What is claimed is:
1. A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring.
2. A semiconductor device according to claim 1, wherein pads of said chips are set such that a pad connected to said common signal wiring is arranged far from said independent signal terminal, and a pad connected to independent signal wiring is arranged near said independent signal terminal.
3. A semiconductor device according to claim 1, wherein said common signal wiring and independent signal wiring formed on said tape are located on the same face, and do not cross each other.
4. A semiconductor device according to claim 1, wherein said tape is a one-layer tape.
5. A semiconductor device according to claim 1, wherein said tape is a two-layer tape.
6. A semiconductor device according to claim 5, wherein a ground electric potential plane pattern and a power electric potential plane pattern are formed on a face opposed to a forming face of said common signal wiring and independent signal wiring in said two-layer tape.
7. A semiconductor device according to claim 5, wherein an insulating material is interposed between a main face of said chip and signal wiring of said two-layer tape.
8. A semiconductor device according to claim 1, wherein a passive element is mounted to said tape.
9. A semiconductor device according to claim 1, wherein a frame is arranged on one face of said tape so as to surround said chip.
10. A semiconductor device according to claim 9, wherein said frame is constructed by plastic or a metal having a good heat radiating property.
11. A semiconductor device according to claim 1, wherein a metallic plate is fixedly attached to said chip.
12. A semiconductor device according to claim 1, wherein a recognizing mark pattern is formed in said tape.
13. A semiconductor device according to claim 1, wherein an index for pin display is formed in said tape.
14. A semiconductor device according to claim 1, wherein said independent signal terminal and another independent signal terminal electrically unconnected to the chip mounted to said tare are arranged on said another side.
15. A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and the common signal terminals arranged on said one set of two opposed sides are arranged with left-right mirror symmetry.
16. A semiconductor device according to claim 15, wherein two mirror symmetry tape carrier type semiconductor devices are formed by cutting said tape along a central line on one side on which said independent signal terminal is arranged.
17. A semiconductor device according to claim 16, wherein a recognizing mark pattern is formed in said tape of each of said two mirror symmetry tape carrier type semiconductor devices.
18. A semiconductor device according to claim 16, wherein an index for pin display is formed in said tape of each of said two mirror symmetry tape carrier type semiconductor devices.
19. A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and a lead continuously extends to said common signal terminals and said independent signal terminal and is projected from said tape, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring.
20. A semiconductor device according to claim 19, wherein pads of said chips are set such that a pad connected to said common signal wiring is arranged far from said independent signal terminal, and a pad connected to independent signal wiring is arranged near said independent signal terminal.
21. A semiconductor device according to claim 19, wherein said common signal wiring and independent signal wiring formed on said tape are located on the same face, and do not cross each other.
22. A semiconductor device according to claim 19, wherein a passive element is mounted to said tape.
23. A semiconductor device according to claim 19, wherein plural support leads electrically unconnected to the mounted chip are arranged on another side opposed to the lead of said independent signal terminal.
24. A semiconductor device according to claim 19, wherein a frame is arranged on one face of said tape so as to surround said chip.
25. A semiconductor device according to claim 24, wherein said frame is constructed by plastic or a metal having a good heat radiating property.
26. A semiconductor device according to claim 19, wherein a metallic plate is fixedly attached to said chip.
27. A semiconductor device according to claim 19, wherein a recognizing mark pattern is formed in said tape.
28. A semiconductor device according to claim 19, wherein an index for pin display is formed in said tape.
29. A tape carrier type semiconductor device of a laminating type for mounting plural chips to one tape, wherein a semiconductor device having common signal terminals arranged on one set of two opposed sides, a first independent signal terminal arranged on another side, and a second independent signal terminal electrically unconnected to the chips mounted to said tape is laminated, and the first independent signal terminal at an upper stage and the second independent signal terminal at a lower stage are connected to each other, and the second independent signal terminal at the upper stage and the first independent signal terminal at the lower stage are connected to each other.
30. A semiconductor device of a laminating type according to claim 29, wherein said laminated semiconductor device is laminated by connecting said signal terminals formed on said tape to each other.
31. A semiconductor device of a laminating type according to claim 29, wherein said laminated semiconductor device has a structure in which the signal terminals are formed on the tape at the lower stage, and also has a structure constructed by a lead terminal continuously extending from said signal terminals at the upper stage, and these structures are laminated with each other.
