1. A method of fabricating a semiconductor device comprising:
attaching a semiconductor substrate to a carrier using a carrier fixing layer, the semiconductor substrate including a plurality of first semiconductor chips;
forming gaps between adjacent ones of the plurality of first semiconductor chips;
filling the gaps with one or more chemicals to remove portions of the carrier fixing layer exposed in respective ones of the gaps; and
electrically connecting a plurality of second semiconductor chips to respective ones of the plurality of first semiconductor chips,
wherein the electrically connecting is performed between the attaching of the semiconductor substrate to the carrier and the forming of the gaps.
2. The method of claim 1, wherein the filling comprises:
filling the gaps with the one or more chemicals to remove the portions of the carrier fixing layer interposed between the plurality of first semiconductor chips and the carrier.
3. The method of claim 1, further comprising:
removing the one or more chemicals after the portions of the carrier fixing layer have been removed by the one or more chemicals.
4. The method of claim 1, wherein
each of the plurality of first semiconductor chips comprises a first surface and a second surface which are opposite each other,
said attaching the carrier includes attaching the carrier fixing layer to the first surface of each of the plurality of first semiconductor chips, the method further comprising:
attaching the second surface of each of the plurality of first semiconductor chips to an adhesive layer after the filling of the gaps with the one or more chemicals, and
separating the carrier from the plurality of first semiconductor chips after the attaching of the second surface to the adhesive layer.
5. The method of claim 1, wherein the filling comprises:
filling the gaps with the one or more chemicals for a time sufficient to allow each of the plurality of first semiconductor chips to be attached to the carrier by substantially a first width of the carrier fixing layer, the first width less than a second width of each of the plurality of first semiconductor chips.
6. The method of claim 1, wherein said filling the gaps includes:
filling the gaps with the one or more chemicals for a time sufficient to allow the portions of the carrier fixing layer to be removed under the plurality of first semiconductor chips.
7. The method of claim 1, further comprising:
forming a molding material to cover the semiconductor substrate and the second semiconductor chips before the forming of the gaps.
8. A method of fabricating a semiconductor device comprising:
attaching a semiconductor substrate to a carrier using a carrier fixing layer, the semiconductor substrate including a plurality of first semiconductor chips;
forming gaps by removing portions of the semiconductor substrate to expose the carrier fixing layer between adjacent ones of the plurality of first semiconductor chips; and
irradiating light to each of the gaps to remove portions of the carrier fixing layer corresponding to respective ones of the gaps,
wherein
each of the plurality of first semiconductor chips comprises a first surface opposing a second surface, and
the carrier is attached to the first surface of each of the plurality of first semiconductor chips by attaching the carrier fixing layer to the first surface of each of the plurality of first semiconductor chips.
9. The method of claim 8, wherein the light comprises laser light or ultraviolet light.
10. The method of claim 8, wherein said irradiating light comprises:
irradiating the light into the gaps through the carrier.
11. The method of claim 8, wherein said irradiating light comprises:
irradiating the light into the gaps from a source facing the second surfaces of the plurality of first semiconductor chips.
12. The method of claim 8, wherein said irradiating light comprises:
irradiating the light into the gaps to remove the portions of the carrier fixing layer located between respective ones of the plurality of first semiconductor chips and the carrier.
13. A method of fabricating a semiconductor device comprising:
attaching a semiconductor substrate to a carrier using a carrier fixing layer, the semiconductor substrate including a plurality of semiconductor chips;
forming gaps between adjacent ones of the plurality of first semiconductor chips;
forming first separation spaces in the carrier fixing layer corresponding to the gaps by irradiating laser light to the carrier fixing layer through the gaps; and
forming second separation spaces in portions of the carrier fixing layer corresponding to the gaps, the forming the second separation spaces including removing portions of the carrier fixing layer interposed between the carrier and the plurality of first semiconductor chips by filling the gaps with one or more chemicals,
wherein each of the first separation spaces is smaller than each of the second separation spaces.
14. The method of claim 13, wherein the forming the second separation spaces comprises increasing the width of the first separation spaces by filling the gaps and the first separation spaces with the one or more chemicals.
