All The Claims

We claim:

1. A method for removing polysilane from a semiconductor substrate without stripping during manufacture of a semiconductor device, comprising:
a) coating a polysilane on a semiconductor substrate and coating a resist on said polysilane;
b) patterning said resist with exposure and development;
c) transferring the pattern from said resist to said polysilane using an etch process selective to said resist;
d) stripping said resist;
e) transferring the pattern from said polysilane to a hardmask using an etch selective to said hardmask;
f) subjecting said polysilane to thermal or plasmathermal oxidation to convert said polysilane to silica; and
g) etching the substrate and stripping off the hard mask.
2. The method of claim 1 wherein in step a) said polysilane is coated by spin coating.
3. The method of claim 1 wherein in step a) said polysilane is coated by dipping.
4. The method of claim 1 wherein in step a) said polysilane is coated by casting.
5. The method of claim 1 wherein step a) said polysilane is coated by vacuum evaporation.
6. The method of claim 1 wherein step a) said polysilane is coated by a Langmuir-Blodgett method.
7. The method of claim 2 wherein said polysilane has the formula:
(R1m R2n Xp Si)q(I)
wherein R1 and R2, may be the same or different, are substituted or unsubstituted monovalent hydrocarbon groups, X is a substituted or unsubstituted monovalent hydrocarbon group, alkoxy group or halogen atom, letters m, n and p are numbers satisfying 1mnp<2.2 and q is an integer of from 10 to 100,000;
when R1 and R2 are aliphatic or alicyclic hydrocarbon groups,
the number of carbon atoms is 1 to 12; when R1 and R2 are aromatic hydrocarbon groups, the number of carbon atoms is 6 to 14; and
X is a group as defined for R1, or an alkoxy group of 1 to 8 carbon atoms or a halogen atom.
8. The method of claim 7 wherein said polysilane is in a solvent solution containing a polysilane concentration of from about 1 to about 20% by weight.
9. The method of claim 8 wherein said solvent is an aromatic hydrocarbon.
10. The method of claim 9 wherein said aromatic hydrocarbon is selected from the group consisting of benzene, toluene and xylene.
11. The method of claim 8 wherein said solvent is an ether solvent.
12. The method of claim 11 wherein said ether solvent is selected from tetrahydrofuron or dibutyl ether.
13. The method of claim 2 wherein said thermal or plasma thermal oxidation proceeds at a temperature range of from about 200 C. to about 1000 C.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A mirror support structure comprising:
a first mirror and a second mirror disposed a predetermined distance apart from each other in a face-to-face relation;
a first mirror support member and a second mirror support member supporting said first mirror and said second mirror, respectively;
a plurality of main rods connecting said first mirror support member and said second mirror support member with each other;
a plurality of auxiliary rods joined at one ends thereof to said first mirror support member or said second mirror support member and at the other ends thereof to a single connection point;
a plurality of support legs for indirectly supporting said first and second mirrors at a total of three points including two points on said first mirror support member and said single connection point at which said auxiliary rods are joined together; and
a base on which said support legs are fixedly mounted; wherein said support legs are composed of follower members capable of following an expansion or contraction of said base.
2. The mirror support structure as claimed in claim 1, wherein said first mirror support member and said second mirror support member are each composed of a triangular-shaped panel, and said main rods and said auxiliary rods comprise three pairs of main and auxiliary rods joined together in each pair to form a continuous and integral rectilinear configuration, said three pairs of continuously and integrally joined main and auxiliary rods serving to connect three apexes of said first triangular-shaped mirror support member with three corresponding apexes of said second triangular-shaped mirror support member, respectively, to cooperate with three sides of said first triangular-shaped mirror support member and three sides of said second triangular-shaped mirror support member to form a trussed structure.
3. The mirror support structure as claimed in claim 2, wherein said main rods comprise additional main rods connecting three apexes of said first triangular-shaped mirror support member with three different apexes of said second triangular-shaped mirror support member in combinations different from those in which the three apexes of said first triangular-shaped mirror support member and the three corresponding apexes of said second triangular-shaped mirror support member are connected with each other by means of said three pairs of continuous and integrally joined main and auxiliary rods.
4. The mirror support structure as claimed in claim 1, wherein said first mirror support member and said second mirror support member are each composed of a triangular-shaped panel, and said main rods comprise six main rods connecting three apexes of said first mirror support member and three apexes of said second mirror support member, respectively, and said auxiliary rods comprise three auxiliary rods joined to three apexes of said second mirror support member, respectively, said six main rods and said three auxiliary rods cooperating with three sides of said first triangular-shaped mirror support member and three sides of said second triangular-shaped mirror support member to form a trussed structure.
