data processor which is capable of getting access to and controlling the synchronous memory, and the data processor performs parallel inputtingoutputting of access data of a plurality of bits between the data processor and the synchronous memory via the mounting substrate lines.
3. An electronic circuit according to claim 2, wherein the external terminal of a plurality of bits of the synchronous memory has data inputtingoutputting timing thereof synchronized with the clock signal, and the data processor acquires data outputted from the synchronous memory in synchronism with the clock signal which is outputted from the synchronous memory.
4. An electronic circuit according to claim 3, wherein the second semiconductor device includes the package structure in which a large number of solder ball electrodes are annularly formed on the package substrate in a plurality of rows as external terminals, wherein unequal lengths of the assembling lines in the inside of the package substrate have the difference integer times as large as a pitch in the row direction of the solder ball electrode.
5. An electronic circuit according to claim 1, wherein the first semiconductor device has lengths of the assembling lines thereof from the external terminals thereof to connection electrodes of the semiconductor chip made equal to each other.
6. An electronic circuit including a first semiconductor device and a second semiconductor device on a mounting substrate, wherein
the first semiconductor device includes external terminals of a plurality of bits,
the second semiconductor device includes external terminals of a plurality of bits, a semiconductor chip having a plurality of connecting electrodes, and assembling lines which connect the external terminals of a plurality of bits and the plurality of connecting electrodes of the semiconductor chip of the second semiconductor device,
the mounting substrate includes a plurality of mounting substrate lines which are connected in common with external terminals of a plurality of bits of the first semiconductor device and external terminals of a plurality of bits of the second semiconductor device for every bit,
the mounting substrate lines have lengths thereof from the external terminals of the first semiconductor device to the external terminals of the second semiconductor device made unequal for respective bits,
the assembling lines of the second semiconductor device have made lengths thereof unequal for respective bits, and
the unequal lengths of the mounting substrate lines have a relationship which offsets the unequal lengths of the assembling lines.
7. A semiconductor device according to claim 6, wherein
the semiconductor chip includes a determination circuit which performs a determination operation using a reference potential supplied from a predetermined pad electrode,
the package substrate includes a first conductive layer which is used for the connection with the pad electrodes of the semiconductor chip, a second conductive layer which is used as a ground plane, a third conductive layer which is used as a power source plane, and a fourth conductive layer which is used for the connection with the mounting substrate, and
the third conductive layer includes a power source plane which is connected with the determination circuit and lines for the reference potential, wherein the lines for the reference potential are arranged in a state that the lines for the reference potential are surrounded by the power source plane.
8. An electronic circuit according to claim 7, wherein
the ground plane and the power source plane include specified regions where via holes or through holes are not formed in a penetrating manner with a width equal to or larger than one pitch of external terminals which are arranged on the semiconductor device.
9. An electronic circuit according to claim 8, wherein the first semiconductor device is constituted of a plurality of semiconductor memory devices, and the second semiconductor device is a semiconductor control device which is capable of getting access to and controlling the semiconductor memory devices, wherein
the mounting substrate includes a power source plane of a terminating power source for terminating lines which connect the semiconductor memory devices and the semiconductor control device by way of terminating resistances,
the semiconductor memory devices are mounted closer to the power source plane of the terminating power source than the semiconductor control device,
to the power source plane of the terminating power source, terminating resistances which are connected with the lines and a plurality of first stabilizing capacities which are arranged close to the terminating resistances are connected in a dispersed manner, and
a second stabilizing capacity which is larger than the first stabilizing capacities is connected to an end portion of the power source plane remote from the supply end which supplies the terminating power source.
10. An electronic circuit according to claim 9, wherein among the lines, the one-way lines having a branch to which a plurality of semiconductor memory devices are connected in common, include lines which have terminating resistances thereof joined to the route having the longer route length starting from the semiconductor control device and lines which have terminating resistances thereof joined to the shorter route in mixture, and
a maximum value of the difference of the route length between the longer route in the one-way line which has the terminating resistance thereof joined to the shorter route and the shorter route is set to a minimum value or less of the difference of the route length between the shorter route in the one-way line which has the terminating resistance thereof joined to the longer route and the longer route.