15. A method of fabricating a semiconductor device, the method comprising:
attaching a semiconductor substrate to a carrier using a carrier fixing layer, the semiconductor substrate including a plurality of first semiconductor chips;
forming gaps between adjacent ones of the plurality of first semiconductor chips; forming first separation spaces in the carrier fixing layer corresponding to the gaps by irradiating laser light to the carrier fixing layer through the gaps; and
forming second separation spaces in portions of the carrier fixing layer corresponding to the gaps, the forming the second separation spaces including removing the portions of the carrier fixing layer interposed between the carrier and the plurality of first semiconductor chips,
wherein each of the first separation spaces is smaller than each of the second separation spaces.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A control device for controlling an automatic transmission in which driving power of an engine is transmitted to a gear shift mechanism through a clutch, engaging force of the clutch being adjusted by a motor, the control device comprising:
a motor control unit for controlling the rotation of the motor, wherein the motor control unit has a motor target current calculating unit for calculating target current in the motor, a current detecting resistor for detecting motor current flowing when the motor rotates, and a current detecting unit for sampling a voltage occurring in the current detecting resistor to detect the motor current, and the current detecting unit has a counter for counting a variation number of a rotational position signal output from a rotational position detecting unit for detecting the rotational position of the motor, and an electrical angle 180\xb0 judging unit for judging on the basis of the count value of the counter that the motor rotates at 180\xb0 in electrical angle, and wherein the voltage occurring in the current detecting unit is sampled at each timing corresponding to an integral multiple of 180\xb0 in electrical angle that is detected by the electrical angle 180\xb0 judging unit, and rotation of the motor is controlled in accordance with the difference between the motor target current calculated by the motor target current calculating unit and the motor current.
2. A control device for an automatic transmission in which driving power of an engine is transmitted to a gear shift mechanism through a clutch, engaging force of the clutch being adjusted by a motor, the control device comprising:
a motor control unit for controlling the rotation of the motor, wherein the motor control unit has a motor target current calculating unit for calculating target current in the motor, a current detecting resistor for detecting motor current flowing when the motor rotates, a current detecting unit for sampling a voltage occurring in the current detecting resistor to detect the motor current, and the current detecting unit has a counter for counting a variation number of a rotational position signal output from a rotational position detecting unit for detecting the rotational position of the motor, and an electrical angle 180\xb0 judging unit for judging on the basis of the count value of the counter that the motor rotates at 180\xb0 in electrical angle, and a current value storing unit for calculating the number of variations of the rotational position signal for the rotation of the electrical angle of 180\xb0 of the motor from the electrical angle 180\xb0 judging unit and the counter and storing only motor current values which are detected by the current detecting unit and whose number corresponds to an integral multiple of the variation number, and wherein an average value of the motor current values stored in the current value storing unit, and the rotation of the motor is controlled in accordance with the difference between motor target current calculated in the motor target current calculating unit and the average value of the motor current values.
3. The control device for the automatic transmission according to claim 2, wherein the motor current values stored in the current value storing unit contain, as the latest data, current sampled at a timing at which variation of the latest rotational position signal is detected.
4. A control device for an automatic transmission in which driving power of an engine is transmitted to a gear shift mechanism through a clutch, engaging force of the clutch being adjusted by a motor, the control device comprising:
a motor control unit for controlling the rotation of the motor, wherein the motor control unit has a motor target current calculating unit for calculating target current in the motor, a current detecting resistor for detecting motor current flowing when the motor rotates, a current detecting unit for sampling a voltage occurring in the current detecting resistor to detect the motor current, and the current detecting unit has a counter for counting a variation number of a rotational position signal output from a rotational position detecting unit for detecting the rotational position of the motor, an electrical angle 180\xb0 judging unit for judging on the basis of the count value of the counter that the motor rotates at 180\xb0 in electrical angle, and a current value storing unit for calculating the number of variations of the rotational position signal for the rotation of the electrical angle of 180\xb0 of the motor from the electrical angle 180\xb0 judging unit and the counter and storing only motor current values which are detected by the current detecting unit and whose number corresponds to an integral multiple of the variation number, and a current ratio calculating unit for setting the current at the count value of the counter to reference current and calculating a ratio of the current stored in the current value storing unit to the reference current every count value, and wherein it is judged whether the current ratio calculation of the current ratio calculating unit is completed or not, and the rotation of the motor is controlled in accordance with the difference between motor target current calculated in the motor target current calculating unit and a value obtained by multiplying the motor current by the calculation result of the current ratio calculating unit.
5. The control device for the automatic transmission according to claim 1, wherein the rotational position detecting unit is constructed by a plurality of hall sensors and the rotational position signal is a hall sensor signal output from the plural hall sensors.
6. The control device for the automatic transmission according to claim 2, wherein the rotational position detecting unit is constructed by a plurality of hall sensors and the rotational position signal is a hall sensor signal output from the plural hall sensors.
7. The control device for the automatic transmission according to claim 3, wherein the rotational position detecting unit is constructed by a plurality of hall sensors and the rotational position signal is a hall sensor signal output from the plural hall sensors.
8. The control device for the automatic transmission according claim 4, wherein the rotational position detecting unit is constructed by a plurality of hall sensors and the rotational position signal is a hall sensor signal output from the plural hall sensors.