1. A heat dissipation device comprising:
a heat spreader for contacting a heat-generating component;
a fin assembly located above the heat spreader, the fin assembly comprising a plurality of horizontal fins stacked on each other;
a heat pipe comprising a first section thermally contacting with the heat spreader, a pair of first legs extending from opposite ends of the first section, respectively, and away from the heat spreader, and a second leg bent from one of the first legs towards the heat spreader, the first and second legs extending through the horizontal fins and having the horizontal fins mounted thereon; and
a heat sink sandwiched between the heat spreader and the fin assembly.
2. The heat dissipation device as claimed in claim 1, wherein the heat pipe further comprises another second leg bent from the other first leg towards the heat spreader and passing through the horizontal fins.
3. The heat dissipation device as claimed in claim 1, wherein the heat sink comprises a base facing the heat spreader, a plurality of fins extending from the base, a slot defined through the heat sink to provide a void for the heat pipes passing through to contact with the heat spreader, a pair of holes defined beside opposite sides of the slot to receive free ends of the second legs.
4. The heat dissipation device as claimed in claim 3, wherein a groove is diagonally defined in the heat spreader, and the first section of the heat pipe passes through the slot defined in the heat sink and is accommodated in the groove.
5. The heat dissipation device as claimed in claim 1, wherein each horizontal fin comprises a pair of flakes each having a plurality of semicircular flanges, the semicircular flanges of the flakes together form a plurality of circular passages for the first and second legs of heat pipe extending therethrough and fixed therein.
6. The heat dissipation device as claimed in claim 1, further comprising another heat pipe thermally connecting the heat spreader and the fin assembly together, the another heat pipe comprises a first section thermally contacting with the heat spreader, a pair of first legs extending from opposite ends of the first section, respectively, and away from the heat spreader, and a second leg bent from each of the first legs towards the heat spreader, the first and second legs extending through the horizontal fins and having the horizontal fins mounted thereon.
7. The heat dissipation device as claimed in claim 6, wherein each horizontal fin comprises a first flake sandwiched between the two heat pipes, and a pair of second flakes located at opposite sides of the first flake and contacting the heat pipes respectively.
8. The heat dissipation device as claimed in claim 7, wherein a plurality of semicircular flanges is formed on adjacent edges of the first and second flakes, and the semicircular flanges form a plurality of circular passages on joints of the first and second flakes for the first and second legs of heat pipes extending therethrough and fixed therein.
9. A heat dissipation device comprising:
a heat spreader having a bottom surface for contacting with a heat-generating component and an upper surface having a groove defined therein;
a heat pipe comprising an evaporator accommodated in the groove of the heat spreader, a pair of inverted U-shaped condensers formed at opposite ends of the evaporator, respectively, and away from the heat spreader;
a fin assembly located above the heat spreader, the fin assembly comprising a plurality of horizontal fins stacked on each other and mounted on the inverted U-shaped condensers of the heat pipe; and
a heat sink sandwiched between the heat spreader and the fin assembly.
10. The heat dissipation device as claimed in claim 9, wherein the heat sink comprises a base facing the upper surface of the heat spreader, a plurality of fins extending from the base, a slot defined through the heat sink to provide a void for the heat pipe passing through and accommodated in the groove, a pair of holes defined beside opposite sides of the slot to receive free ends of the inverted U-shaped condensers of the heat pipe.
11. The heat dissipation device as claimed in claim 9, wherein each horizontal fin comprises a pair of flakes each having a plurality of semicircular flanges, the semicircular flanges of the flakes together form a plurality of circular passages for the inverted U-shaped condensers of the heat pipe extending therethrough and fixed therein.
12. The heat dissipation device as claimed in claim 9, further comprising another heat pipe, and the another heat pipe comprises an evaporator and a condenser thermally connecting the heat spreader and the fin assembly respectively.
13. The heat dissipation device as claimed in claim 12, wherein each horizontal fin comprises a first flake sandwiched between the two heat pipes, and a pair of second flakes located at opposite sides of the first flake and contacting the heat pipes respectively.
14. The heat dissipation device as claimed in claim 13, wherein a plurality of semicircular flanges is formed on adjacent edges of the first and second flakes, and the semicircular flanges form a plurality of circular passages on opposite edges of the first flake for the condensers of the heat pipes extending therethrough and fixed therein.
