I claim:
1. A process for producing a semiconductor device, which comprises:
a) producing a doped III-V semiconductor substrate of a first conduction type;
b) applying a first doped III-V semiconductor layer of a second conduction type to the III-V semiconductor substrate;
c) applying a second doped III-V semiconductor layer of the first conduction type to the first doped III-V semiconductor layer;
d) applying an active layer system to the second doped III-V semiconductor layer; and
e) producing at least two functional semiconductor structures electrically insulated from one another, by cutting the active layer system inclusive of the first doped III-V semiconductor layer and the second doped III-V semiconductor layer.
2. The process according to claim 1, which further comprises performing the substrate producing step by producing a doped III-V semiconductor substrate having a charge carrier concentration of more than 1*1015 cm3 at room temperature.
3. The process according to claim 1, which further comprises performing the substrate producing step by producing a doped III-V semiconductor substrate having a charge carrier concentration of between 1*1016 cm3 and 1*1019 cm3 at room temperature.
4. The process according to claim 1, which further comprises performing the structure producing step by producing at least one metal clad ridge waveguide laser structure.
5. The process according to claim 1, which further comprises performing the structure producing step by producing, from the at least two functional semiconductor structure, a photodiode array of photodiode structures.
6. The semiconductor device according to claim 5, which further comprises producing etching trenches between each of the photodiode structures.
7. The process according to claim 1, which further comprises:
performing the structure producing step by producing at least two monolithically integrated functional semiconductor structures; and
producing at least one pn junction reverse-biased during operation of the semiconductor device between each of the at least two monolithically integrated functional semiconductor structures and the doped III-V semiconductor substrate.
8. The process according to claim 7, which further comprises cutting the at least one pn junction in an intermediate location between the at least two monolithically integrated functional semiconductor structures to prevent a conductive electrical connection between the at least two monolithically integrated functional semiconductor structures through the doped III-V semiconductor substrate and inclusive of at least one of the first doped III-V semiconductor layer and the second doped III-V semiconductor layer.
9. The process according to claim 1, which further comprises performing the structure producing step by producing at least two monolithically integrated functional semiconductor structures of different types.
10. A process for producing a semiconductor device, which comprises:
a) producing a doped III-V semiconductor substrate of a first conduction type;
b) applying a first doped III-V semiconductor layer of a second conduction type to the III-V semiconductor substrate;
c) applying an active layer system to the first doped III-V semiconductor layer; and
d) producing at least two functional semiconductor structures electrically insulated from one another, by cutting the active layer system inclusive of the first doped III-V semiconductor layer.
11. The process according to claim 10, which further comprises performing the substrate producing step by producing a doped III-V semiconductor substrate having a charge carrier concentration of more than 1*1015 cm3 at room temperature.
12. The process according to claim 10, which further comprises performing the substrate producing step by producing a doped III-V semiconductor substrate having a charge carrier concentration of between 1*1016 cm3 and 1*1019 cm3 at room temperature.
13. The process according to claim 10, which further comprises performing the structure producing step by producing at least one metal clad ridge waveguide laser structure.
14. The process according to claim 10, which further comprises performing the structure producing step by producing, from the at least two functional semiconductor structure, a photodiode array of photodiode structures.
15. The semiconductor device according to claim 14, which further comprises producing etching trenches between each of the photodiode structures.
16. The process according to claim 10, which further comprises:
performing the structure producing step by producing at least two monolithically integrated functional semiconductor structures; and
producing at least one pn junction reverse-biased during operation of the semiconductor device between each of the at least two monolithically integrated functional semiconductor structures and the doped III-V semiconductor substrate.
17. The process according to claim 16, which further comprises cutting the at least one pn junction in an intermediate location between the at least two monolithically integrated functional semiconductor structures to prevent a conductive electrical connection between the at least two monolithically integrated functional semiconductor structures through the doped III-V semiconductor substrate and inclusive of at least one of the first doped III-V semiconductor layer and the second doped III-V semiconductor layer.
