What is claimed is:
1. A method for manufacturing a master substrate for producing a grooved molding substrate, comprising:
a preparing step that prepares a substrate on which a photoresist is coated;
an exposing step that exposes the photoresist to light with a predetermined pattern such that the exposed part corresponds to a land of the grooved molding substrate to be produced; and
a developing step that obtains the master substrate by developing the photoresist.
2. A method for manufacturing a master substrate for producing a grooved molding substrate, comprising:
a preparing step that prepares a substrate on which a photoresist is coated;
an exposing step that exposes the photoresist to light with a predetermined pattern such that the exposed part corresponds to a land of the grooved molding substrate to be produced;
a developing step that forms a resist pattern by developing the photoresist, the resist pattern exposing a part of the substrate;
an etching step that etches the part of the substrate exposed in the developing step; and
a removing step that obtains the master substrate by removing the photoresist.
3. A method for manufacturing a master substrate for use in producing a grooved molding substrate, comprising:
a first step that prepares a substrate on which a photoresist is coated;
a second step that exposes the photoresist with exposing light, the resultant photoresist having a portion that is exposed to the exposing light and a portion that is not exposed to the exposing light, the exposed portion corresponding to a land of the grooved molding substrate to be produced, the unexposed portion corresponding to a groove of the grooved molding substrate to be produced; and
a third step that obtains the master substrate by developing the photoresist exposed in the second step.
4. The method according to claim 3, wherein the second step includes the steps of:
forming a part corresponding to a first land of the grooved molding substrate to be produced, by illuminating and exposing the photoresist along a first line with the exposing light;
moving an illuminating position from the first line to a second line that is separated from the first line by a distance corresponding to the sum of a groove width Gw and a land width Lw of the grooved molding substrate to be produced; and
forming a part corresponding to a second land of the grooved molding substrate to be produced, by illuminating and exposing the photoresist along the second line with the exposing light.
5. The method according to claim 4, wherein the groove width Gw is about 0.1 m or less.
6. The method according to claim 4, wherein the groove width Gw is about 0.06 m or less.
7. The method according to claim 4, wherein the groove of the grooved molding substrate is at least one of a pit, a hollow, and discontinuity.
8. The method according to claim 4, wherein the step of moving an illuminating position from the first line to a second line and the step of forming a part corresponding to a second land of the grooved molding substrate to be produced are repeated in that order a plurality of times by successively regarding the second line in the previous execution of the two steps as the first line in the repetition.
9. The method according to claim 3, wherein the second step includes a step that forms a part corresponding to a spiral-shaped land of the grooved molding substrate to be produced, by illuminating and exposing the photoresist along a spiral line, the spiral line having an interval corresponding to the sum of a groove width Gw and a land width Lw of the grooved molding substrate to be produced.
10. The method according to claim 9, wherein the groove width Gw is about 0.1 m or less.
11. The method according to claim 9, wherein the groove width Gw is about 0.06 m or less.
12. The method according to claim 9, wherein the groove of the grooved molding substrate is at least one of a pit, a hollow, and discontinuity.
13. A method for manufacturing a master substrate for use in producing a grooved molding substrate, comprising:
a first step that prepares a substrate on which a photoresist is coated;
a second step that exposes the photoresist with exposing light, the resultant photoresist having a portion that is exposed to the exposing light and a portion that is not exposed to the exposing light, the exposed portion corresponding to a land of the grooved molding substrate to be produced, the unexposed portion corresponding to a groove of the grooved molding substrate to be produced;
a third step that obtains a resist pattern by developing the photoresist exposed in the second step;
a fourth step that etches a part of the substrate in accordance with the resist pattern; and
a fifth step that removes the photoresist from the substrate processed in the third step to obtain the master substrate for use in producing the grooved molding substrate.
