1. A compound semiconductor device, comprising:
a substrate;
a compound semiconductor layer disposed over the surface of the substrate;
a source electrode, a drain electrode and a gate electrode formed over the compound semiconductor layer;
an opening penetrates the substrate and formed in the compound semiconductor layer under a position with the source electrode;
a local p-type region partially formed in the compound semiconductor layer under the position with the source electrode, which is exposed at a bottom of the opening; and
a rear electrode made of a conductive material, the rear electrode being disposed in the opening so as to be connected to the local p-type region,
wherein the local p-type region is in a distant position with the source electrode.
2. The compound semiconductor device according to claim 1, wherein the substrate is one of insulating and semi-insulating, and wherein the rear electrode covers inner wall and the bottom of the opening.
3. The compound semiconductor device according to claim 1, wherein the opening lies under the source electrode so as to be aligned with the source electrode.
4. The compound semiconductor device according to claim 1, further comprising a source line formed over the compound semiconductor layer, wherein the opening lies under the source line so as to be aligned with the source line.
5. The compound semiconductor device according to claim 1, further comprising a source line and a gate line formed over the compound semiconductor layer, wherein the opening lies under a region where the source line and the gate line are disposed, so as to be aligned with the region.
6. A power supply device, comprising:
a high-voltage circuit including a transistor;
a low-voltage circuit; and
a transformer between the high-voltage circuit and the low-voltage circuit,
wherein the transistor includes
a substrate,
a compound semiconductor layer disposed over the surface of the substrate,
a source electrode, a drain electrode and a gate electrode formed over the compound semiconductor layer,
an opening penetrates the substrate and formed in the compound semiconductor layer under a position with the source electrode,
a local p-type region partially formed in the compound semiconductor layer under the position with the source electrode, which is exposed at a bottom of the opening, and
a rear electrode made of a conductive material, the rear electrode being disposed in the opening so as to be connected to the local p-type region,
wherein the local p-type region is in a distant position with the source electrode.
7. A high-frequency amplifier that amplifies a high-frequency input voltage, the high-frequency amplifier, comprising:
a power amplifier configured to amplifies a mixed signal of a compensated input signal and a AC signal, the power amplifier includes a transistor,
wherein the transistor including
a substrate,
a compound semiconductor layer disposed over the surface of the substrate,
a source electrode, a drain electrode and a gate electrode formed over the compound semiconductor layer,
an opening penetrates the substrate and formed in the compound semiconductor layer under a position with the source electrode is formed,
a local p-type region partially formed in the compound semiconductor layer under the position with the source electrode, which is exposed at a bottom of the opening, and
a rear electrode made of a conductive material, the rear electrode being disposed in the opening so as to be connected to the local p-type region,
wherein the local p-type region is in a distant position with the source electrode.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is
1. A soft candy unit, comprising
two half shells (1, 2) of dimensionally stable transparent plastic material,
which combine to constitute a closed spherical mold, and
which rest on one another by rims (3, 4) on a parting plane, and
which are linked to one another at least partially; and
a soft foamed sugar body (13), which rests planely on the inside of the half shells (1, 2);
wherein the soft foamed sugar body (13) forms an eyeball, the iris (10) and pupil (11) of which are arranged at the zenith of a half shell (2);
wherein the iris (10) consists of edible gum mass of transparent colors; and
wherein the pupil (11) consists of a lenticular sweet that is placed into the iris (10).
2. A soft candy unit according to claim 1, wherein the rims are flanged rims (3, 4).
3. A soft candy unit according to claim 1, wherein the rims (3, 4) are welded together.
4. A soft candy unit according to claim 1 or 2, characterized in that the rims (3, 4) are flexibly interlocked.
5. A soft candy unit according to claim 1, wherein the rims (3, 4) are linked to one another by an integral hinge (5).
6. A soft candy unit according to claim 1, wherein lugs (6, 7) are formed on the rims (3, 4).
7. A soft candy unit according to claim 1, wherein a pattern, which is allocated to the soft foamed sugar body (13), is imprinted on at least one half shell (1, 2).