1. A component-embedded substrate manufacturing method of manufacturing a component-embedded substrate where in an insulating substrate having a wiring pattern on a surface thereof, an electrical or electronic component having a terminal electrically connected to the wiring pattern is embedded, the method comprising:
a mark forming step of forming a metal layer to serve as the wiring pattern on a support plate and forming a main mark made of a metal columnar body on a second surface opposite to a first surface contacting the support plate of the metal layer;
a component mounting step of positioning the component using the main mark as a reference relative to the metal layer and mounting the component on the second surface of the metal layer with an insulating adhesive layer interposed between the second surface and each of the component and the terminal;
a buried layer forming step of forming a buried layer serving as the insulating substrate having the component and the main mark buried on the second surface of the metal layer having the component mounted thereon;
a window forming step of separating the support plate from the metal layer, then removing part of the metal layer from the first surface side of the metal layer exposed by the separation, and thereby forming a first window for exposing the main mark and at least a part of the buried layer;
a via hole forming step of determining a position of a terminal of the component using the main mark exposed from the first window as a reference and forming a first via hole reaching the terminal;
a conductive via forming step of subjecting the first via hole to a plating process, then filling metal thereinto, and thereby forming a first conductive via; and
a pattern forming step of forming the wiring pattern from the metal layer electrically connected to the terminal through the conductive via.
2. The component-embedded substrate manufacturing method according to claim 1, wherein in the mark forming step, a sub mark made of a metal columnar body is formed on the second surface of the metal layer simultaneously together with the main mark;
before the window forming step, the method further comprises a through-hole forming step of determining the sub mark using X-rays and thereby forming a through-hole penetrating all of the metal layer, the sub mark, and the buried layer, wherein in the window forming step, the first window is formed using the through-hole as a reference.
3. The component-embedded substrate manufacturing method according to claim 1, wherein in the window forming step, a second window for exposing a portion of the adhesive layer including a position corresponding to the terminal of the component is further formed; and in the via hole forming step, the first via hole reaching the terminal in the adhesive layer exposed from the second window is formed.
4. The component-embedded substrate manufacturing method according to claim 3, wherein in the mark forming step, a sub mark made of a metal columnar body is formed on the second surface of the metal layer simultaneously together with the main mark;
before the window forming step, the method further comprises a through-hole forming step of determining the sub mark using X-rays and thereby forming a through-hole penetrating all of the metal layer, the sub mark, and the buried layer, wherein in the window forming step, the first window and the second window are formed using the through-hole as a reference.
5. The component-embedded substrate manufacturing method according to claim 1, wherein in the mark forming step, a pedestal made of a metal columnar body is formed simultaneously together with the main mark at a position within a mounting expected region of the component on the second surface of the metal layer and at a position excluding a portion in which the terminal is expected to be positioned; and
in the component mounting step, the component on the pedestal is placed and the adhesive layer is interposed between the second surface and both of the component and the terminal.
6. The component-embedded substrate manufacturing method according to claim 1, before the buried layer forming step, the method further comprising a circuit board preparation step of preparing an inner circuit board to be further buried within the buried layer, the inner circuit board including an inner insulating plate, an inner conductive circuit provided on both surfaces of the inner insulating plate, and an alignment mark provided at a predetermined position on the inner insulating plate, wherein
in the buried layer forming step, the buried layer is formed in a state in which the alignment mark and the main mark are aligned in a thickness direction of the component-embedded substrate and a predetermined space is secured between the inner circuit board and the second surface of the metal layer;
in the via hole forming step, a position of the inner conductive circuit is determined using the main mark exposed from the first window as a reference and a second via hole reaching the inner conductive circuit is further formed; and
in the conductive via forming step, the second via hole is plated with metal and a second conductive via is further formed.
7. The component-embedded substrate manufacturing method according to claim 6, wherein in the conductive via forming step, the second conductive via is a filled via obtained by subjecting the second via hole to via filling plating and filling metal therein.
8. The component-embedded substrate manufacturing method according to claim 6, wherein in the conductive via forming step, the second conductive via is formed to have a diameter equal to or greater than that of the first conductive via.
9. The component-embedded substrate manufacturing method according to claim 1, wherein the columnar body is formed by pattern plating using a plating resist film.
10. The component-embedded substrate manufacturing method according to claim 1, wherein the adhesive layer is made of an epoxy-based resin or a polyimide-based resin.
11. The component-embedded substrate manufacturing method according to claim 1, wherein in the component mounting step, the component is mounted in a state in which the terminal of the component is oriented toward the second surface side.
12. The component-embedded substrate manufacturing method according to claim 1, wherein an aluminum plate is used as the support plate; and a copper foil attached to the aluminum plate is used as the metal layer.
13. The component-embedded substrate manufacturing method according to claim 1, wherein a stainless plate is used as the support plate; and a copper plating film deposited on the stainless plate is used as the metal layer.
14. A component-embedded substrate manufactured using the manufacturing method according to claim 1.
15. The component-embedded substrate according to claim 14, further comprising a sub mark made of metal and formed on the second surface of the metal layer simultaneously together with the main mark.
16. The component-embedded substrate according to claim 14, further comprising a pedestal made of a metal columnar body and formed simultaneously together with the main mark at a position within a mounting expected region of the component on the second surface of the metal layer and at a position excluding a portion in which the terminal is expected to be positioned.
17. The component-embedded substrate according to claim 14, further comprising an inner circuit board including an inner insulating plate, an inner conductive circuit provided on both surfaces of the inner insulating plate, and an alignment mark provided at a predetermined position on the inner insulating plate.
18. A component-embedded substrate manufactured using the manufacturing method according to claim 3.
19. The component-embedded substrate according to claim 18, further comprising a sub mark made of metal and formed on the second surface of the metal layer simultaneously together with the main mark.