32. A semiconductor device of a laminating type according to claim 29, wherein said laminated semiconductor device has a structure having lead terminals respectively continuously extending from the signal terminals, and is laminated by connecting said lead terminals to each other.
33. A semiconductor device of a laminating type according to claim 29, wherein a recognizing mark pattern is formed in said tape.
34. A semiconductor device of a laminating type according to claim 29, wherein an index for pin display is formed in said tape.
35. A semiconductor module mounting plural tape carrier type semiconductor devices thereto in which plural external terminals are formed on one long side of a rectangular substrate, and common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring, and plural chips are mounted to one tape, wherein said independent signal terminal is arranged along an arranging direction of said external terminals.
36. A semiconductor module according to claim 35, wherein a resin seal type semiconductor device is mounted between said external terminals and said plural tape carrier type semiconductor devices.
37. A semiconductor module according to claim 35, wherein the semiconductor module is constructed by mixing said tape carrier type semiconductor device mounting four chips onto one tape, and a tape carrier type semiconductor device in which common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and the common signal terminals arranged on said one set of two opposed sides are arranged with left-right mirror symmetry, and two chips are mounted onto one tape.
38. A semiconductor module according to claim 35, wherein a mounting face of said substrate and a chip main face are mounted such that these faces are opposed to each other.
39. A semiconductor module mounting plural tape carrier type semiconductor devices thereto in which plural external terminals are formed on one long side of a rectangular substrate, and common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and a lead continuously extends to said common signal terminals and said independent signal terminal and is projected from a tape, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring, and plural chips are mounted to one tape, wherein said independent signal terminal is arranged along an arranging direction of said external terminals.
40. A semiconductor module according to claim 39, wherein a resin seal type semiconductor device is mounted between said external terminals and said plural tape carrier type semiconductor devices.
41. A semiconductor module according to claim 39, wherein the semiconductor module is constructed by mixing said tape carrier type semiconductor device mounting four chips onto one tape, and a tape carrier tripe semiconductor device in which common signal terminals are arranged on one see of two opposed sides, and an independent signal terminal is arranged on another side, and the common signal terminals arranged on said one set of two opposed sides are arranged with left-right mirror symmetry, and two chips are mounted onto one tape.
42. A semiconductor module according to claim 39, wherein a mounting face of said substrate and a chip main face are mounted such that these faces are facing each other.
43. A semiconductor module constructed by laminating a semiconductor device in which plural external terminals are formed on one long side of a rectangular substrate, and common signal terminals are arranged on one set of two opposed sides, and a first independent signal terminal is arranged on another side, and a second independent signal terminal electrically unconnected to a chip mounted to a tape is arranged; and mounting plural tape carrier type semiconductor devices in which the first independent signal terminal at an upper stage and the second independent signal terminal at a lower stage are connected to each other, and the second independent signal terminal at the upper stage and the first independent signal terminal at the lower stage are connected to each other, and plural chips are mounted to one tape, wherein said independent signal terminal is arranged along an arranging direction of said external terminals.
44. A semiconductor module according to claim 43, wherein each of said plural tape carrier type semiconductor devices is laminated by connecting said signal terminals formed on said tape to each other.
45. A semiconductor module according to claim 43, wherein each of said plural tape carrier type semiconductor devices has a structure in which the signal terminals are formed on the tape at the lower stage, and also has a structure constructed by a lead terminal continuously extending from said signal terminals at the upper stage, and these structures are laminated with each other.
46. A semiconductor module according to claim 43, wherein each of said plural tape carrier type semiconductor devices has a structure having lead terminals respectively continuously extending from the signal terminals, and is laminated by connecting said lead terminals to each other.
47. A semiconductor module of a lead-on-board structure according to claim 43, wherein each of said plural tape carrier type semiconductor devices has a structure having lead terminals respectively continuously extending from the signal terminals, and is laminated onto the mounting substrate such that said lead terminal of the tape carrier type semiconductor device mounted at the upper stage lies across said lead terminal of the tape carrier type semiconductor device mounted at the lower stage.
48. A semiconductor module according to claim 47, wherein a lead of said tape carrier type semiconductor device at the upper stage is longer in said lead-on-board structure.
