1. A tonneau cover cargo containment track rail system comprising:
a cargo hold down having a base portion and a handle portion, wherein the handle portion is operably attached to the base portion for movement between an engaged position and a disengaged position; and
at least one tonneau cover rail, wherein the tonneau cover rail has a first attachment mechanism attached thereto and wherein the first attachment mechanism is adapted to engage a portion of the cargo hold down to retain the cargo hold down in engagement with the tonneau cover rail while permitting the cargo hold down to move with respect to the tonneau cover rail.
2. The tonneau cover cargo containment track rail system of claim 1, wherein at least one of the base portion and the handle portion have a tie down recess formed therein.
3. The tonneau cover cargo containment track rail system of claim 1, wherein the handle portion is biased to the engaged position.
4. The tonneau cover cargo containment track rail system of claim 1, wherein the handle portion at least partially engages a cutout formed in the tonneau cover rail when in the engaged position.
5. The tonneau cover cargo containment track rail system of claim 1, wherein the first attachment mechanism is a first channel that is defined by a first side member and a second side member, wherein the first side member and the second side member define a first width region and a second width region, wherein the first width region is greater than the second width region, and wherein the first width region is intermediate the second width region and a point at which the first side member is attached to the tonneau cover rail.
6. The tonneau cover cargo containment track rail system of claim 5, wherein the base portion includes at least one extension and wherein the base portion proximate the extension has a width that is greater than the second width and less than the first width.
7. The tonneau cover cargo containment track rail system of claim 5, wherein at least one of the first side member and the second side member includes a cutout and wherein the cutout has a profile that is larger than a profile of an extension that extends from the base portion.
8. The tonneau cover cargo containment track rail system of claim 7, wherein the extension has a semi-circular profile.
9. The tonneau cover cargo containment track rail system of claim 5, wherein at least one of the first side member and the second side member includes a plurality of cutouts, wherein at least two of the plurality of cutouts are arranged in a first spacing, wherein at least two of the plurality of cutouts are arranged in a second spacing and wherein the second spacing is smaller than the first spacing.
10. The tonneau cover cargo containment track rail system of claim 1, wherein the tonneau cover rail includes an upper rail portion and a lower rail portion, wherein upper rail portion is capable of supporting a portion of a tonneau cover and wherein the lower rail portion facilitates attachment of the tonneau cover rail to a side of a pickup bed.
11. A pickup bed covering and object restraint system comprising:
pickup bed having a pair of sides and an upwardly directed opening;
a cargo hold down having a base portion and a handle portion, wherein the handle portion is operably attached to the base portion for movement between an engaged position and a disengaged position;
a pair of tonneau cover rails, wherein one of the tonneau cover rails is attached to each of the pickup bed sides, wherein each of the tonneau cover rails has a first attachment mechanism attached thereto and wherein the first attachment mechanism is adapted to engage a portion of the cargo hold down to retain the cargo hold down in engagement with the tonneau cover rail while permitting the cargo hold down to move with respect to the tonneau cover rail; and
a tonneau cover mounted to the tonneau cover rails, wherein the tonneau cover substantially covers the upwardly directed opening when in a closed position.
12. The pickup bed covering and object restraint system of claim 11, wherein at least one of the base portion and the handle portion have a tie down recess formed therein.
13. The pickup bed covering and object restraint system of claim 11, wherein the handle portion is biased to the engaged position.
14. The pickup bed covering and object restraint system of claim 11, wherein the handle portion at least partially engages a cutout formed in the tonneau cover rail when in the engaged position.
15. The pickup bed covering and object restraint system of claim 11, wherein the first attachment mechanism comprises a first channel that is defined by a first side member and a second side member, wherein the first side member and the second side member define a first width region and a second width region, wherein the first width region is greater than the second width region, and wherein the first width region is intermediate the second width region and a point at which the first side member is attached to the tonneau cover rail.
16. The pickup bed covering and object restraint system of claim 15, wherein the base portion includes at least one extension and wherein the base portion proximate the extension has a width that is greater than the second width and less than the first width.
17. The pickup bed covering and object restraint system of claim 15, wherein at least one of the first side member and the second side member includes a cutout and wherein the cutout has a profile that is larger than a profile of an extension that extends from the base portion.
18. The pickup bed covering and object restraint system of claim 17, wherein the extension has a semi-circular profile.
19. The pickup bed covering and object restraint system of claim 15, wherein at least one of the first side member and the second side member includes a plurality of cutouts, wherein at least two of the plurality of cutouts are arranged in a first spacing, wherein at least two of the plurality of cutouts are arranged in a second spacing and wherein the second spacing is smaller than the first spacing.
20. The pickup bed covering and object restraint system of claim 11, wherein the tonneau cover rail includes an upper rail portion and a lower rail portion, wherein upper rail portion comprises a second attachment mechanism that is adapted to engage a fastening device for attaching the tonneau cover to the tonneau cover rail and wherein the lower rail portion facilitates attachment of the tonneau cover rail to a side of a pickup bed.
21. A method of covering a pickup bed and restraining objects placed in the pickup bed, wherein the method comprises:
attaching a tonneau cover rail to each side of a pickup bed, wherein each of the tonneau cover rails has a first attachment mechanism attached thereto and wherein the pickup bed has an upwardly directed opening;
engaging the first attachment mechanism with a cargo hold down, wherein the cargo hold down includes a base portion and a handle portion;
moving the handle portion with respect to the base portion from a disengaged position to an engaged position, wherein the cargo hold down is retained in a stationary position with respect to the tonneau cover rail when the handle portion is in the engaged position; and
attaching a tonneau cover to the tonneau cover rails so that the tonneau cover substantially covers the upwardly directed opening when in a closed position.
