What is claimed is:
1. A method for obtaining a digital signature comprising the steps of:
receiving a request for a digital signature during an electronic transaction;
notifying a web browser of the request for the digital signature;
obtaining the digital signature from the wireless device;
appending the digital signature to the data;
notifying the web browser the digital signature has been obtained; and
transmitting the data with the appended digital signature to a requesting party.
2. The method of claim 1, wherein the step of obtaining further includes the steps of:
forwarding the data to an application within the computer;
establishing a short-range wireless connection between the computer and the wireless device; and
forwarding the digital signature to the computer from the wireless device via the short-range wireless link.
3. The method of claim 1, further including the step of recognizing a command within the request for a digital signature.
4. The method of claim 1, further including the step of including a command for the digital signature and the data to be digitally signed within an HTTP header transmitted to a customer.
5. The method of claim 1, wherein the step of transmitting the data with the appended digital signature further includes transmitting the data with the appended digital signature to a URL included within the request.
6. The method of claim 1, wherein the step of notifying further includes the step of periodically reloading a web page notifying the customer of the request for the digital signature.
7. A method for obtaining a digital signature in a transaction between a computer of a customer and a merchant, comprising the steps of:
receiving a request for a digital signature from the merchant during an electronic transaction;
recognizing a command for the digital signature and a data string to be digitally signed within the request;
notifying a web browser of the request for the digital signature;
forwarding the data string to an application within the computer;
establishing a shortrange wireless link between the computer and a wireless device;
forwarding the digital signature to the computer from the wireless device via the short range wireless link;
appending the digital signature to the data string;
notifying the web browser the digital signature has been obtained; and
transmitting the data string with the appended digital signature to a URL included within the request.
8. The method of claim 7, further including the step of including the command for the digital signature and the data string to be digitally signed within an HTTP header transmitted to the computer of the customer by the merchant.
9. The method of claim 7, wherein the step of notifying further includes the step of periodically reloading a web page notifying the customer of the request for the digital signature.
10. A mobile electronic transaction personal proxy device, comprising:
a first interface with a merchant computer;
a second interface with a web browser;
a third interface with a Mobile electronic transaction device; and
control logic configured to:
notify the web browser of a request for a digital signature from the merchant computer;
request a data string be digitally signed by the Mobile electronic transaction device;
receive a digitally signed data string from the Mobile electronic transaction device;
notify the web browser of the digitally signed data string; and
forward the digitally signed data string to the merchant computer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of manufacturing a stacked-type semiconductor device, comprising:
arranging a plurality of chip stacks obtained by stacking semiconductor chips on a plurality of stages in one surface direction on a support substrate;
setting the plurality of chip stacks at a preliminary temperature;
heating each of the plurality of chip stacks in sequence at a temperature higher than the preliminary temperature, and connecting a semiconductor chip of each stage in each heated chip stack and the support substrate by wire;
performing plastic molding of each chip stack; and
separating the chip stacks from each other,
wherein the heating in units of chip stacks is performed by divided heater blocks arranged with respect to the chip stacks.
2. The method of manufacturing a stacked-type semiconductor device according to claim 1, wherein the divided heater block is selectively heated in relation to a chip stack to be wire-bonded.
3. The method of manufacturing a stacked-type semiconductor device according to claim 1, wherein the divided heater block is disposed near to a corresponding one of the chip stacks when the corresponding one of the chip stacks is wire-bonded.