1. An oscillatory pressure sensor, comprising:
a stainless-steel pressure sensing diaphragm to a rear side surface of which a fluid pressure is applied;
an oscillator provided on a front side surface of the pressure sensing diaphragm;
a wall body so arranged that it surrounds the oscillator; and
a light transmitting part which closes an opening part of the wall body in an air-tight manner such that an inner space in which the oscillator is installed forms a vacuum chamber.
2. An oscillatory pressure sensor as claimed in claim 1, wherein said oscillator has a bridge structure in which the oscillator comprises a pair of base supports that are symmetrically placed on a surface of the pressure sensing diaphragm, and an oscillatory plate bridging the base supports.
3. An oscillatory pressure sensor as claimed in claim 1, having an optical measuring means in which an incident light beam is permitted to pass through the light transmitting part to enter the vacuum chamber, the light beam reflected by an oscillatory plate that is caused to resonate by an external vibratory force applied from outside of the vacuum chamber is allowed to exit the vacuum chamber through the light transmitting part, and the reflected light beam is detected to measure the resonant frequency of the oscillator so that the fluid pressure detected by the pressure sensing diaphragm is obtained from said resonant frequency.
4. An oscillatory pressure sensor as claimed in claim 3, wherein said optical measuring means comprises an optical fibre for incidence of the light beam, an incident lens causing the incident beam to be focussed upon the surface of the oscillator, a reflection lens for converging the beam reflected by the oscillator, and an optical fibre for reflection to guide the reflected beam.
5. An oscillatory pressure sensor as claimed in claim 3, wherein said optical measuring means comprises a laser-Doppler vibration meter to receive the beam reflected by the oscillator.
6. An oscillatory pressure sensor as claimed in claim 3, wherein said optical measuring means comprises a half-split light-receiving element, wherein changes in the reflected beam are detected by a differential output of the half-split light-receiving element, so that the resonant frequency of the oscillator is obtained.
7. An oscillatory pressure sensor as claimed in claim 3, wherein a piezo-electric actuator is attached to an outer surface of said pressure sensing diaphragm, the wall body or light transmitting part, such that the oscillator of the pressure sensing diaphragm is caused to resonate with the oscillation of the piezo-electric actuator.
8. An oscillatory pressure sensor as claimed in claim 3, wherein an alternating current voltage is applied between an electrode part arranged externally of said light transmitting part and the stainless-steel pressure sensing diaphragm, and the static electric force subjects the diaphragm to a forced oscillation such that the oscillator is caused indirectly to resonate.
9. An oscillatory pressure sensor as claimed in claim 1, having an optical measuring device, arranged so that an incident light beam is permitted to pass through the light transmitting part to enter the vacuum chamber, the light beam being reflected by an oscillatory plate that is caused to resonate by an external vibratory force applied from outside of the vacuum chamber, and allowed to exit the vacuum chamber through the light transmitting part, and the reflected light beam being detected to measure the resonant frequency of the oscillator so that the fluid pressure detected by the pressure sensing diaphragm is obtained from said resonant frequency.
10. An oscillatory pressure sensor as claimed in claim 9, wherein said optical measuring device comprises an optical fibre incidence of the light beam, an incident lens arranged to focus the incident beam upon a surface of the oscillator, a reflection lens arranged to converge the beam reflected by the oscillator, and an optical fibre arranged to guide the reflected beam.
11. An oscillatory pressure sensor as claimed in claim 9, wherein said optical measuring device comprises a laser-Doppler vibration meter to receive the beam reflected by the oscillator.
12. An oscillatory pressure sensor as claimed in claim 9, wherein said optical measuring device comprises a half-split light-receiving element, wherein changes in the reflected beam are detected by a differential output of the half-split light-receiving element, so that the resonant frequency of the oscillator is obtained.
13. An oscillatory pressure sensor as claimed in claim 9, wherein a piezo-electric actuator is attached to an outer surface of said pressure sensing diaphragm, the wall body or light transmitting part, such that the oscillator of the pressure sensing diaphragm is caused to resonate with the oscillation of the piezo-electric actuator.
