1. A method of transmitting a cyclic shift parameter indicating orthogonality by a base station, the method comprising:
determining a multiple access state of one or more user equipments and determining a cyclic shift parameter so that the user equipment calculates information related to orthogonality; and
transmitting the determined cyclic shift parameter to the user equipment,
wherein the cyclic shift parameter is determined so that information related to orthogonality for each of all layers is calculated based on transmitted one cyclic shift parameter.
2. The method of claim 1, wherein when the multiple access state of the user equipment is Single-User Multiple Input Multiple Output (SU-MIMO), determining of the cyclic shift parameter comprises selecting the cyclic shift parameter among all available cyclic shift parameters allocatable to the user equipment.
3. The method of claim 1, wherein when the multiple access state of the user equipment is Multiple-User Multiple Input Multiple Output (MU-MIMO) and includes a first user equipment and a second user equipment, determining of the cyclic shift parameter comprises:
determining a first cyclic shift parameter which the first user equipment is to receive; and
determining a second cyclic shift parameter which the second user equipment is to receive,
wherein first information related to the orthogonality calculated based on the first cyclic shift parameter is different from second information related to the orthogonality calculated based on the second cyclic shift parameter.
4. The method of claim 3, wherein the cyclic shift parameters allocatable to the user equipments are divided into two sets including a first set and a second set,
the first set and the second set have a relation of a relative prime, the first cyclic shift parameter is an element of the first set, and
the second cyclic shift parameter is an element of the second set.
5. The method of claim 3, wherein a band allocated to the first user equipment is not equal to a band allocated to the second user equipment.
6. The method of claim 1, wherein the information related to the orthogonality is information indicating an orthogonality cover code.
7. The method of claim 6, wherein the orthogonality cover code for each of two or more layers of the user equipment is allocated by using an allocation rule of the orthogonality cover code calculated based on the cyclic shift parameter.
8. A method of transmitting a reference signal by receiving a cyclic shift parameter indicating orthogonality by a user equipment, the method comprising:
calculating information related to orthogonality for a first layer from a cyclic shift parameter received from a base station by the user equipment using two or more layers;
calculating information related to orthogonality for each of remaining layers by using the information related to the orthogonality for the first layer;
generating a reference signal for each of the layers by using the information on the orthogonality for each layer; and
transmitting the generated reference signal to the base station.
9. The method of claim 8, further comprising calculating a cyclic shift parameter for each of the remaining layers by using a cyclic shift parameter for the first layer, in which the cyclic shift parameter received by the user equipment from the base station is a parameter indicating the cyclic shift parameter for the first layer, and
generating of the reference signal comprises generating the reference signal by using the cyclic shift parameter for each of the layers and the information related to the orthogonality together.
10. The method of claim 8, wherein the received cyclic shift parameter belongs to one group among two or more cyclic shift parameter groups,
the cyclic shift parameter group is linked with group-specific orthogonality-related information, and
the information related to the orthogonality is calculated based on information related to orthogonality linked with the cyclic shift parameter group to which the cyclic shift parameter belongs.
11. The method of claim 8, wherein the information related to the orthogonality is information indicating an orthogonality cover code.
12. The method of claim 11, wherein calculating of the information related to the orthogonality further comprises allocating an orthogonality cover code for each of two or more layers of the user equipment by using an allocation rule of the orthogonality cover code calculated based on the cyclic shift parameter.
13. An apparatus for transmitting a cyclic shift parameter indicating orthogonality, the apparatus comprising:
an User Equipment (UE) configuration state determiner for determining a multiple access state of one or more user equipments;
a cyclic shift parameter determiner for determining a cyclic shift parameter according to the determined multiple access state of the user equipment so as to calculate information related to orthogonality;
a signal generator for generating a signal for transmitting control information including the determined cyclic shift parameter to the user equipment; and
a transceiver for transmitting the signal to the user equipment,
wherein the cyclic shift parameter is determined so that information related to orthogonality for each of all layers is calculated based on transmitted one cyclic shift parameter.
14. The apparatus of claim 13, wherein when the multiple access state of the user equipment determined by the UE configuration state determiner is Single-User Multiple Input Multiple Output (SU-MIMO), the cyclic shift parameter determiner determines the cyclic shift parameter by selecting the cyclic shift parameter among all available cyclic shift parameters allocatable to the user equipment.
15. The apparatus of claim 13, wherein when the multiple access state of the user equipment determined by the UE configuration state determiner is Multiple-User Multiple Input Multiple Output (MU-MIMO) and includes a first user equipment and a second user equipment, the cyclic shift parameter determiner determines a first cyclic shift parameter which the first user equipment is to receive and a second cyclic shift parameter which the second user equipment is to receive,
first information related to the orthogonality calculated based on the first cyclic shift parameter is different from second information related to the orthogonality calculated based on the second cyclic shift parameter.
