1. An alignment spacer system comprising:
a siding outside corner; and
an alignment spacer, wherein the alignment spacer includes a body;
wherein the body includes a rib member, wherein the body includes at least two inner walls and at least two end walls wherein each end wall is perpendicular to one of the inner walls, wherein the rib member projects from each end wall and is located between the at least two end walls, wherein the rib member is adjacent to and spans an entire length of the at least two inner walls and between the at least two end walls, wherein the rib member and the at least two inner walls are configured to have a first angle that matches a second angle of an outside corner of a structure, wherein the outside corner of the structure is received by the first angle made by said at least two inner walls such that the inner walls abut an outer surface of the outside corner of the structure, wherein each of the at least two end walls and a portion of the rib member define at least one aperture for receiving at least one fastener for securing the alignment spacer to the structure, wherein the at least two inner walls have a height and a width and the height of the at least two inner walls is less than the width of the at least two inner walls, and wherein the siding outside corner is snapped over the body and comes into direct contact with each end wall such that the siding outside corner is engaged by the alignment spacer while allowing the siding outside corner to be shifted vertically along the outside corner of the structure.
2. The alignment spacer system of claim 1, wherein the body has an L-shaped configuration, wherein the first angle is ninety degrees, and the second angle is ninety degrees.
3. The alignment spacer system of claim 1, further comprising at least two fasteners, wherein each of the at least two fasteners are configured to be received by the at least one aperture defined by each of the at least two end walls.
4. The alignment spacer system of claim 3, wherein the at least two fasteners are nails.
5. The alignment spacer system of claim 3, wherein the at least two fasteners are standard six-penny construction nails.
6. The alignment spacer system of claim 1, wherein the body comprises a rigid plastic.
7. The alignment spacer system of claim 6, wherein the rigid plastic is an injection molded plastic.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A multi-layer printed circuit board (PCB) comprising:
a plurality of conductive layers with dielectric material: disposed therebetween;
a through-hole that extends through the PCB; and
a via, spaced apart from the through-hole, electrically coupled to one or more internal conductive layers of the plurality of conductive layers;
wherein the through-hole is electrically coupled to the via, and wherein the through-hole is spaced apart from at least one of the one or more internal conductive layers.
2. The multi-layer PCB of claim 1, further comprising a surface land that couples the through-hole to the via.
3. The multi-layer PCB of claim 1, wherein the through-hole is plated with copper.
4. The multi-layer PCB of claim 1, wherein the via is plated with copper.
5. The multi-layer PCB of claim 1, wherein the one or more internal conductive layers are ground layers or power layers.
6. The multi-layer PCB of claim 1, wherein the one or more internal conductive layers includes at least two layers, and wherein the through-hole is spaced apart from at least two of the internal conductive layers.
7. The multi-layer PCB of claim 1, wherein the via is a first via, the multi-layer PCB further comprising:
a second via, spaced apart from the through-hole, electrically coupled to the one or more internal conductive layers of the plurality of conductive layers;
wherein the through-hole is electrically coupled to the second via.
8. A method of manufacturing a PCB, the method comprising:
providing a multi-layer PCB that includes a plurality of conductive layers with dielectric material disposed therebetween;
generating a through-hole that extends through the PCB; and
generating a via, spaced apart from the through-hole, that is electrically coupled to one or more internal conductive layers of the plurality of conductive layers;
wherein the through-hole is electrically coupled to the via, and wherein the through-hole is spaced apart from at least one of the one or more internal conductive layers.
9. The method of claim 8, further comprising:
providing a surface land that couples the through-hole to the via.
10. The method of claim 8, wherein the through-hole is plated with copper.
11. The method of claim 8, wherein the via is plated with copper.
12. The method of claim 8, wherein the one or more internal conductive layers are ground layers or power layers.
13. The method of claim 8, wherein the one or more internal conductive layers includes at least two layers, and wherein the through-hole is spaced apart from at least two of the internal conductive layers.
14. The method of claim 8, wherein the via is a first via, the method further comprising:
generating a second via, spaced apart from the through-hole, that is electrically coupled to the one or more internal conductive layers of the plurality of conductive layers, wherein the through-hole is electrically coupled to the second via.
15. A method for mechanically coupling an electrical component to a multi-layer PCB, the method comprising:
providing a multi-layer PCB that includes:
a plurality of conductive layers with dielectric material disposed therebetween;
a through-hole that extends through the PCB; and
a via, spaced apart from the through-hole, electrically coupled to one or more internal conductive layers of the plurality of conductive layers;
wherein the through-hole is electrically coupled to the via, and wherein the through-hole is spaced apart from at least one of the one or more internal conductive layers;
providing an electrical component that includes a pin;
positioning the pin of the electrical component into the through-hole of the PCB; and
soldering the pin to the through-hole to form a secure mechanical and electrical connection, wherein the solder substantially fills the through-hole.
16. The method of claim 15, wherein the soldering is performed by a wave soldering process.
17. The method of claim 15, wherein the. PCB further comprises a surface land that couples the through-hole to the via.
18. The method of claim 15, wherein the through-hole and the via are plated with copper.
19. The method of claim 15, wherein the one or more internal conductive layers of the PCB are ground layers or power layers.
20. The method of claim 15, wherein the one or more internal conductive layers includes at least two layers, and wherein the through-hole is spaced apart from at least two of the internal conductive layers.