14. The method according to claim 13, wherein the second step includes the steps of:
forming a part corresponding to a first land of the grooved molding substrate to be produced, by illuminating and exposing the photoresist along a first line with the exposing light;
moving an illuminating position from the first line to a second line that is separated from the first line by a distance corresponding to the sum of a groove width Gw and a land width Lw of the grooved molding substrate to be produced; and
forming a part corresponding to a second land of the grooved molding substrate to be produced, by illuminating and exposing the photoresist along the second line with the exposing light.
15. The method according to claim 14, wherein the groove width Gw is about 0.1 m or less.
16. The method according to claim 14, wherein the groove width Gw is about 0.06 m or less.
17. The method according to claim 14, wherein the groove of the grooved molding substrate is at least one of a pit, a hollow, and discontinuity.
18. The method according to claim 14, wherein the step of moving an illuminating position from the first line to a second line and the step of forming a part corresponding to a second land of the grooved molding substrate to be produced are repeated in that order a plurality of times by successively regarding the second line in the previous execution of the two steps as the first line in the repetition.
19. The method according to claim 13, wherein the second step includes a step that forms a part corresponding to a spiral-shaped land of the grooved molding substrate to be produced, by illuminating and exposing the photoresist along a spiral line, the spiral line having an interval corresponding to the sum of a groove width Gw and a land width Lw of the grooved molding substrate to be produced.
20. The method according to claim 19, wherein the groove width Gw is about 0.1 m or less.
21. The method according to claim 19, wherein the groove width Gw is about 0.06 m or less.
22. The method according to claim 19, wherein the groove of the grooved molding substrate is at least one of a pit, a hollow, and discontinuity.
23. A method for manufacturing a stamper for producing a grooved molding substrate, comprising the steps of:
obtaining a master substrate manufactured using the method according to any one of claims 1-4, 9, 13-14, and 19 using a positive type photoresist as the photoresist;
forming a replica from the master substrate, the replica having a surface profile that is reverse of the surface profile of the master substrate; and
producing the stamper from the replica using an electroforming method.
24. The method for manufacturing a stamper for producing a grooved molding substrate according to claim 23, wherein the replica is made of at least one of a metal and a resin.
25. A method for manufacturing a stamper for producing a grooved molding substrate, comprising the steps of:
obtaining a master substrate manufactured using the method according to any one of claims 1-4, 9, 13-14, and 19 using a negative type photoresist as the photoresist, and producing the stamper from the master substrate using an electroforming method.
26. A method for manufacturing a stamper comprising steps of:
a preparing step that prepares a substrate on which a photoresist is coated;
an exposing step that exposes the photoresist to light with a predetermined pattern;
a developing step that forms a resist pattern by developing the photoresist;
an etching step that etches a part of the substrate not covered by the photoresist;
a removing step that obtains a master substrate by removing the photoresist;
a replica forming step that forms a resin replica from the master substrate; and
a stamper producing step that produces the stamper from the replica using an electroforming method.
27. A method for manufacturing a grooved molding substrate comprising the steps of:
obtaining a stamper manufactured using the method of claim 23; and
producing the grooved molding substrate by forming one of a glass and a resin with the stamper.
28. A method for manufacturing a grooved molding substrate comprising the steps of:
obtaining a stamper manufactured using the method of claim 25, and
producing the grooved molding substrate by forming one of a glass and a resin with the stamper.
29. A grooved molding substrate manufactured by an injection molding method using a stamper, wherein the groove width Gw is about 0.1 m or less.
30. The grooved molding substrate according to claim 29, wherein the groove width Gw is about 0.06 m or less.
31. The grooved molding substrate according to claim 29, wherein the slope angle of the sidewall of the groove is about 85 or more.
32. The grooved molding substrate according to claim 29, wherein the ratio of the groove depth d to the groove width Gw is about 0.1 or more.
33. The grooved molding substrate according to claim 29, wherein the groove is at least one of a pit and a discontinuity.
34. A memory medium a substrate of which is manufactured by the method for manufacturing a grooved molding substrate according to claim 27.
