1. A method for manufacturing an electronic device having an element including an insulating metal oxide film serving as a ferroelectric film or a high dielectric constant film,
wherein in a cleaning step conducted after a step of forming the insulating metal oxide film, dry cleaning is used such that the ferroelectric film or the high dielectric constant film or a periphery region thereof does not directly contact water, and
after the cleaning step, heat treatment is conducted at a temperature at which water remaining near the element is diffused to the ferroelectric film or the high dielectric constant film.
2. A method for manufacturing an electronic device having an element including an insulating metal oxide film serving as a ferroelectric film or a high dielectric constant film, comprising the step of:
forming an interlayer insulating film so as to cover the element after formation of the element,
wherein in a cleaning step conducted after a step of forming the interlayer insulating film, dry cleaning is used such that the ferroelectric film or the high dielectric constant film or a periphery region thereof does not directly contact water, and
after the cleaning step, heat treatment is conducted at a temperature at which water remaining near the element is diffused to the ferroelectric film or the high dielectric constant film.
3. A method for manufacturing an electronic device having an element including an insulating metal oxide film serving as a ferroelectric film or a high dielectric constant film,
wherein in a cleaning step conducted after a step of forming the insulating metal oxide film, a cleaning solution containing substantially no water is used such that the ferroelectric film or the high dielectric constant film or a periphery region thereof does not directly contact water, and
after the cleaning step, heat treatment is conducted at a temperature at which water remaining near the element is diffused to the ferroelectric film or the high dielectric constant film.
4. A method for manufacturing an electronic device having an element including an insulating metal oxide film serving as a ferroelectric film or a high dielectric constant film, comprising the step of:
forming an interlayer insulating film so as to cover the element after formation of the element,
wherein in a cleaning step conducted after a step of forming the interlayer insulating film, a cleaning solution containing substantially no water is used such that the ferroelectric film or the high dielectric constant film or a periphery region thereof does not directly contact water, and
after the cleaning step, heat treatment is conducted at a temperature at which water remaining near the element is diffused to the ferroelectric film or the high dielectric constant film.
5. A method for manufacturing an electronic device having an element including an insulating metal oxide film serving as a ferroelectric film or a high dielectric constant film,
wherein in a cleaning step conducted after a step of forming the insulating metal oxide film, at least one selected from the group consisting of organic cleaning using an organic solvent, Ar aerosol cleaning, CO2 cleaning, UV cleaning, and cleaning using CO2 in a supercritical state is used such that the ferroelectric film, the high dielectric constant film or a periphery region thereof does not directly contact water,
ashing is not used in the cleaning step, and
after the cleaning step, heat treatment is conducted at a temperature at which water remaining near the element is diffused to the ferroelectric film or the high dielectric constant film.
6. A method for manufacturing an electronic device having an element including an insulating metal oxide film serving as a ferroelectric film or a high dielectric constant film, comprising the step of:
forming an interlayer insulating film so as to cover the element after formation of the element,
wherein in a cleaning step conducted after a step of forming the interlayer insulating film, at least one selected from the group consisting of organic cleaning using an organic solvent, Ar aerosol cleaning, CO2 cleaning, UV cleaning, and cleaning using CO2 in a supercritical state is used such that the ferroelectric film or the high dielectric constant film or a periphery region thereof does not directly contact water,
ashing is not used in the cleaning step, and
after the cleaning step, heat treatment is conducted at a temperature at which water remaining near the element is diffused to the ferroelectric film or the high dielectric constant film.
7. The method according to claim 1, wherein the element is at least partially exposed in the cleaning step.
8. The method according to claim 1, wherein the dry cleaning is Ar aerosol cleaning, CO2 cleaning, UV cleaning, or cleaning using CO2 in a supercritical state.
9. The method according to claim 2, wherein the interlayer insulating film is at least partially exposed in the cleaning step.
10. The method according to claim 2, wherein the dry cleaning is Ar aerosol cleaning, CO2 cleaning, UV cleaning, or cleaning using CO2 in a supercritical state.