5. The mirror support structure as claimed in claim 1, wherein said first mirror support member and said second mirror support member are each composed of a triangular-shaped panel, and said first triangular-shaped mirror support member and said second triangular-shaped mirror support member are arranged such that they have one side disposed in parallel with a surface of said base, and said main rods comprise six main rods connecting three apexes of said first triangular-shaped mirror support member and three apexes of said second triangular-shaped mirror support member with each other, and said auxiliary rods comprise three auxiliary rods joined to the three apexes of said first triangular-shaped mirror support member, respectively, said six main rods and said three auxiliary rods cooperating with three sides of said first triangular-shaped mirror support member and three sides of said second triangular-shaped mirror support member to form a trussed structure.
6. The mirror support structure as claimed in claim 1, wherein said first mirror support member and said second mirror support member are each composed of a triangular-shaped panel, and said first triangular-shaped mirror support member and said second triangular-shaped mirror support member are arranged such that they have each side disposed in antiparallel with a surface of said base, and said main rods comprise six main rods connecting three apexes of said first triangular-shaped mirror support member and three apexes of said second triangular-shaped mirror support member with each other, and said auxiliary rods comprise three auxiliary rods joined to three apexes of said first triangular-shaped mirror support member, respectively, said six main rods and said three auxiliary rods cooperating with three sides of said first triangular-shaped mirror support member and three sides of said second triangular-shaped mirror support member to form a trussed structure.
7. The mirror support structure as claimed in claim 1, wherein said follower members are each composed of a plate spring.

What is claimed is:

1. A dry powder nucleic acid composition comprising insoluble nucleic acid constructs dispersed within a hydrophilic excipient material.
2. A dry powder nucleic acid composition as in claim 1, wherein the composition consists essentially of particles of the nucleic acid constructs dispersed within the hydrophilic excipient material, present in a powder of the excipient material.
3. A dry powder nucleic acid composition as in claim 2, wherein the nucleic acid construct particles have an average particle size in the range from 0.5 m to 50 m.
4. A dry powder nucleic acid composition as in claim 1, wherein the nucleic acid constructs comprise bare nucleic acid molecules or viral vectors.
5. A dry powder nucleic acid composition as in claim 1, wherein the nucleic acid constructs comprise nucleic acids present in a vesicle, wherein the vesicle is dispersed within the hydrophilic excipient.
6. A dry powder nucleic acid composition as in claim 1, wherein nucleic acid construct includes a structural region and a regulatory region.
7. A dry powder nucleic acid composition as in claim 1, wherein the hydrophilic excipient is a material selected from the group consisting of inorganic salts, sugars, sugar alcohols, oligosaccharides, amino acids, organic acids and salts, carbohydrates, proteins, and peptides.
8. A method for preparing dry powder nucleic acid compositions, said method comprising:
suspending insoluble nucleic acid constructs in an aqueous solution of a hydrophilic excipient; and
drying the solution to produce a powder comprising particles of the nucleic acid constructs dispersed within the dried excipient material.
9. A method as in claim 8, wherein the nucleic acid constructs are present in the aqueous solution at a weight ratio in the range form 2:1 to 1:100 nucleic acid construct: hydrophilic excipient.
10. A method as in claim 8, wherein the aqueous solution is dried by spraying droplets into a gas stream, wherein particles having a size in the range from 0.5 to 50 m are produced.
11. A method as in claim 8, wherein the aqueous solution is dried by exposure to a vacuum to produce a crude powder, further comprising grinding the crude powder to produce a final powder size in the range from 1 to 50 m.
12. A method as in claim 8, wherein the nucleic acid constructs comprise bare nucleic acid molecules or viral vectors and the aqueous solution is buffered.
13. A method as in claim 8, wherein the nucleic acid constructs comprise nucleic acids present in a vesicle and the aqueous solution is substantially free from buffer and salts.
14. A method as in claim 8, wherein the nucleic acid constructs include a structural region and a regulatory region.
15. A method as in claim 8, wherein the hydrophilic excipient is a material selected from the group consisting of inorganic salts, sugars, sugar alcohols, oligosaccharides, amino acids, organic acids and salts, carbohydrates, proteins, and peptides.
16. A method for delivering nucleic acid constructs to a moist target location in a patient, said method comprising
dispersing a dry powder comprising particles of insoluble nucleic acid constructs in a hydrophilic excipient material in a gas stream; and
directing the gas stream at the moist target location, whereby the hydrophilic excipient coating absorbs water and dissolves to release the nucleic acid constructs.
17. A method as in claim 16, wherein the target location is the lung and the gas stream is directed to the lung by inhalation.