49. A semiconductor module according to claim 43, wherein a resin seal type semiconductor device is mounted between said external terminals and said plural tape carrier terse semiconductor devices.
50. A semiconductor module according to claim 43, wherein the semiconductor module is constructed by mixing said tape carrier type semiconductor device mounting four chips onto one tape, and a tape carrier type semiconductor device in which common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and the common signal terminals arranged on said one set of two opposed sides are arranged with left-right mirror symmetry, and two chips are mounted onto one tape.
51. A semiconductor module according to claim 43, wherein a mounting face of said substrate and a chip main face are mounted such that these faces are facing each other.
52. A manufacturing method of a semiconductor device comprising a process for preparing a series of tapes in which plural semiconductor chips are mounted to the series of tapes, and common signal terminals are formed so as to divide said semiconductor chips every plural semiconductor chips, and plural independent signal terminals are formed along one side of said plural semiconductor chips in a direction perpendicular to said common signal terminals; and a process for forming the common signal terminals along both sides of said plural semiconductor chips by cutting the tapes approximately along a central line of said common signal terminals so as to divide said common signal terminals into two portions; wherein a tape carrier type semiconductor device having said plural semiconductor chips on one tape is completed by cutting the tapes so as to expose said plural independent signal terminals to a side face of said tapes.
53. A manufacturing method of a semiconductor device according to claim 52, wherein the tape carrier type semiconductor device mounting said plural chips thereto is divided into two portions between said semiconductor chips approximately at centers of said common signal terminals on both sides.
54. A manufacturing method of a semiconductor device according to claim 52, wherein the tapes are cut every four chips when the tape carrier type semiconductor device mounting said plural chips thereto is completed.
55. A manufacturing method of a semiconductor device according to claim 54, wherein the tape carrier type semiconductor device mounting said four chips thereto is cut in a unit of two chips between said semiconductor chips approximately at a center of said common signal terminals.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for learning ranking functions to determine the ranking of one or more content items that are responsive to a query, the method comprising:
generating one or more training sets comprising one or more content item-query pairs;
determining preference data for the one or more query-content item pairs of the one or more training sets;
determining labeled data for the one or more query-content item pairs of the one or more training sets;
determining a ranking function based upon the preference data and the labeled data for the one or more content-item query pairs of the one or more training sets; and
storing the ranking function for application to query-content item pairs not contained in the one or more training sets.
2. The method of claim 1, wherein determining a ranking function based upon the preference data and the labeled data for the one or more content-item query pairs of the one or more training sets further comprises determining a ranking function by deriving a boosted ranking function algorithm using a regression method based upon quadratic approximation.
3. The method of claim 1 comprising utilizing one or more regularization parameters to control parameters of the ranking function.
4. The method of claim 1 wherein generating one or more training sets comprising one or more query-content item pairs further comprises extracting query dependent features for the one or more content item-query pairs.
5. The method of claim 1 wherein generating one or more training sets comprising one or more query-content item pairs further comprises extracting query independent features for the one or more content item-query pairs.
6. The method of claim 1 wherein generating one or more training sets comprising one or more query-content item pairs further comprises providing a given query-content item pair to a human subject to determine a relevance label.
7. The method of claim 1 wherein generating one or more training sets comprising one or more query-content item pairs further comprises determining a relevance label based on historical click through data for a given content item-query pair.
8. The method of claim 1 further comprising applying the ranking function to a new content item in response to receipt of a query from a user.
9. The method of claim 8 wherein applying the ranking function to a new content item in response to receipt of a query from a user, further comprises:
retrieving one or more content items in a result set in response to receipt of the query from the user;
determining a feature vector for a given content item in the result set;
applying the ranking function to the feature vector for the given content item; and
generating a ranking score for the given content item.
10. The method claim 9 further comprising ordering the given item in the result set according to the ranking score for the given content item.
11. The method of claim 10 further comprising transmitting the result set to the user.
12. Computer readable media comprising program code that when executed by a programmable processor causes execution of a method for learning ranking functions to determine the ranking of one or more content items that are responsive to a query, the computer readable media comprising:
program code for generating one or more training sets comprising one or more content item-query pairs;
program code determining preference data for the one or more query-content item pairs of the one or more training sets;
program code determining labeled data for the one or more query-content item pairs of the one or more training sets;
program code determining a ranking function based upon the preference data and the labeled data for the one or more content-item query pairs of the one or more training sets; and
program code storing the ranking function for application to query-content item pairs not contained in the one or more training sets.