11. The method according to claim 3, wherein the element is at least partially exposed in the cleaning step.
12. The method according to claim 3, wherein the cleaning solution is an organic solvent.
13. The method according to claim 4, wherein the interlayer insulating film is at least partially exposed in the cleaning step.
14. The method according to claim 4, wherein the cleaning solution is an organic solvent.
15. The method according to claim 5, wherein the element is at least partially exposed in the cleaning step.
16. The method according to claim 5, wherein the interlayer insulating film is at least partially exposed in the cleaning step.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A cleaning device for cleaning a carpet having face yarns that extend over a distance of several millimeters from a generally planar backings to define a carpet surface, comprising:
an oscillator unit, including:
an oscillator;
an oscillation space that is at least partially defined by or accommodates at least part of the oscillator, and that is accessible through a jet opening via which ambient fluid is alternatingly drawn into the oscillation space and expelled from the oscillation space during operation of the oscillator;
a nozzle, including
a support structure configured to support the nozzle against the carpet, including a carpet surface penetrator that defines said jet opening and protrudes from the support structure such that, in a supported condition of the nozzle in which the support structure is supported against a carpet, the carpet surface penetrator penetrates the carpet surface and the jet opening is disposed at least partially below the support structure and the carpet surface.
2. The cleaning device according to claim 1, wherein, in the supported condition of the nozzle against the carpet, the penetrator penetrates the carpet surface and the jet opening is disposed substantially below the carpet surface.
3. The cleaning device according to claim 1, wherein, in the supported condition of the nozzle against the carpet, the penetrator penetrates the carpet surface and the jet opening is disposed in between 0.5 and 2 mm below the carpet surface.
4. The cleaning device according to claim 1, wherein the support structure includes a generally planar, external support surface for supporting the nozzle against the carpet surface, and wherein at least part of the penetrator protrudes outwardly from the external support surface, such that the jet opening defined by the penetrator is at least partially disposed outward of the support surface.
5. The cleaning device according to claim 4, wherein at least part of the penetrator protrudes outwardly from the external support surface, such that the jet opening defined by the penetrator is substantially disposed outward of the support surface, in particular at a distance in the range of 0.5-2 mm there from.
6. The cleaning device according to claim 1, wherein the oscillation space defines a jet channel at an end of which the jet opening is provided, and
wherein the jet channel, at the jet opening, extends outwardly in a jet direction (J).
7. The cleaning device according to claim 6, wherein the jet direction (J), in the supported condition of the nozzle against the carpet, faces away from the carpet’s backing.
8. The cleaning device according to claim 7, wherein the jet direction (J), in the supported condition of the nozzle against the carpet, includes an angle in the range of 15-45 degrees with the carpet’s backing.
9. The cleaning device according to claim 6, wherein the jet channel, at the jet opening, is defined by a jet channel wall having a first section and a second section,
wherein, in the supported condition of the nozzle against the carpet, the first section is proximal to the carpet’s backing while the second section is distal to the carpet’s backing, and
wherein the second section extends beyond the first section in the jet direction (J).
10. The cleaning device according to claim 9, wherein the second section extends 0.5-5 mm beyond the first section.
11. The cleaning device according to claim 1, configured such that, during operation, the following criterion is achievable:
f
\xb7
d
v
\u2264
1
,
wherein \u0192 is the frequency of the oscillator, d is a characteristic dimension of the jet opening, and v is an average fluid velocity at the jet opening when fluid is expelled from the oscillation space.
12. The cleaning device according to claim 1, further comprising:
a fluid suction unit, including:
a dirt discharge duct having a suction end that, in the supported condition of the nozzle against the carpet, faces the carpet;
a fluid flow generator, operably connected to the dirt discharge duct, and configured to generate a fluid flow through the dirt discharge duct by effecting under pressure at the suction end;
including the jet opening of the oscillator unit faces the suction end of the dirt discharge duct, such that, during operation, fluid expelled from the oscillation space through the jet opening is effectively injected into the generated fluid flow at the suction end and entrained therein.