18. A method as in claim 17, wherein the coated nucleic acid constructs have a particle size in the range from 0.5 m to 50 m.
19. A method as in claim 16, wherein the nucleic acid constructs comprise bare nucleic acid molecules or viral vectors.
20. A method as in claim 16, wherein the nucleic acid constructs comprise nucleic acids present in a vesicle.
21. A method as in claim 16, wherein the nucleic acid constructs include a structural region and a regulatory region.
22. A method as in claim 16, wherein the hydrophilic excipient is a material selected from the group consisting of inorganic salts, sugars, sugar alcohols, oligosaccharides, amino acids, organic acids and salts, carbohydrates, proteins, and peptides.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An electrical connector adapted for being mounted onto a printed circuit board defining a plurality of vias, the electrical connector comprising:
an insulative housing having a mounting surface adapted for being mounted onto the printed circuit board;
a contact module assembled to the insulative housing, said contact module comprising a plurality of conductive terminals, each of the conductive terminals comprising a pin end extending beyond the mounting surface for being inserted into one of the vias;
a position fixer having a plurality of through holes each retaining to a corresponding pin end prior to the position fixer being moved up to the mounting surface when the electrical connector is mounted to the printed circuit board.
2. The electrical connector as claimed in claim 1, wherein said pin end comprises a needle eye portion having a first end and a second end, and the position fixer, prior to the electrical connector being mounted onto the printed circuit board, is disposed adjacent to the first end while, after the electrical connector being pressed into the printed circuit board, the position fixer is moved to the second end.
3. The electrical connector as claimed in claim 2, wherein a diameter of the needle eye portion is greater than a diameter of the through hole of the position fixer.
4. The electrical connector as claimed in claim 1, wherein there are provided plural contact modules assembled to the insulative housing, and said insulative housing defines a plurality of ports forwardly opening to receive a plurality of mating connectors, respectively.
5. The electrical connector as claimed in claim 1, wherein said position fixer is parallel to the printed circuit board.
6. The electrical connector as claimed in claim 1, wherein said pin ends extend along a direction perpendicular to the position fixer.
7. The electrical connector as claimed in claim 1, wherein said insulative housing comprises a projection portion for aligning to the printed circuit board.
8. The electrical connector as claimed in claim 1, further comprising a sub-circuit board at the mounting surface of the insulative housing.
9. The electrical connector as claimed in claim 1, further comprising a shielding shell enclosing the insulative housing, the shielding shell having a plurality of ground tails.
10. A method of mounting an electrical connector having a housing and a plurality of conductive terminals to a printed circuit board having a plurality of vias, the method comprising the steps of:
retaining a position fixer defining a plurality of through holes corresponding to the conductive terminals to pin ends of the conductive terminals; and
inserting the pin ends into the vias while moving the position fixer all the way up to the housing.
11. The method of assembling an electrical connector as claimed in claim 10, further comprising a step of providing a needle eye portion to the pin end, and wherein the step of retaining comprises placing the position fixer onto the needle eye portion.
12. An electrical connector for mating with at least a complementary connector and for mounting to a printed circuit board, comprising:
an insulative housing defining a mating face for mating with said at least complementary connector, and a mounting face for mounting to the printed circuit board;
a plurality of contact modules dispose in the housing around the mounting face, said contact module including a position member associated with a plurality of conductive terminals, each of said terminal defining a press-fit mounting portion for mounting to a corresponding hole in the printed circuit board, said press-fit mounting portion including an upper needle eye section and a lower pin type section wherein said upper needle eye section is transversely shrinkable and defines a larger width than the lower pin type section; and
a position fixer characterized with deformability thereof; wherein
the housing and the contact modules are configured to allow the lower pin type sections of said press-fit mounting portions to pierce through said positioning fixer and retained thereto in a snug manner when said position fixer is located in a lower position before said connector is mounted to the printed circuit board, and to allow the upper needle eye sections of said mounting portions to further pierce through said position fixer via a procedure of mounting said connector to the printed circuit board to have the upper needle eye sections further inserted into said corresponding holes in the printed circuit board when said position fixer is located in a final position.
13. The electrical connector as claimed in claim 12, wherein said position fixer is moved above the needle eye section when the position fixer is located in the final position.
14. The electrical connector as claimed in claim 12, wherein said position member is wholly located around said mounting face and equipped with two rows of said terminals arranged in a minor image with a shielding plate therebetween.
15. The electrical connector as claimed in claim 12, wherein the shielding plate defines a height similar to that of the housing while the position member is less than a half of that of the housing.
16. The electrical connector as claimed in claim 12, wherein a sub-circuit board is mounted between the contact module and the position fixer and pierced by the mounting portion.