1. An oral care composition for combating dentine hypersensitivity comprising inorganic oxide particles surface-coated with an anionic polymer, and an orally acceptable carrier or excipient.
2. A composition according to claim 1 wherein the anionic polymer is a polycarboxylate.
3. A composition according to claim 1 wherein the surface-coated inorganic oxide particles have a mean particle size from 0.01 \u03bcm to 3.0 \u03bcm.
4. A composition according to claim 1 wherein the inorganic oxide is selected from silica, titanium dioxide, or alumina or a mixture thereof.
5. A composition according to claim 1 wherein the polycarboxylate is a polyacrylic acid, a copolymer of acrylic acid and maleic acid, a copolymer of methacrylic acid and acrylic acid, or a copolymer of an alkyl vinyl ether and maleic acid or anhydride.
6. A composition according to claim 1 wherein the polycarboxylate is a polyacrylic acid.
7. A composition according to claim 1 wherein the polycarboxylate is a polysaccharide containing carboxy functional groups.
8. A composition according to claim 7 wherein the polycarboxylate is an alginic acid or derivative thereof.
9. A composition claim 1 wherein the polycarboxylate is a copolymer having repeated units of a hydrophilic monomer selected from a carboxylic acid, a dicarboxylic acid or a dicarboxylic acid anhydride and a hydrophobic monomer consisting of an alpha-olefin having at least eight carbon atoms, full and partially hydrolysed forms thereof and full and partial salts thereof.
10. A composition according to claim 9 wherein the polycarboxylate is an octadecene maleic anhydride copolymer.
11. A composition according claim 1 wherein the surface-coated inorganic oxide particles are present in an amount of 0.1 to 60% ww of the total composition.
12. A composition according to claim 1 further comprising an additional desensitising agent.
13. A composition according to claim 1 further comprising a source of soluble fluoride ions.
14. A method of combating dentine hypersensitivity which comprises applying an effective amount of a composition as defined in claim 1 to an individual in need thereof.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of making a supported foam circuit laminate, comprising:
fitting a dielectric foam substrate having a shape defined by edges to a support frame having a thickness, an inner rim and an outer rim, wherein
the edges of the dielectric foam substrate are flush with the inner rim of the support frame, and
the dielectric foam substrate has a thickness that is greater than the thickness of the support frame;
disposing an electrically conductive layer onto a side of the dielectric foam substrate and the support frame, wherein the edges of the electrically conductive layer overlap the inner rim of the support frame; and X
co-laminating the electrically conductive layer to the dielectric foam substrate and the overlapped frame under heat and pressure to provide a supported foam circuit laminate.
2. The method of claim 1, further comprising disposing an adhesive layer between the surface of the dielectric foam substrate and the electrically conductive layer.
3. The method of claim 2, wherein the adhesive layer has a thickness of less than or equal to about 0.1 millimeters.
4. The method of claim 1, further comprising pre-coating the electrically conductive layer with an adhesive prior to disposing the electrically conductive layer onto the dielectric foam substrate and the support frame.
5. The method of claim 1, further comprising disposing a second conductive layer onto a side of the dielectric foam substrate and the support frame on a side opposite the first layer, wherein the edges of the second electrically conductive layer overlap the inner rim of the support frame.
6. The method of claim 5, further comprising disposing an adhesive layer between the surface of the dielectric foam substrate and the second electrically conductive layer.
7. The method of claim 6, wherein the adhesive layer has a thickness of less than or equal to about 0.1 millimeters.
8. The method of claim 5, further comprising pre-coating the electrically conductive layer with an adhesive prior to disposing the electrically conductive layer onto the dielectric foam substrate and the support frame.
9. The method of claim 1, further comprising forming a circuit on the electrically conductive layer.
10. The method of claim 9, wherein forming the circuit comprises etching the electrically conductive layer.
11. The method of claim 1, further comprising excising the foam circuit from the support frame.
12. The method of claim 1, further comprising forming plated through-holes in the supported foam circuit laminate.
13. The method of claim 1, wherein the dielectric foam substrate is about 0.025 to about 0.175 millimeters thicker than the support frame.
14. The method of claim 1, wherein the dielectric foam substrate comprises an open cell foam material.
15. The method of claim 1, wherein the support frame is formed from a copper sheet.
16. A single clad supported foam circuit material made by the process of claim 1.
17. A double clad supported foam circuit material made by the process of claim 8.
18. A supported foam circuit laminate, comprising:
a support frame having a first surface, an opposite second surface, an inner rim defining a void, and an outer rim,
a dielectric foam substrate having a first side and an outer second side and a shape defined by edges, wherein the edges of the dielectric foam substrate are fitted within and in continuous contact with inner rim of the support frame; and
an electrically conductive layer having a shape defined by edges, and laminated onto the first surface of the dielectric foam substrate and the support frame, wherein the edges of the electrically conductive layer overlap the inner rim of the support frame.
19. The supported foam circuit laminate of claim 18, wherein the edges of the electrically conductive layer are coterminal with the outer rim of the support frame.
20. The supported foam circuit laminate of claim 18, further comprising an adhesive disposed between the first surfaces of the support frame and dielectric foam substrate and the electrically conductive layer.
21. The supported foam circuit laminate of claim 20, wherein the adhesive has a thickness of less than or equal to about 0.1 millimeters.
22. The supported foam circuit laminate of claim 18, wherein the edges of the electrically conductive layer are coterminal with the outer rim of the support frame.
23. The supported foam circuit laminate of claim 18, further comprising a second electrically conductive layer having a shape defined by edges, and laminated onto the second surface of the dielectric foam substrate and the support frame, wherein the edges of the second electrically conductive layer overlap the inner rim of the support frame.
24. The supported foam circuit laminate of claim 18, wherein the electrically conductive layer comprises copper, silver, aluminum or stainless steel.
25. The supported foam circuit laminate of claim 18, wherein the dielectric foam substrate is about 0.025 to about 0.175 millimeters thicker than the support frame.