11. An electronic circuit according to claim 10, wherein
the semiconductor control device includes a semiconductor chip mounted on a package substrate,
the semiconductor chip includes a phase locked loop circuit or a delay locked loop circuit,
the first conductive layer of the package substrate is used for connection with pad electrodes of the semiconductor chip, and
the first conductive layer includes a power source line which supplies a power source to the phase locked loop circuit or the delay locked loop circuit, and clock lines which supply clock signals to the phase locked loop circuit or the delay locked loop circuit, wherein the power source line and the clock line are spaced apart from each other with a distance larger than a minimum distance size of lines in the first conductive layer.
12. An electronic circuit according to claim 11, wherein
the semiconductor chip includes converters of either one or both of a digital analog converter and an analog digital converter,
on the third conductive layer, power source planes for the converters are separated from the power source plane for other circuits, and
on the first conductive layer, signal lines for converters are formed at positions where the signal lines for converters are overlapped to the power source plane for the converters.
13. An electronic circuit according to claim 12, wherein
the digital analogue converter includes a circuit which adds a constant current from the constant current source circuit to an output node using a switch,
the semiconductor chip includes a first analog power source terminal and a first analog ground terminal for the constant current source circuit and a second analog power source terminal and a second analog ground terminal for the switch control circuit respectively in a separated manner,
the first analog ground terminal and the second analog ground terminal are connected to analog grounding lines which are separately formed on the first conductive layer, and the respective analog ground lines are connected to the ground plane of the second conductive layer in common, and
the first analog power source terminal and the second analog power source terminal are separately connected to terminals of the fourth conductive layer from the respectively intrinsic analog power source lines which are formed on the first conductive layer via the respective power source planes.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. Use of optically active polymers of N-acryloyl-S-phenylalanine d-neomenthylamide or of the enantiomer thereof as such, in crosslinked form andor in carrier-bonded form as stationary phases for the chromatographic separation of enantiomers of lactones of the general formula (I)
4
wherein
R represents an organic radical and
X represents CH2CH2 or CHCH:
2. Use of optically active polymers according to claim 1 for the chromatographic separation of enantiomers of a lactone chosen from the group consisting of:
5
3. Use of optically active polymers according to claim 1 for the chromatographic separation of enantiomers of ()-trans-(E)-6-2-(2,6-diisopropyl4-(4-fluorophenyl)-3-methoxymethyl-pyrid-5-yl)-ethenyl-3,4,5,6-tetrahydro-4-hydroxy-2H-pyran-2-one.
4. Use of optically active polymers according to claim 1, characterized in that the optically active polymer is employed in a form bonded to silica gel.
5. Use of optically active polymers according to claim 4, characterized in that the optically active polymer is bonded via the mercapto groups from a correspondingly modified silica gel.
6. Process for the chromatographic separation of enantiomers of lactones of the general formula (I) according to claim 1, characterized in that the enantiomer mixture is separated into the enantiomers by means of an optically active polymer of N-acryloyl-S-phenylalanine d-neomenthylamide or of the enantiomer thereof as the chiral stationary phase, using a suitable mobile phase, the optically active polymer being employed as such, in crosslinked form andor in carrier-bonded form.
7. Process according to claim 6, characterized in that a mixture of toluene and tetrahydrofuran is used as the mobile phase.
8. Process according to claim 6, characterized in that the optically active polymer is employed as the stationary phase in a form bonded to silica gel.

1. Test procedure for use in mass-producing a batch of hoses, one after another, where the hoses comprise respective lengths of elastomeric tubing and respective hollow metal ferrules;
the test procedure is effective to determine, on a hose-by-hose basis, whether the tubing is properly present inside the ferrule, and includes:
pressing a dimple inwards into the metal of the ferrule, in such manner as to make an indentation in the metal;
providing a dimple-force measuring-device, and measuring the force needed to form the dimple, termed the dimple-force;
determining a threshold value for the dimple-force;
making an assessment, in respect of the individual hoses, whether the dimple-force is above or below the threshold; and
accepting those hoses of the batch in respect of which the dimple-force is above the threshold, and rejecting those hoses of the batch in respect of which the dimple-force is below the threshold.
2. As in claim 1, including providing a dimple-pin, and applying the dimple-force to the ferrule by pressing the dimple-pin into the ferrule.
