1. A spreader bar assembly for sealing a catalyst within an aftertreatment housing, the spreader bar assembly comprising:
a pair of arms disposed in a scissor type arrangement defining an axis of rotation therebetween;
a contact member attached to an end of each of the pair of arms, the contact member configured to maintain a contact with the catalyst; and
a sealing member provided in association with the contact member and disposed on a first side of each of the pair of arms, wherein on exerting a force on the sealing member on the first side of each of the pair of arms, an opposing force is generated on a second side of each of the pair of arms disposed substantially opposite the first side of each of the pair of arms.
2. The spreader bar assembly of claim 1, wherein the contact member has a planar configuration.
3. The spreader bar assembly of claim 1, wherein the contact member on the first side of each of the pair of arms has a larger contact area than the contact member on the second side of each of the pair of arms.
4. The spreader bar assembly of claim 1, wherein the spreader bar assembly is configured to attach to a clamping wall.
5. The spreader bar assembly of claim 1, wherein the sealing member includes mechanical fasteners.
6. The spreader bar assembly of claim 5, wherein the mechanical fastener is provided on either end of the contact member.
7. The spreader bar assembly of claim 1, wherein the spreader bar assembly is positioned between a pair of the catalysts.
8. An aftertreatment housing comprising:
an inlet chamber;
an outlet chamber;
a pair of catalysts disposed between the inlet chamber and the outlet chamber; and
a spreader bar assembly disposed between the pair of catalysts, the spreader bar assembly comprising:
a pair of arms disposed in a scissor type arrangement defining an axis of rotation therebetween;
a contact member attached to an end of each of the pair of arms, the contact member configured to maintain a contact with the pair of catalysts; and
a sealing member provided in association with the contact member and disposed on a first side of each of the pair of arms, wherein on exerting a force on the sealing member on the first side of each of the pair of arms, an opposing force is generated on a second side of each of the pair of arms disposed substantially opposite the first side of each of the pair of arms.
9. The aftertreatment housing of claim 8 further comprising:
a clamping wall configured to surround at least a portion of the inlet chamber and the outlet chamber.
10. The aftertreatment housing of claim 9, wherein a portion of the clamping wall extends radially outwards with respect to the axis.
11. The aftertreatment housing of claim 9 further comprising:
a support structure attached to the clamping wall, the support structure configured to at least partially surround the catalyst.
12. The aftertreatment housing of claim 11 further comprising:
a clamp attachment surface extending radially from the support structure.
13. The aftertreatment housing of claim 12, wherein the clamp attachment surface is configured to attach to the clamping wall using mechanical fasteners.
14. The aftertreatment housing of claim 9, wherein the sealing member includes mechanical fasteners configured to engage with the clamping wall.
15. The aftertreatment housing of claim 14, wherein the mechanical fastener is provided on either end of the contact member.
16. The aftertreatment housing of claim 15, wherein the mechanical fastener includes a threaded rod and nut assembly.
17. A method of supporting a pair of catalysts within an aftertreatment housing, the method comprising:
installing the pair of catalysts within the aftertreatment housing, each of the pair of catalysts being axially spaced from one another;
providing a pair of support structures at least partially surrounding each of the pair of catalysts respectively;
preventing a radial movement of each of the pair of catalysts with respect to an axis of the aftertreatment housing by the pair of support structures;
providing a spreader bar assembly between the pair of the catalysts; and
preventing an axial movement of each of the pair of catalysts with respect to the axis by the spreader bar assembly comprising:
exerting a force on a first side of the spreader bar assembly; and
generating an opposing force on a second side of the spreader bar assembly based on the exerted force, wherein the second side is disposed substantially opposite the first side of each of the pair of arms.
18. The method of claim 17 further comprising:
attaching a clamping wall at least partially surrounding the aftertreatment housing.
19. The method of claim 18, wherein providing the pair of support structures further includes:
attaching the pair of support structures to the clamping wall.
20. The method of claim 17, wherein exerting the force on the first side of the spreader bar assembly further includes:
torqueing a sealing member provided on the first side of the spreader bar assembly.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A solid-state imaging apparatus, comprising:
a semiconductor chip having a principal face including a pixel region;
a protruding portion disposed on the principal face of the semiconductor chip so as to surround the pixel region;
a light transmitting cover member disposed over the pixel region; and
an adhesive material surrounding the pixel region so that an interior space is formed between the semiconductor chip and the cover member, and bonding the cover member and the protruding portion, wherein
the protruding portion has a top face and a first side face facing the space, a first edge line being formed by the top face and the first side face,
the adhesive material bonds the top face of the protruding portion and the cover member,
the adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member, and
perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member.
2. The apparatus according to claim 1, wherein the first side face of the protruding portion is perpendicular to the semiconductor chip.
3. The apparatus according to claim 1, wherein the perimeters of the interior space, in the planes parallel to the principal face become shorter in a direction from the semiconductor chip toward the cover member.
4. The apparatus according to claim 1, wherein the protruding portion further has a second side face that does not face the interior space, a second edge line being formed by the top face and the second side face, and
the adhesive material further has a second face that does not face the interior space, the second face extending from the second edge line toward the cover member.
5. The apparatus according to claim 1, wherein the protruding portion further has a second side face that does not face the interior space, and
the adhesive material further bonds the second side face of the protruding portion, a part around the second side face of the protruding portion, of the principal face of the semiconductor chip, and the cover member.
6. The apparatus according to claim 1, wherein the adhesive material is a light curable resin.
7. The apparatus according to claim 1, wherein the protruding portion contacts the principal face of the semiconductor chip.
8. A method of manufacturing a solid-state imaging apparatus, comprising:
preparing a semiconductor chip having a principal face including a pixel region;
forming a protruding portion on the principal face of the semiconductor chip so as to surround the pixel region; and
disposing a light transmitting cover member at a position at which the pixel region is covered, and bonding circumferentially the cover member and the protruding portion with an adhesive material so that an interior space is formed between the semiconductor chip and the cover member, wherein
the protruding portion has a top face and a first side face facing the space, a first edge line being formed by the top face and the first side face,
the adhesive material bonds the top face of the protruding portion and the cover member,
the adhesive material has a first face facing the interior space, the first face extending from the first edge line toward the cover member, and
perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the first edge line toward the cover member.
9. The method according to claim 8, wherein the protruding portion is formed by a patterning photosensitive resin.
10. The method according to claim 8, wherein the protruding portion is formed so as to contact the principal face.
11. A camera comprising:
the solid-state imaging apparatus according to claim 1; and
a signal processing unit that processes a signal obtained by the solid-state imaging apparatus.