13. The computer readable media of claim 12, wherein program code for determining a ranking function based upon the preference data and the labeled data for the one or more content-item query pairs of the one or more training sets further comprises program code for determining a ranking function by deriving a boosted ranking function algorithm using a regression method based upon quadratic approximation.
14. The computer readable media of claim 12 comprising utilizing one or more regularization parameters to control parameters of the ranking function.
15. The computer readable media of claim 12 wherein program code for generating one or more training sets comprising one or more query-content item pairs further comprises program code for extracting query dependent features for the one or more content item-query pairs.
16. The computer readable media of claim 12 wherein program code for generating one or more training sets comprising one or more query-content item pairs further comprises program code for extracting query independent features for the one or more content item-query pairs.
17. The computer readable media of claim 12 wherein program code for generating one or more training sets comprising one or more query-content item pairs further comprises program code for providing a given query-content item pair to a human subject to determine a relevance label.
18. The computer readable media of claim 12 wherein program code for generating one or more training sets comprising one or more query-content item pairs further comprises program code for determining a relevance label based on historical click through data for a given content item-query pair.
19. The computer readable media of claim 12 further comprising program code for applying the ranking function to a new content item in response to receipt of a query from a user.
20. The computer readable media of claim 19 wherein program code for applying the ranking function to a new content item in response to receipt of a query from a user, further comprises:
program code for retrieving one or more content items in a result set in response to receipt of the query from the user;
program code for determining a feature vector for a given content item in the result set;
program code for applying the ranking function to the feature vector for the given content item; and
program code for generating a ranking score for the given content item.
21. The computer readable media of claim 20 further comprising program code for ordering the given item in the result set according to the ranking score for the given content item.
22. The computer readable media of claim 21 further comprising program code for transmitting the result set to the user.
23. A system for learning ranking functions to determine the ranking of one or more content items that are responsive to a query, the system comprising:
a computer network;
a search engine operative to receive a search query comprising one or more terms from a user and to locate and retrieve one or more content items and related information responsive to the search query;
an indexing component operative to parse the search query into one or more constituent terms and generate an index that defines a structure for the content items and related information that allows for location and retrieval of the content items and related information;
an index data store operative to store the one or more indexes generated by the indexing component;
a persistent data store operative to store a historical log of queries that users submit; and
a ranking engine operative to,
generate one or more training sets comprising one or more content item-query pairs,
determine preference data for the one or more query-content item pairs of the one or more training sets,
determine labeled data for the one or more query-content item pairs of the one or more training sets,
determine a ranking function based upon the preference data and the labeled data for the one or more content-item query pairs of the one or more training sets, and
store the ranking function for application to query-content item pairs not contained in the one or more training sets.
24. The system of claim 23, wherein the ranking engine is operative to determine a ranking function by deriving a boosted ranking function algorithm using a regression method based upon quadratic approximation.
25. The system of claim 23, wherein the ranking engine is operative to utilize one or more regularization parameters to control parameters of the ranking function.
26. The system of claim 23, wherein the ranking engine is operative to extract query dependent features for the one or more content item-query pairs.
27. The system of claim 23, wherein the ranking engine is operative to extract query independent features for the one or more content item-query pairs.
28. The system of claim 23, wherein the ranking engine is operative to provide a given query-content item pair to a human subject to determine a relevance label.
29. The system of claim 23, wherein the ranking engine is operative to determine a relevance label based on a historical log of click through data for a given content item-query pair.
30. The system of claim 23, wherein the ranking engine is operative to apply the ranking function to a new content item in response to receipt of a query from a user.
31. The system of claim 30, wherein
the search engine is operative to retrieve one or more content items in a result set in response to receipt of the query from the user; and
the ranking engine is operative to
determine a feature vector for a given content item in the result set,
apply the ranking function to the feature vector for the given content item, and
generate a ranking score for the given content item.
32. The system of claim 31, wherein the search engine is operative to order the given item in the result set according to the ranking score for the given content item.
33. The system of claim 32, wherein the search engine is operative to transmit the result set to the user.