22. The method of claim 21, wherein at least one of the base portion and the handle portion have a tie down recess formed therein.
23. The method of claim 21, wherein the handle portion is biased to the engaged position.
24. The method of claim 21, and further comprising forming a cutout in the tonneau cover rail, wherein the handle portion at least partially engages the cutout when in the engaged position.
25. The method of claim 21, wherein the first attachment mechanism comprises the first channel having a first side member and a second side member, wherein the first side member and the second side member define a first width region and a second width region, wherein the first width region is greater than the second width region, and wherein the first width region is intermediate the second width region and a point at which the first side member is attached to the tonneau cover rail.
26. The method of claim 25, and further comprising providing at least one extension on the base portion includes, wherein the base portion proximate the extension has a width that is greater than the second width and less than the first width.
27. The method of claim 25, and further comprising forming a cutout in at least one of the first side member and the second side member, wherein the cutout has a profile that is larger than a profile of an extension that extends from the base portion.
28. The method of claim 25, and further comprising forming a plurality of cutouts in at least one of the first side member and the second side member, wherein at least two of the plurality of cutouts are arranged in a first spacing, wherein at least two of the plurality of cutouts are arranged in a second spacing and wherein the second spacing is smaller than the first spacing.
29. The method of claim 21, wherein the tonneau cover rail includes an upper rail portion and a lower rail portion, wherein the upper rail portion comprises a second attachment mechanism that is adapted to engage a fastening device for attaching the tonneau cover to the tonneau cover rail and wherein the lower rail portion facilitates attachment of the tonneau cover rail to a side of a pickup bed.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of making a multi-layered interconnect structure, comprising:
providing a thermally conductive layer including first and second opposing surfaces;
positioning a first liquid crystal polymer (LCP) dielectric layer on the first opposing surface of the thermally conductive layer with no extrinsic adhesive material therebetween, wherein the first LCP dielectric layer comprises a first LCP dielectric material, and wherein the first LCP dielectric layer includes a first LCP dielectric sublayer positioned on the first opposing surface of the thermally conductive layer;
positioning a second LCP dielectric layer on the second opposing surface of the thermally conductive layer with no extrinsic adhesive material therebetween, wherein the second LCP dielectric layer comprises a second LCP dielectric material, and wherein the second LCP dielectric layer includes a second LCP dielectric sublayer positioned on the second opposing surface of the thermally conductive layer, the second LCP dielectric sublayer comprising a first plurality of shielded signal conductors;
heating the first and second LCP layers;
subjecting the first and second LCP dielectric layers to a first and second temperature that are less than a liquid crystal transition temperature of the first and second LCP dielectric materials, respectively, for a dwell time and at an elevated pressure that is sufficient to cause the first and second LCP dielectric materials to plastically deform and to cause:
bonding of the first LCP dielectric sublayer to the thermally conductive layer without any extrinsic adhesive layer disposed between the first LCP dielectric sublayer and the thermally conductive layer, and bonding of the second LCP dielectric sublayer to the thermally conductive layer without any extrinsic adhesive layer disposed between the second LCP dielectric sublayer and the thermally conductive layer;
first and second pluralities of electrically conductive members positioned on the first and second LCP dielectric layers, respectively;
passing a plated through hole through the multi-layered interconnect structure electrically connecting at least one member of the first plurality of electrically conductive members, to at least one of the first plurality of shielded signal conductors, and to at least one member of the second plurality of electrically conductive members; and
positioning a third dielectric layer on the first LCP dielectric layer and on portions of the first plurality of electrically conductive members, the third dielectric layer substantially overlying the plated through hole, and the third dielectric layer includes a high density interconnect layer for providing an electrical path from a first electronic device to the first plurality of shielded signal conductors.
2. The method of claim 1, wherein the polymer chain structure and associated directional orientation of the first and second LCP dielectric materials remain essentially unchanged throughout the dwell time.
3. The method of claim 1, wherein the coefficient of thermal expansion (CTE) of the first and second LCP dielectric materials remain essentially unchanged throughout the dwell time.
4. The method of claim 1, wherein the elevated pressure is in a range of about 1000 psi to about 3000 psi.
5. The method of claim 1, wherein the dwell time is at least about 2 minutes.
6. The method of claim 1, wherein the first LCP dielectric material and the second LCP dielectric material are a same LCP dielectric material.
7. The method of claim 1, wherein the first LCP dielectric material and the second LCP dielectric material are a different LCP dielectric material.
8. The method of claim 1, wherein the first electronic device is selected from the group consisting of a semiconductor chip and a circuitized substrate.
9. The method of claim 1, wherein the third dielectric layer is a high density interconnect layer that includes a resin comprising a modified polyphenylene ether.
10. The method of claim 1, wherein the third dielectric layer is a third LCP dielectric layer that is directly bonded to the first dielectric layer and to the portions of the first plurality of electrically conductive members such that no extrinsic adhesive material bonds the third LCP dielectric to the first dielectric layer and such that no extrinsic adhesive material bonds the third LCP dielectric to the portions of the first plurality of electrically conductive members.
11. The method of claim 1, wherein the first LCP dielectric layer comprises a first LCP dielectric material having a coefficient of thermal expansion (CTE) that is essentially the same as a CTE that existed in the first LCP dielectric material prior to the bonding of the first LCP dielectric layer to the thermally conductive layer, and wherein the second LCP dielectric layer comprises a second LCP dielectric material having a CTE that is essentially the same as a CTE that existed in the second LCP dielectric material prior to the bonding of the second LCP dielectric layer to the thermally conductive layer.