3. As in claim 2, wherein the dimple-pin is right-cylindrical and round-ended.
4. As in claim 2, including:
providing a crimp-press, for crimping the ferrule to an end of the elastomeric tubing, to form the hose;
providing, in the crimp-press, crimp-tooling, which includes a plurality of crimp-punches;
so arranging the crimp-tooling that operating a crimp-stroke of the crimp-press is effective to drive the crimp-punches inwards together, thereby crimping the metal ferrule onto the elastomeric tubing, and thereby permanently deforming the metal of the ferrule inwards, and thereby producing hydraulic sealing and mechanical securement of the hose as a unit;
placing the metal ferrule in the crimp-tooling;
inserting the elastomeric tubing into an open end of the ferrule;
then operating the crimp-stroke; and
then removing the resulting crimped hose, as a unit, from the crimp-tooling.
5. As in claim 4, including so arranging the dimple-pin in the crimp-tooling that operating that same crimp-stroke of the crimp-tooling is effective also to apply the dimple-force to press the dimple-pin into the ferrule of that same hose.
6. As in claim 4, including so arranging the crimp-tooling that the dimple in the metal is physically spaced apart from the deformation of the metal arising from the crimp-punches.
7. As in claim 4, including so arranging the crimp-tooling that the dimple-pin is functionally incorporated into one of the plurality of crimp-punches, termed a dimple-crimp-punch, in that the dimple-pin is pressed inwards into the ferrule in unison with the dimple-crimp-punch, during operation of the crimp-stroke.
8. As in claim 4, including arranging the crimp-tooling in a dies-close configuration, in which, during the crimp-stroke, the crimp-punches travel inwards until the crimp-punches reach a mechanical stop, which constrains the crimp-punches against further movement inwards.
9. As in claim 4, including arranging the crimp-tooling in a dies-do-not-close configuration, in which, during the crimp-stroke, the crimp-punches travel inwards until the force pushing the crimp-punches inwards reaches a predetermined maximum.
10. As in claim 1, including, the ferrule being closed- or blind-ended, inserting the elastomeric tubing right to the blind- or closed-end of the ferrule.
11. As in claim 10, including:
providing the ferrule with a sight-hole, right through the metal;
so placing the sight-hole that, if the elastomeric tubing has been properly inserted into the ferrule, the tubing is visible through the sight-hole.
12. As in claim 11, including forming, in addition to the said dimple, also a second dimple in the same ferrule, so pitched around the circumference of the ferrule from the said dimple that if one of the dimples coincides with the sight-hole, the other does not.
13. As in claim 1, including providing the dimple-force measuring-device in the form of an electronic load-cell, which sends a signal indicative of the dimple-force to a computer.
14. As in claim 13, including determining the threshold value for the dimple-force as follows:
recording certain parameters of the dimple-force as the dimple is pressed into the ferrule;
carrying out a preliminary sampling, including keeping records of the parameters as recorded from several completed hoses;
inspecting the several hoses, and determining, in respect of each hose, whether the elastomeric tubing has been properly inserted into the ferrule;
relating that decision to the as-recorded parameters, in respect of each hose, and computing the difference between an accept-value of the parameter, recorded in respect of hoses in which the tubing was properly inserted, and a reject-value of the parameter, recorded in respect of hoses in which the tubing was not properly inserted; and
setting the threshold of the dimple-force to a value between the accept-value and the reject-value.
15. As in claim 14, wherein the parameter is the peak magnitude of the dimple-force.
16. As in claim 1, including applying the dimple-force at a high enough magnitude to cause permanent deformation of the metal of the ferrule.
17. As in claim 1, including applying the dimple-force at a low enough magnitude to avoid puncturing right through the metal of the ferrule.
18. As in claim 3, wherein the dimple-pin is at least 3 cm long.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. An anvil assembly, useable against a shoe of a machine which seals a cover to flanges of a package, the flanges and the cover having predetermined thicknesses, the anvil assembly comprising:
a base;
a pin operably connected to said base;
a first insert rotatable about said pin over a predetermined range of rotation and having a surface constructed and arranged to act the shoe during a sealing operation; and,
a second insert opposite said first insert and rotatable about said pin over a predetermined range of rotation and having a surface constructed and arranged to act against a shoe of the sealing machine during a sealing operation.
2. The anvil assembly of claim 1 wherein said base comprises a wall defining a hole sized to receive said pin.
3. The anvil assembly of claim 1 wherein said base comprises a pair of opposed walls, each defining a hole receiving opposite ends of said pin.
4. The anvil assembly of claim 3 wherein said base further comprises a floor connecting said opposed walls.
5. The anvil assembly of claim 4 wherein said inserts are positioned a predetermined distance from said floor such that when said inserts are rotated, said inserts abut against said floor, said floor thereby defining the limits of said range of rotation.
