1. A method comprising:
forming a first via; and
stacking a second via onto the first via, at least one of the first via and the second via being a skip via.
2. The method of claim 1 wherein stacking a second via onto the first via includes stacking a second skip via onto a first skip via.
3. The method of claim 1 wherein stacking the second via onto the first via includes substantially aligning a longitudinal axis of the first via with a longitudinal axis of the second via.
4. The method of claim 1 wherein forming a first via comprises:
forming a first conductive layer onto a core;
forming a first dielectric layer such that the first conductive layer is between the first dielectric layer and the core;
forming a second conductive layer onto the first dielectric layer;
forming a second dielectric layer such that the second conductive layer is between the first dielectric layer and the second dielectric layer;
forming an opening in the first and second dielectric layers; and
forming a first skip via in the opening.
5. The method of claim 4 wherein forming an opening in the first and second dielectric layers includes drilling an opening in the first and second dielectric layers.
6. The method of claim 5 wherein drilling an opening in the first and second dielectric layers includes laser drilling an opening in the first and second dielectric layers.
7. The method of claim 4 wherein forming an opening in the first and second dielectric layers includes etching an opening in the first and second dielectric layers.
8. The method of claim 4 wherein forming a first conductive layer includes plating the first conductive layer onto the core and patterning the first conductive layer, and wherein forming a second conductive layer includes plating the second conductive layer onto the first dielectric layer and patterning the second conductive layer.
9. The method of claim 4 wherein forming the first skip via in the opening includes filling the opening with a conductive material.
10. The method of claim 9 wherein filling the opening with a conductive material includes forming a third conductive layer onto the second dielectric layer.
11. The method of claim 4 wherein forming a third conductive layer on the second dielectric layer includes patterning the third conductive layer.
12. The method of claim 10 further comprising:
forming a third dielectric layer on the third conductive layer;
forming a second opening in the third dielectric layer; and
forming the second via in the second opening.
13. The method of claim 12 wherein forming the second via in the second opening includes forming a fourth conductive layer onto the third dielectric layer.
14. A substrate comprising:
a plurality of dielectric layers;
a first skip via extending through two of the dielectric layers; and
a second via extending through one of the dielectric layers, the second via and the first skip via being stacked on top of one another.
15. The substrate of claim 14 wherein the second via is a second skip via extending through two of the dielectric layers.
16. The substrate of claim 14 wherein the first skip via includes a longitudinal axis and the second via includes a longitudinal axis, the longitudinal axis of the first skip via being substantially aligned with the longitudinal axis of the second via.
17. The substrate of claim 14 further comprising a third via extending through at least one of the dielectric layers, the third via being stacked onto the first skip via and the second via.
18. The substrate of claim 14 wherein the plurality of dielectric layers is formed on a core.
19. A computer system comprising:
a bus;
a memory coupled to the bus; and
a substrate electrically coupled to the bus, the substrate including a plurality of dielectric layers, a first skip via extending through two of the dielectric layers and a second via extending through one of the dielectric layers, the second via and the first skip via being stacked on top of one another.
20. The computer system of claim 19 wherein the second via is a second skip via extending through two of the dielectric layers.
21. The computer system of claim 19 further comprising a processor coupled to the substrate and the bus.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A connection of a gas exchange valve of an internal combustion engine to an actuator capable of moving the gas exchange valve in an opening and a closing direction, the connector comprising:
a shaft (11) formed as a part of one of either the gas exchange valve (1) or the actuator,
a coupling piece (13) formed as a part of the other of either the gas exchange valve (1) or the actuator,
at least one circumferential groove (25) on the shaft (11),
the coupling piece (13) having a bore (15) whose diameter when assembled corresponds to the diameter of the shaft (11),
the bore (15) having at least one circumferential bead (17), which can be connected in a positively engaging manner to the at least one circumferential groove (25), and
the coupling piece (13) having at least one slit (21) in the longitudinal direction of the coupling piece (13) in the vicinity of the bead (17).
2. The connection according to claim 1, wherein the shaft (11) comprises a number of circumferential grooves (25) spaced apart from one another in the longitudinal direction of the shaft (11), and the bore (15) comprises a number of beads (17) spaced apart from one another in the longitudinal direction.
3. The connection according to claim 1, wherein the shaft (11) is embodied in a cylindrical shape in the vicinity of the at least one circumferential groove (25), and wherein the bore (15) is embodied in a cylindrical shape.
4. The connection according to claim 2, wherein the shaft (11) is embodied in a cylindrical shape in the vicinity of the at least one circumferential groove (25), and wherein the bore (15) is embodied in a cylindrical shape.
5. The connection according to claim 1, wherein the shaft (11) is embodied in the shape of a truncated cone in the vicinity of the at least one circumferential groove (25), and wherein the bore (15) is embodied in the shape of a truncated cone.
6. The connection according to claim 2, wherein the shaft (11) is embodied in the shape of a truncated cone in the vicinity of the at least one circumferential groove (25), and wherein the bore (15) is embodied in the shape of a truncated cone.
7. The connection according to claim 1, wherein the at least one circumferential groove (25) has a semi-circular, rectangular, or trapezoidal cross-section.
8. The connection according to claim 1, further comprising a securing element, which prevents the connection from the shaft (11) and the coupling piece (13) from becoming detached.
9. The connection according to claim 2, further comprising a securing element, which prevents the connection from the shaft (11) and the coupling piece (13) from becoming detached.
10. The connection according to claim 3, further comprising a securing element, which prevents the connection from the shaft (11) and the coupling piece (13) from becoming detached.
11. The connection according to claim 5, further comprising a securing element, which prevents the connection from the shaft (11) and the coupling piece (13) from becoming detached.
12. The connection according to claim 8, wherein the securing element is embodied as a wire ring (33) and wherein the coupling piece (13) has at least one groove (31) on its outer surface to accommodate the wire ring (33).
13. The connection according to claim 8, wherein the securing element is embodied as a nut (27) and wherein the coupling piece (13) has an external thread (19) that cooperates with the nut (27).
14. The connection according to claim 8, wherein the securing element (33) is embodied as a sleeve (35) and wherein the sleeve (35) can be slid over the coupling piece (13).
15. The connection according to claim 14, wherein the sleeve (35) and the coupling piece (13) constitute a force fit when assembled.
16. The connection according to claim 8, wherein the coupling piece (13) is spread open in the vicinity of the at least one bead (17) in comparison to the assembled state, and wherein the coupling piece (13) is pressed together by the securing element (27, 33, 35).
17. The connection according to claim 15, wherein the coupling piece (13) is spread open in the vicinity of the at least one bead (17) in comparison to the assembled state, and wherein the coupling piece (13) is pressed together by the securing element (27, 33, 35).
18. The connection according to claim 1, wherein the shaft (11) is part of the gas exchange valve (1) and wherein the coupling piece (13) is part of the actuator (5).
19. The connection according to claim 1, wherein the coupling piece (13) is part of the gas exchange valve (1) and wherein the shaft (11) is part of the actuator (5).