1460718592-a61452e8-eeec-43d6-b780-0710575f33cd

1. A resistive sensor read-out apparatus, comprising:
an active sensor;
a reference element;
a bias circuit coupled to the active sensor and the reference element, the bias circuit configured to calibrate one or more mismatches between the active sensor and the reference element;
a current-to-voltage converter coupled to an output of the bias circuit;
an analog-to-digital converter coupled to an output of the current-to-voltage converter; and
a calibration processor coupled to an output of the analog-to-digital converter and configured to estimate an error caused by limited resolution mismatch calibration, the calibration processor configured to at least partially control calibration performed at the bias circuit based on the error.
2. The apparatus of claim 1, wherein the bias circuit is an adjustable current mirror configured to calibrate mismatches between the active sensor and the reference element based on digital control thereof.
3. The apparatus of claim 1, wherein the calibration processor is configured to identify effects of quantization errors in the bias circuit.
4. The apparatus of claim 1, wherein the calibration processor is configured to identify effects of quantization errors in the bias circuit based on the output of the analog-to-digital converter.
5. The apparatus of claim 1, wherein the calibration processor is configured to cancel effects of quantization errors in the bias circuit.
6. The apparatus of claim 1, wherein the calibration processor is configured to cancel effects of quantization errors in the bias circuit based on the output of the analog-to-digital converter.
7. The apparatus of claim 1, wherein the calibration processor is configured to identify effects of non-linearities in the bias circuit.
8. The apparatus of claim 1, wherein the calibration processor is configured to identify effects of non-linearities in the bias circuit based on the output of the analog-to-digital converter.
9. The apparatus of claim 1, wherein the calibration processor is configured to cancel effects of non-linearities in the bias circuit.
10. The apparatus of claim 1, wherein the calibration processor is configured to cancel effects of non-linearities in the bias circuit based on the output of the analog-to-digital converter.
11. The apparatus of claim 1, wherein the calibration processor is configured to characterize and store non-linearities of the bias circuit in a look-up table.
12. A resistive sensor read-out apparatus, comprising:
an active sensor;
a reference element;
an adjustable current mirror coupled to the active sensor and the reference element, the adjustable current mirror configured to calibrate mismatches between the active sensor and the reference element;
a current-to-voltage converter coupled to an output of the adjustable current mirror;
an analog-to-digital converter coupled to an output of the current-to-voltage converter; and
a digital signal processor coupled to an output of the analog-to-digital converter, the digital signal processor having at least one look-up table, a calibration processor, at least one arithmetic block, and a quantizer, the digital signal processor configured to at least partially control calibration performed at the adjustable current mirror.
13. The apparatus of claim 12, wherein the look-up table is used to store current estimate coefficients of the reference element.
14. The apparatus of claim 12, wherein the calibration processor is configured to identify quantization errors caused by limited resolution mismatch calibration.
15. The apparatus of claim 12, wherein the at least one arithmetic block is configured to cancel quantization errors caused by limited resolution mismatch calibration.
16. The apparatus of claim 12, wherein the quantizer is configured to convert high-to-low resolution coefficients.
17. A method for calibrating and compensating a resistive sensor read-out, comprising the steps of:
providing an active sensor;
providing a reference element;
providing a bias circuit for biasing the active sensor and the reference element;
determining a mismatch between the active sensor and the reference element;
identifying effects of limited resolution in the bias circuit based on the mismatch between the active sensor and the reference element; and
correcting the effects of limited resolution in the bias circuit.
18. The method of claim 17 further comprising a step of converting the mismatch between the active sensor and the reference element into digital form.
19. The method of claim 17, wherein the bias circuit is adjustably configured to bias the active sensor and the reference element at least partially based on the effects of limited resolution in the bias circuit.