15. A heat dissipation device comprising:
a serpentine heat pipe having a horizontal section adapted for thermally connecting with a heat generating electronic component and two parallel vertical sections extending from each of two ends of the horizontal section;
a fin assembly having a plurality of horizontal fins through which the two parallel vertical sections of the heat pipe extend, wherein the two parallel vertical sections are fixed to and thermally connect with the horizontal fins; and
a heat sink having a base defining a slot receiving the horizontal section of the heat pipe and a plurality of fins extending toward the fin assembly.
16. The heat dissipation device of claim 15, wherein each of the horizontal fins comprises a plurality of flakes connected together.
17. The heat dissipation device of claim 15 further comprising a heat spreader fixed to a bottom surface of the heat sink and thermally connecting with horizontal section of the heat pipe.
18. The heat dissipation device of claim 17, wherein the heat spreader is made of copper and defines a groove extending diagonally therein, the groove receiving the horizontal section of the heat pipe therein.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An electro-optical apparatus that constitutes electro-optical devices having a laminated structure including a first electrode layer formed above an effective area of a substrate, and a second electrode layer formed above the first electrode layer, the electro-optical apparatus including:
first power lines that supply a voltage to the first electrode layer; and
second power lines electrically connected to the second electrode layer,
both the first and second power lines being arranged above the effective area, and being arranged in the same layer as the first electrode layer or in a layer below the first electrode layer; and
the second power lines function as a cathode auxiliary wiring, and the second power lines being arranged in column and row directions of the effective area.
2. The electro-optical apparatus according to claim 1,
the second power lines arranged in the column direction and the second power lines arranged in the row direction being formed in different layers via an interlayer insulating film, and both being electrically connected via a contact hole formed in the interlayer insulating film.
3. The electro-optical apparatus according to claim 2,
the second power lines being formed in a line state in a predetermined dispersion density in any of the layers forming the interlayer laminated structure.
4. The electro-optical apparatus according to claim 3,
an arrangement pitch of the second power lines being at a substantially equal interval.
5. The electro-optical apparatus according to claim 1,
the second electrode layer has light transmissivity.
6. The electro-optical apparatus according to claim 1,
the electro-optical devices being electroluminescent devices.
7. An electronic unit, comprising:
the electro-optical apparatus according to claim 1.
8. An electro-optical apparatus provided with a plurality of pixels including electro-optical devices having a laminated structure including a first electrode layer formed above an effective area of a substrate, and a second electrode layer formed above the first electrode layer, the electro-optical apparatus including:
first power lines that supply a voltage to the first electrode layer,
second power lines electrically connected to the second electrode layer; and
a plurality of scanning lines and data lines connected to the plurality of pixels,
the first and second power lines being arranged above the effective area, and being arranged in the same layer as the first electrode layer or in a layer below the first electrode layer; and
the wiring layout of the second power lines within the effective area being line symmetrical to arbitrary pixels arranged in parallel to the scanning lines or the data lines.
9. The electro-optical apparatus according to claim 8,
a line width of the second power lines being substantially the same as a combined line width of two of the scanning lines.
10. The electro-optical apparatus according to claim 8,
a line width of the second power lines is substantially the same as a combined line width of two of the data lines.
11. An electro-optical apparatus comprising:
a substrate:
a first electrode disposed above the substrate;
a second electrode disposed over the first electrode; and
an auxiliary wiring electrically connected to the second electrode, the auxiliary wiring being disposed between the substrate and the first electrode and the first electrode being electrically separate from the auxiliary wiring.
12. The electro-optical apparatus according to claim 11, a planarizing layer being disposed between the second electrode and the substrate.
13. An electro-optical apparatus comprising:
a substrate;
a data line disposed above the substrate;
a first electrode disposed above the data line;
a second electrode disposed over the first electrode; and
an auxiliary wiring electrically connected to the second electrode,
the auxiliary wiring being disposed in the same layer as the data line and the first electrode being electrically separate from the auxiliary wiring.
14. An electro-optical apparatus comprising:
a substrate;
a scanning line disposed above the substrate;
a first electrode disposed above the scanning line;
a second electrode disposed over the first electrode; and
an auxiliary wiring electrically connected to the second electrode,
the auxiliary wiring being disposed in the same layer as the scanning line and the first electrode being electrically separate from the auxiliary wiring.