6. The anvil assembly of claim 1 wherein said predetermined range of rotation is between 0.5 degrees to 2.5 degrees.
7. The anvil assembly of claim 6 wherein said predetermined range of rotation is on the order of 1.0 degrees.
8. The anvil assembly of claim 3 wherein said walls extend above said first and second insert surfaces by a predetermined amount.
9. The anvil assembly of claim 8 wherein said predetermined amount that said walls extend above said first and second insert surfaces is greater than the predetermined thicknesses of the cover and the package combined, measured when said inserts are parallel to said walls.
10. The anvil assembly of claim I wherein said first and second inserts are separated and define a channel therebetween through which a packaging tape may pass while a plastic covering film is attached thereto.
11. The anvil assembly of claim 3 further comprising a spring surrounding said pin and sized to press said inserts against said base walls.
12. The anvil assembly of claim 3 further comprising a spacer of a predetermined length surrounding said pin and sized to maintain said inserts in a spaced apart relationship.
13. An anvil assembly, useable in a package sealing machine, comprising:
a pair of opposed inserts having flat upper surfaces of predetermined widths; and,
a base constructed and arranged to rotatably hold said inserts such that said flat upper surfaces are presented toward sealing shoes of the package sealing machine during operation.
14. The anvil assembly of claim 13 wherein said base comprises at least one pin rotatably holding said inserts.
15. The anvil assembly of claim 14 wherein said base further comprises a wall defining a hole sized to receive said at least one pin.
16. The anvil assembly of claim 14 wherein said base further comprises a pair of opposed walls, each defining a hole sized to receive said at least one pin.
17. The anvil assembly of claim 16 wherein said holes defined by said pair of opposed walls are in opposing alignment with each other.
18. The anvil assembly of claim 16 wherein said base further comprises a floor connecting said opposed walls.
19. The anvil assembly of claim 13 wherein said inserts are rotatably held by said base such that the inserts have a predetermined range of rotation which is less than 180 degrees.
20. The anvil assembly of claim 19 wherein said predetermined range of rotation is between 0.5 degrees to 2.5 degrees.
21. The anvil assembly of claim 19 wherein said predetermined range of rotation is on the order of 1.0 degrees.
22. The anvil assembly of claim 16 wherein said walls extend above said first and second insert surfaces by a predetermined amount.
23. The anvil assembly of claim 22 wherein said predetermined amount said walls extend above said first and second insert surfaces is on the order of 0.5 millimeters when said inserts are parallel to said walls.
24. The anvil assembly of claim 13 wherein said first and second inserts are separated and define a channel therebetween through which a packaging tape may pass while a plastic covering film is attached thereto.
25. The anvil assembly of claim 17 wherein said at least one pin comprises one pin having two ends, each of said ends riding in one of said aligned holes.
26. The anvil assembly of claim 25 further comprising a spring surrounding said pin and sized to press said inserts against said base walls.
27. The anvil assembly of claim 25 further comprising a spacer surrounding said pin and sized to maintain said inserts adjacent said base walls and to further maintain a channel therebetween.
28. The anvil assembly of claim 18 wherein said inserts are positioned a predetermined distance from said floor such that when said inserts are rotated, said inserts abut against said floor, said floor thereby defining limits of said insert rotation.
29. An anvil assembly, useable in a package heat sealing machine, comprising:
a U-shaped base having two opposed vertical walls extending upwardly from opposite sides of a horizontal floor, each of said walls defining a hole sized to receive a pin;
two inserts having flat upper surfaces of predetermined widths, each insert defining a hole slightly larger than the holes defined by said walls;
a pin having two ends, each of said ends received by one of said holes in said walls such that said pin extends from one wall to the other, over said floor, and passes through said holes defined by said inserts such that said inserts are supported by said pin between said walls.
30. The anvil assembly of claim 29 wherein each of said predetermined insert widths are substantially equal.
31. The anvil assembly of claim 29 wherein said inserts comprise bottom edges which are separated from said floor by a predetermined amount such that, when said inserts are rotated in forward and reverse directions, said bottom edges abut said floor, thereby preventing further rotation and defining a range of rotation.
32. The anvil assembly of claim 31 wherein said range of rotation is between 0.5 degrees to 2.5 degrees.
33. The anvil assembly of claim 32 wherein said range of rotation is on the order of 1.0 degrees.