18. The process according to claim 10, which further comprises performing the structure producing step by producing at least two monolithically integrated functional semiconductor structures of different types.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A method for upgrading a software on a customer system, comprising:
receiving, by a supplier system, a software inventory from the customer system;
verifying one or more business contracts for the software inventory utilizing one or more databases connected to the supplier system; and
determining one or more software upgrade releases for the software inventory utilizing a product topology database connected to the supplier system.
2. The method of claim 1, further comprising,
displaying the one or more software upgrade releases for customer approval.
3. The method of claim 2, further comprising,
forwarding an approved order to a fulfillment and distribution center.
4. The method of claim 2, further comprising:
prompting one or more responses from a customer utilizing graphical user interfaces.
5. The method of claim 1, wherein the software inventory is received after a software upgrade request.
6. The method of claim 1, wherein the software inventory is received periodically.
7. The method of claim 1, wherein verifying one or more business contracts comprises validating subscription for one or more subscription software in the software inventory utilizing a subscription entitlement database.
8. The method of claim 1, wherein verifying one or more business contracts comprises verifying entitlement for one or more keyed software in the software inventory utilizing a keyed management system database.
9. The method of claim 1, wherein determining one or more software upgrade releases comprises mapping software releases in the software inventory to software upgrade releases.
10. The method of claim 1, wherein determining one or more software upgrade releases comprises:
filtering the software inventory;
categorizing the software inventory;
mapping software releases in the software inventory to software upgrade releases;
categorize software upgrade releases; and
generate an upgrade order.
11. The method of claim 10, wherein determining one or more software upgrade releases further comprises:
cross-referencing release-to-release product configurations for the software upgrade releases.
12. The method of claim 10, wherein determining one or more software upgrade releases further comprises:
verifying pre-requisite and co-requisite software for the software upgrade releases.
13. The method of claim 1, further comprising:
receiving an order for additional software; and
verifying pre-requisite and co-requisite software for the additional software.
14. A system for upgrading a software on a customer system, comprising:
a supplier system configured to:
receive a software inventory from the customer system;
verify one or more business contracts for the software inventory utilizing one or more databases connected to the supplier system; and
determine one or more software upgrade releases for the software inventory utilizing a product topology database connected to the supplier system.
15. The system of claim 14, wherein the supplier system comprises a software upgrade system having a software upgrade server connected to an interface server.
16. The system of claim 15, wherein the supplier system further comprises a security mechanism connected to the software upgrade system, the security mechanism having connections to a network.
17. A signal bearing medium, comprising a program which, when executed by a processor, performs steps for upgrading a software on a customer system, comprising:
receiving, by a supplier system, a software inventory from the customer system;
verifying one or more business contracts for the software inventory utilizing one or more databases connected to the supplier system; and
determining one or more software upgrade releases for the software inventory utilizing a product topology database connected to the supplier system.
18. The signal bearing medium of claim 17, wherein the steps further comprises:
displaying the one or more software upgrade releases for customer approval.
19. The signal bearing medium of claim 18, wherein the steps further comprises:
forwarding an approved order to a fulfillment and distribution center.
20. The signal bearing medium of claim 18, wherein the steps further comprises:
prompting one or more responses from a customer utilizing graphical user interfaces.
21. The signal bearing medium of claim 17, wherein verifying one or more business contracts comprises validating subscription for one or more subscription software in the software inventory utilizing a subscription entitlement database.
22. The signal bearing medium of claim 17, wherein verifying one or more business contracts comprises verifying entitlement for one or more keyed software in the software inventory utilizing a keyed management system database.
23. The signal bearing medium of claim 17, wherein determining one or more software upgrade releases comprises mapping software releases in the software inventory to software upgrade releases.
24. The signal bearing medium of claim 17, wherein determining one or more software upgrade releases comprises:
filtering the software inventory;
categorizing the software inventory;
mapping software releases in the software inventory to software upgrade releases;
categorize software upgrade releases; and
generate an upgrade order.
25. The signal bearing medium of claim 24, wherein determining one or more software upgrade releases further comprises:
cross-referencing release-to-release product configurations for the software upgrade releases.
26. The signal bearing medium of claim 24, wherein determining one or more software upgrade releases further comprises:
verifying pre-requisite and co-requisite software for the software upgrade releases.