35. A memory medium a substrate of which is manufactured by the method for manufacturing a grooved molding substrate according to claim 28.
36. A memory medium a substrate of which is the grooved molding substrate of claim 29.
37. A memory device having the memory medium according to claim 34.
38. A memory device having the memory medium according to claim 35.
39. A memory device having the memory medium according to claim 36.
40. A computer having the memory device according to claim 37.
41. A computer having the memory device according to claim 38.
42. A computer having the memory device according to claim 39.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for manufacturing an image sensor, comprising:
forming an oxide layer on a color filter layer;
etching the oxide layer to form a first oxide layer microlens;
forming a second oxide layer microlens on the first oxide layer microlens;
performing a chemical treatment on the second oxide layer microlens; and
forming a third oxide layer microlens on the second oxide layer microlens after performing the chemical treatment.
2. The method according to claim 1, wherein performing the chemical treatment comprises applying a chemical to the second oxide layer microlens, wherein the chemical comprises TMH, H2O2 and H2O.
3. The method according to claim 2, wherein etching the oxide layer comprises using a photoresist pattern as an etching mask.
4. The method according to claim 2, wherein etching the oxide layer to form the first oxide layer microlens comprises:
depositing a photoresist pattern on the oxide layer;
forming a microlens pattern by performing a reflow process on the photoresist pattern; and
etching the oxide layer using the microlens pattern as an etching mask.
5. The method according to claim 2, wherein performing the chemical treatment comprises performing the chemical treatment for about 1 minute to about 5 minutes.
6. The method according to claim 2, wherein the chemical comprises about 1.5 to about 2.3 times as much H2O2 as TMH, and wherein the chemical comprises about 20 to about 36.7 times as much H2O as TMH.
7. The method according to claim 6, wherein performing the chemical treatment comprises performing the chemical treatment for about 1 minute to about 5 minutes.
8. The method according to claim 6, wherein etching the oxide layer comprises using a photoresist pattern as an etching mask.
9. The method according to claim 6, wherein etching the oxide layer to form the first oxide layer microlens comprises:
depositing a photoresist pattern on the oxide layer;
forming a microlens pattern by performing a reflow process on the photoresist pattern; and
etching the oxide layer using the microlens pattern as an etching mask.
10. The method according to claim 1, wherein performing the chemical treatment comprises performing the chemical treatment for about 1 minute to about 5 minutes.
11. The method according to claim 1, wherein etching the oxide layer comprises using a photoresist pattern as an etching mask.
12. The method according to claim 1, wherein etching the oxide layer to form the first oxide layer microlens comprises:
depositing a photoresist pattern on the oxide layer;
forming a microlens pattern by performing a reflow process on the photoresist pattern; and
etching the oxide layer using the microlens pattern as an etching mask.
13. The method according to claim 1, wherein etching the oxide layer comprises using a photoresist pattern as an etching mask.
14. The method according to claim 1, wherein etching the oxide layer to form the first oxide layer microlens comprises:
depositing a photoresist pattern on the oxide layer;
forming a microlens pattern by performing a reflow process on the photoresist pattern; and
etching the oxide layer using the microlens pattern as an etching mask.
15. The method according to claim 1, wherein forming the oxide layer comprises depositing the oxide layer at a temperature of about 200\xb0 C. or less.
16. The method according to claim 1, wherein forming the oxide layer comprises depositing the oxide layer to a thickness of about 700 nm to about 800 nm.
17. The method according to claim 1, wherein forming the second oxide layer microlens comprises forming a second oxide layer on the first oxide layer microlens to a thickness of about 100 nm to about 300 nm.
18. The method according to claim 1, wherein forming the third oxide layer microlens comprises forming a third oxide layer on the second oxide layer microlens to a thickness of about 100 nm to about 300 nm.
19. The method according to claim 1, wherein the second oxide layer microlens comprises a low temperature oxide.