20. The component-embedded substrate according to claim 18, further comprising an inner circuit board including an inner insulating plate, an inner conductive circuit provided on both surfaces of the inner insulating plate, and an alignment mark provided at a predetermined position on the inner insulating plate.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A computer-implemented method for securely roaming a digital identity stored on a secure roaming device, wherein the secure roaming device stores encrypted attributes of the digital identity accessible using a bimodal credential, the method comprising:
receiving a request for at least one attribute of the digital identity from a service provider;
providing to the secure roaming device a first password of the bimodal credential, wherein the first password enables a safe mode of access to the digital identity;
retrieving from the secure roaming device an encrypted identity token, wherein the encrypted identity token is encrypted with a private key of a public-key cryptographic key pair, and wherein the encrypted identity token comprises:
a cryptographic session key;
a time stamp indicative of a duration of the cryptographic session key; and
the at least one attribute of the digital identity, wherein the at least one attribute comprises private identity information;
retrieving from the secure roaming device an encrypted identifier, wherein the encrypted identifier is encrypted with the cryptographic session key; and
providing the encrypted identity token and the encrypted identifier to the service provider.
2. The computer-implemented method in accordance with claim 1, wherein the encrypted identifier comprises a response to a challenge from the service provider.
3. The computer-implemented method in accordance with claim 1, further comprising:
providing to the secure roaming device a second password of the bimodal credential, wherein the second password enables an administrative mode of access to the digital identity; and
modifying at least one of the public-key cryptographic key pair, the time stamp, and the at least one attribute of the digital identity.
4. The computer-implemented method in accordance with claim 3, wherein the bimodal credential comprises a pair of predetermined passwords.
5. The computer-implemented method in accordance with claim 1, wherein the safe mode of the bimodal credential allows access to respective metadata associated with each of the encrypted attributes of the digital identity.
6. The computer-implemented method in accordance with claim 1, wherein the secure roaming device comprises a flash memory device.
7. The computer-implemented method in accordance with claim 1, wherein the secure roaming device is accessed through an unsecure interface.
8. A secure roaming device for securely roaming a digital identity, wherein the secure roaming device stores encrypted attributes of the digital identity accessible using a bimodal credential, comprising:
an inputoutput portion for:
receiving one or more passwords of a bimodal credential indicative of an appropriate mode of access to information associated with the digital identity;
receiving a request for at least attribute associated with the digital identity;
providing a response to the request, the response being based on the appropriate mode of access and comprising an encrypted identity token and an encrypted identifier, the encrypted identity token comprising the requested at least one attribute, a cryptographic session key, and a time stamp indicative of a duration of the cryptographic session key, wherein:
the identity token is encrypted with a private key of a public-key cryptographic key pair; and
the encrypted identifier is encrypted utilizing the cryptographic session key; and
a memory portion for storing attributes of the digital identity, the private key, the time stamp, the identity token, and all modes of the bimodal credential.
9. The secure roaming device in accordance with claim 8, further comprising a processing portion for:
determining the appropriate mode of access to the information associated with the digital identity based on receiving the one or more passwords of the bimodal credential;
processing the request for at least one attribute associated with the digital identity; and
creating the response to request, wherein the response provides the information associated with the digital identity according to the determined appropriate mode of access.
10. The secure roaming device in accordance with claim 8, wherein the memory portion comprises a removable memory.
11. The secure roaming device in accordance with claim 8, wherein the secure roaming device comprises at least one of a portable secure roaming device and a biometric memory device.
12. The secure roaming device in accordance with claim 8, wherein:
an administrative mode of the bimodal credential allows modification of at least one of the public-key cryptographic key pair, the time stamp, and the encrypted attributes of the digital identity; and
a safe mode of the bimodal credential prohibits modification of the public-key cryptographic key pair, the time stamp, and the encrypted attributes of the digital identity.
13. The secure roaming device in accordance with claim 8, wherein the secure roaming device is a flash memory device.
14. The secure roaming device in accordance with claim 8, wherein the secure roaming device is accessed through an unsecure interface.
15. A computer storage medium having computer-executable instructions for securely roaming a digital identity stored on a secure roaming device, wherein the secure roaming device stores encrypted attributes of the digital identity accessible using a bimodal credential, performing the acts of:
receiving a request for at least one attribute of the digital identity from a service provider over an unsecure interface;
providing to the secure roaming device a first password of the bimodal credential, wherein the first password enables a safe mode of access to the digital identity;
retrieving from the secure roaming device an encrypted identity token, wherein the encrypted identity token is encrypted with a private key of a public-key cryptographic key pair, and wherein the encrypted identity token comprises a cryptographic session key, a time stamp indicative of a duration of the cryptographic session key, and at least one attribute of digital identity;
retrieving from the secure roaming device an encrypted identifier, wherein the encrypted identifier is encrypted with the cryptographic session key; and
providing the encrypted identity token and the encrypted identifier to the service provider over the unsecure interface.
16. The computer storage medium in accordance with claim 15, wherein the encrypted identifier comprises a response to a challenge from the service provider.
17. The computer storage medium in accordance with claim 15, the computer-readable medium having further computer-executable instructions for:
providing to the secure roaming device a second password of the bimodal credential, wherein the second password enables an administrative mode of access to the digital identity; and
modifying at least one of the public-key cryptographic key pair, the time stamp, and the encrypted attributes of the digital identity.
18. The computer storage medium in accordance with claim 15, wherein the safe mode of the bimodal credential allows access to respective metadata associated with the encrypted attributes of the digital identity.
19. The computer storage medium in accordance with claim 15, wherein the secure roaming device is a flash memory device.