14. An oscillatory pressure sensor as claimed in claim 9, wherein an alternating current voltage is applied between an electrode part arranged externally of said light transmitting part and the stainless-steel pressure sensing diaphragm, and the static electric force subjects the diaphragm to a forced oscillation such that the oscillator is caused indirectly to resonate.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An interconnection substrate comprising:
a substrate;
a first conductor layer on said substrate, said first conductor layer containing first conductive particles and a binder; and
a second conductor layer on said first conductor layer, said second conductor layer containing second conductive particles,
wherein an average particle size of said second conductive particles is smaller than an average particle size of said first conductive particles.
2. The interconnection substrate according to claim 1, wherein
for a portion where said first conductor layer and said second conductor layer are co-extensive, said first conductor layer and said second conductor layer define an interconnection layer region provided exclusively in a prescribed region part, and
in a remaining region part, for a portion where said first conductor layer and said second conductor layer are not co-extensive, provided exclusively is said first conductor layer.
3. The interconnection substrate according to claim 2, wherein
the average particle size of said second conductive particles is in a range of from 1 nm to 100 nm.
4. The interconnection substrate according to claim 2, wherein
said binder comprises one of thermosetting resin and ultraviolet setting resin.
5. The interconnection substrate according to claim 2, further comprising:
an insulating film covering at least a portion of said interconnection layer region.
6. The interconnection substrate according to claim 2, wherein
said first conductor layer includes a narrowed portion, with said interconnection layer region corresponding to said narrowed portion.
7. The interconnection substrate according to claim 1, wherein
said second conductive particles are in contact with one another and fused to one another.
8. The interconnection substrate according to claim 7, wherein
said first conductor layer also contains some of said second conductive particles in contact with some of said first conductive particles.
9. The interconnection substrate according to claim 1, wherein
said second conductor layer also contains a binder, with an amount of binder contained in said second conductor layer being less than an amount of binder contained in said first conductor layer.
10. The interconnection substrate according to claim 9, wherein
said second conductive particles are in contact with one another and fused to one another.
11. The interconnection substrate according to claim 1, wherein
said first conductive particles comprise metallic conductive particles, and
said second conductive particles comprise metallic conductive particles.
12. A method for fabricating an interconnection substrate, comprising:
applying a first conductive paste layer onto a substrate, said first conductive paste layer containing first conductive particles and a binder;
hardening said binder so as to convert said first conductive paste layer into a first conductor layer having said first conductive particles;
forming a second conductive paste layer on a prescribed region of said first conductor layer, said second conductive paste layer containing second conductive particles having an average particle size smaller than an average particle size of said first conductive particles; and
heating said second conductive paste layer so as to convert said second conductive paste layer into a second conductor layer, on said first conductor layer, having said second conductive particles.
13. The method according to claim 12, wherein
heating said second conductive paste layer results in said second conductive particles coming into contact with one another and fusing to one another.
14. The method according to claim 13, wherein
hardening said binder comprises heating said first conductive paste layer.
15. The method according to claim 14, wherein
said second conductive paste layer also contains a dispersant and an organic binder, and said binder contained in said first conductive paste layer includes, at least in part, a binder having the same composition as said organic binder, and
heating said second conductive paste layer causes said binder having the same composition as said organic binder to affect contact and fusion of said second conductive particles.
16. The method according to claim 13, wherein
applying a first conductive paste layer onto a substrate, hardening said binder, applying a second conductive paste layer onto said first conductor layer, and heating said second conductive paste layer comprises
(i) applying said first conductive paste layer onto said substrate,
(ii) applying said second conductive paste layer onto a prescribed region of said first conductive paste layer, and then
(iii) heating said first conductive paste layer and said second conductive paste layer concurrently.
17. The method according to claim 16, wherein
said second conductive paste layer also contains a dispersant and an organic binder, and said binder contained in said first conductive paste layer includes, at least in part, a binder having the same composition as said organic binder, and
heating said first conductive paste layer and said second conductive paste layer concurrently causes said binder having the same composition as said organic binder to affect contact and fusion of said second conductive particles.
18. The method according to claim 13, wherein
said average particle size of said second conductive particles is in a range of from 1 nm to 100 nm.
19. The method according to claim 13, wherein
heating said second conductive paste layer also results in some of said second conductive particles burrowing into said first conductor layer and coming into contact with some of said first conductive particles.
20. The method according to claim 12, wherein
said first conductive particles comprise metallic conductive particles, and
said second conductive particles comprise metallic conductive particles.