1. An integrated circuit having on-chip signaling between a first component and a second component comprising:
a differential interconnect coupling the first component to the second component;
a driver coupled to the first component that sends data on the differential interconnect;
a receiver coupled to the second component that receives the data; and
a plurality of negative impedance converters coupled to the differential interconnect that provide loss compensation; and
a data skew circuit coupled to the driver and a data de-skew circuit coupled to the receiver.
2. The integrated circuit of claim 1, wherein each of the plurality of negative impedance converters includes a source degeneration network which compensates for signal attenuation on the differential interconnect.
3. The integrated circuit of claim 2, wherein the source degeneration network is a resistor-capacitor network.
4. The integrated circuit of claim 1, further comprising a pre-driver for multiplexing two data streams onto the differential interconnect.
5. The integrated circuit of claim 1, further comprising a calibration controller for calibrating the receiver.
6. The integrated circuit of claim 1, further comprising a phase lock loop for providing a multiplied clock signal to the driver and the receiver for double data rate operation.
7. The integrated circuit of claim 6, wherein the phase lock loop has a voltage controlled oscillator with shorted current source drains and a cross coupled transistor pair.
8. An integrated circuit having on-chip signaling between a first component and a second component comprising:
a differential interconnect coupling the first component to the second component, wherein the differential interconnect has a co-planar waveguide topology;
a driver coupled to the first component that sends data on the differential interconnect;
a receiver coupled to the second component that receives the data; and
a plurality of negative impedance converters coupled to the differential interconnect that provide loss compensation.
9. An integrated circuit having on-chip signaling between a first component and a second component comprising:
a differential interconnect coupling the first component to the second component;
a driver coupled to the first component that sends data on the differential interconnect;
a receiver coupled to the second component that receives the data; and
a plurality of negative impedance converters coupled to the differential interconnect that provide loss compensation; and
a second driver at the first component, the driver and the second driver each providing a distinct drive current for sending data.
10. A method for on-chip signaling on an integrated circuit comprising:
transmitting a data signal from a first component on the integrated circuit to a second component on the integrated circuit over a differential interconnect;
providing a differential admittance to the data signal; and
compensating for data skew between the first component and the second component.
11. The method of claim 10, wherein providing a differential admittance is performed using a source degeneration network which compensates for signal attenuation on the differential interconnect.
12. The method of claim 11, wherein the source degeneration network is a resistor-capacitor network.
13. The method of claim 10, further comprising multiplexing two data streams onto the differential interconnect.
14. A method for on-chip signaling on an integrated circuit comprising:
transmitting a data signal from a first component on the integrated circuit to a second component on the integrated circuit over a differential interconnect;
providing a differential admittance to the data signal; and
adjusting the current level of the data signal based on a desired transmission rate.
15. An integrated circuit having on-chip signaling between a first component and a second component comprising:
a means for differentially coupling the first component to the second component;
a means for sending data on the means for differentially coupling located at the first component;
a means for receiving the data at the second component;
a plurality of means for providing loss compensation coupled to the means for differentially coupling; and
a means for handling data skew between the means for sending data and the means for receiving data.
16. The integrated circuit of claim 15, wherein each of the plurality of the means for providing loss compensation includes a frequency dependent means for compensating for signal attenuation on the means for sending data.
17. A method for on-chip signaling on an integrated circuit comprising:
transmitting a data signal from a first component on the integrated circuit to a second component on the integrated circuit over a differential interconnect, wherein the differential interconnect has a co-planar waveguide topology; and
providing a differential admittance to the data signal.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A structure for shielding a stray light in an optical waveguide module, comprising:
an optical waveguide substrate supported in an optical waveguide module package,
a laser diode (LD, hereinafter) which is mounted on said optical waveguide substrate and emits a first signal light,
an optical waveguide which is formed on said optical waveguide substrate and propagates a part of said first signal light,
a wavelength division multiplexing (WDM, hereinafter) filter which is formed on said optical waveguide substrate,
an optical fiber which is situated on said optical waveguide substrate and transmits said part of said first signal light to an optical transmission line,
a photodiode (PD, hereinafter) for receiving a second signal light which is propagated through said optical transmission line and transmitted through said WDM filter via said optical waveguide, and
a metallic layer which is evaporated on a surface of said WDM filter and provided with a pin hole for transmitting said second signal light to said PD via said WDM filter,
wherein a remaining part of said first signal light (a stray light, hereinafter) which is not optically coupled with said optical waveguide is reflected by said metallic layer so that said stray light is prevented from being coupled with said PD.
2. A structure for shielding a stray light in an optical waveguide module according to claim 1 further comprising a light-absorption layer formed on a surface of said metallic layer.
3. A structure for shielding a stray light in an optical waveguide module according to claim 2, wherein:
said light-absorption layer is formed of chromium oxide.
4. A structure for shielding a stray light in an optical waveguide module according to claim 1, wherein:
said WDM filter is situated near an end face of said optical waveguide substrate.
5. A structure for shielding a stray light in an optical waveguide module according to claim 4, wherein:
said LD is situated on a side of said WDM filter.
6. A structure for shielding a stray light in an optical waveguide module, comprising:
an optical waveguide substrate supported in an optical waveguide module package,
a LD which is mounted on said optical waveguide substrate and emits a first signal light,
an optical waveguide which is formed on said optical waveguide substrate and propagates a part of said first signal light,
a WDM filter which is formed on said optical waveguide substrate,
an optical fiber which is situated on said optical waveguide substrate and transmits said part of said first signal light to an optical transmission line,
a photodiode for receiving a second signal light which is propagated through said optical transmission line and transmitted through said WDM filter via said optical waveguide, and
a plate which is stuck to a surface of said WDM filter, does not transmit said first and second signal lights but reflect them, and is provided with a pin hole for transmitting said second signal light to said PD via said WDM filter,
wherein a remaining part of said first signal light which is not optically coupled with said optical waveguide is reflected by said plate so that said stray light is prevented from being coupled with said PD.