20. The method of claim 17, wherein the bias circuit is an adjustable current mirror.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for forming a display device of organic light emitting diodes, comprising:
providing a panel with a pixel array thereon and surrounded by a peripheral region, at least a pixel of said pixel array comprising an organic light emitting diode;
providing a frame to be joined to said panel;
coupling a signal line to said pixel array electrically;
joining a power line to said frame; and
joining said frame to said panel.
2. The method as in claim 1, wherein said coupling a signal line comprises physically joining said signal line to said panel.
3. The method as in claim 2, wherein said signal line is disposed on a surface of a printed circuit board and wherein said physically joining said signal line to said panel comprises joining said printed circuit board to said panel such that said surface faces a surface of said panel upon which said pixel array is disposed.
4. The method as in claim 1, wherein said coupling a signal line to said pixel array electrically comprises joining said signal line to said periphery at a first peripheral location and said joining said frame to said panel comprises said power line being positioned at a second peripheral location spaced apart from said first peripheral location.
5. The method as in claim 1, wherein said coupling a signal line to said pixel array electrically comprises using an anisotropic conductive film.
6. The method as in claim 5, wherein said signal line is disposed on a flexible printed circuit board and said coupling a signal line to said pixel array electrically comprises placing said anisotropic conductive film between said flexible printed circuit board and said panel and compressing said flexible printed circuit board and said panel, together.
7. The method as in claim 6, wherein said signal line comprises at least one signal line terminal disposed on said flexible printed circuit board, said panel comprises terminals of interconnect leads connected to said pixel array, and said coupling a signal line to said pixel array electrically comprises electrically coupling each of said terminals to a corresponding signal line terminal of said at least one signal line terminal.
8. The method as in claim 5, further comprising curing said anisotropic conductive film.
9. The method as in claim 1, further comprising illuminating said display device by providing power to said pixel array via said power line and providing a signal to said pixel array via said signal line.
10. The method as in claim 1, wherein said joining said frame to said panel comprises providing at least one conductive contact on said panel and soldering an electrical contact of said power line to said at least one conductive contact.
11. The method as in claim 9, wherein said power line is formed of copper.
12. The method as in claim 1, wherein said joining said frame to said panel comprises electrically coupling said power line to said pixel array.
13. A method for forming a display device of organic light emitting diodes, comprising:
providing a panel with a pixel array thereon and surrounded by a peripheral region, at least a pixel of said pixel array comprising an organic light emitting diode and a thin film transistor;
electrically coupling a signal line formed on a surface, to said pixel array by physically joining said signal line and said surface to said panel at a first peripheral location;
electrically coupling a power line to said pixel array by physically joining said power line to said panel at a second peripheral location peripherally spaced apart from said first peripheral location, said power line comprising an insulated electrical cable; and
providing a frame and joining said frame to said panel.
14. An electroluminescent display device comprising a substrate with a pixel array disposed thereon and a peripheral area surrounding said pixel array, at least a pixel of said pixel array comprising an organic light emitting diode,
a signal line formed on a surface and physically coupled to said substrate; and
a frame with a power line joined thereto, said frame joined to said substrate.
15. The electroluminescent display device as in claim 14, wherein said signal line is physically joined to said peripheral area at a first peripheral location and said power line is positioned at a second peripheral location and said first peripheral location is spaced from said second peripheral location by an angle of at least 60\xb0 with respect to a geometrical center of said substrate.
16. The electroluminescent device as in claim 14, wherein said power line is an insulated electrical cable formed of copper.
17. The electroluminescent device as in claim 14, wherein said signal line comprises a terminal disposed on a flexible printed circuit board and an anisotropic conductive film is positioned between said flexible printed circuit board and said substrate.
18. The electroluminescent device as in claim 17, wherein said substrate comprises a plurality of conductive interconnect leads disposed thereon, said conductive interconnect leads coupled to said pixel array, and said terminal is electrically coupled to a corresponding one of said of conductive interconnect leads.
19. The electroluminescent display device as in claim 14, wherein said signal line is formed of copper.
20. The electroluminescent display device as in claim 14, wherein said power line is electrically coupled to said pixel array.