16. The apparatus of claim 15, wherein all available cyclic shift parameters allocatable to the user equipments are divided into two sets including a first set and a second set, and the first set and the second set have a relation of a relative prime, and
the cyclic shift parameter determiner determines the first cyclic shift parameter by selecting the cyclic shift parameter from elements of the first set and determines the second cyclic shift parameter by selecting the cyclic shift parameter from elements of the second set.
17. The apparatus of claim 13, wherein a band allocated to the first user equipment is not equal to a band allocated to the second user equipment.
18. The apparatus of claim 13, wherein the information related to the orthogonality is information indicating an orthogonality cover code.
19. The apparatus of claim 18, wherein the orthogonality cover code is allocated to each of two or more layers of the user equipment by using an allocation rule of the orthogonality cover code calculated based on the cyclic shift parameter.
20. A user equipment for transmitting a reference signal by receiving a cyclic shift parameter indicating orthogonality, the user equipment comprising:
a receiver for receiving control information from a base station by a user equipment using two or more layers;
a cyclic shift parameter extractor for extracting a cyclic shift parameter from a control signal received by the receiver;
an orthogonality related information calculator for calculating information related to orthogonality for a first layer based on the received cyclic shift parameter;
a layer-based information calculator for calculating information related to orthogonality for each of remaining layers by using the information related to the orthogonality for the first layer;
a reference signal generator for generating a reference signal for each of the remaining layers by using the information on the orthogonality for each of the layers; and
a transmitter for transmitting the generated reference signal to the base station.
21. The user equipment of claim 20, wherein the cyclic shift parameter received from the base station by the user equipment is a parameter indicating a cyclic shift parameter for the first layer,
the layer-based information calculator calculates a cyclic shift parameter for each of the remaining layers by using the cyclic shift parameter for the first layer, and
the reference signal generator generates the reference signal by using the cyclic shift parameter for each of the layers and the information related to the orthogonality together.
22. The user equipment of claim 20, wherein the received cyclic shift parameter belongs to one group among two or more cyclic shift parameter groups, and
the cyclic shift parameter group is linked with group-specific orthogonality-related information, and information related to orthogonality is calculated based on information related to orthogonality linked with the cyclic shift parameter group to which the cyclic shift parameter belongs.
23. The user equipment of claim 20, wherein the information related to the orthogonality is information indicating an orthogonality cover code.
24. The user equipment of claim 23, wherein the orthogonality related information calculator allocates an orthogonality cover code for each of two or more layers of the user equipment by using an allocation rule of the orthogonality cover code calculated based on the cyclic shift parameter.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor device comprising:
an encapsulater comprising an insulating resin, lead exposed to a mounting surface of said encapsulater and a gate cured resin which remains as a result to form said encapsulater;
wherein said gate cured resin exists in a portion between the adjacent leads with a thickness identical to or smaller than the thickness of said each lead.
2. A semiconductor device comprising:
an encapsulater comprising an insulating resin, lead and tub-suspension leads exposed to a mounting surface of said encapsulater and a gate cured resin which remains as a result to form said encapsulater;
wherein said gate cured resin exists in a portion between said each tub-suspension lead and said lead with a thickness identical to or smaller than the thickness of said each tub-suspension lead.
3. A semiconductor device comprising:
an encapsulater comprising an insulating resin, leads and tub-suspension leads exposed to a mounting surface of said encapsulater and a gate cured resin and air vent cured resins which remains as a result to form said encapsulater;
wherein each of said gate cured resin and said air vent cured resins exists in a portion between said each tub-suspension lead and said lead with a thickness identical to or smaller than the thickness of each of resin burrs.
4. A semiconductor device comprising:
an encapsulater comprising an insulating resin, leads and tub-suspension leads exposed to a mounting surface of said encapsulater and a gate cured resin and air vent cured resins which remains as a result to form said encapsulater;
wherein said gate cured resin and said air vent cured resins respectively extend from the edges of said encapsulater with a predetermined thickness and have obverse and reverse sides formed as flat surfaces.
5. The semiconductor device according to claim 4, wherein said gate cured resin partly overlaps with said tub-suspension lead.
6. The semiconductor device according to claim 4, wherein said air vent cured resins partly overlap with said tub-suspension leads respectively.
7. The semiconductor device according to claim 4, wherein said gate cured resin partly overlaps with at least one lead.
8. The semiconductor device according to claim 4, wherein said air vent cured resins partly overlap with at least one lead.
9. A method of manufacturing a semiconductor device, comprising the steps of:
preparing a lead frame having a frame portion, a plurality of leads which protrude inwardly in the frame portion from the frame portion, and a plurality of tub-suspension leads which protrude inwardly in the frame portion from the frame portion and support a tub at leading end portions thereof;
fixing a semiconductor chip to one surface of the tub;
electrically connecting electrodes of the semiconductor chip and the leads;
covering the semiconductor chip and the leads with an encapsulater comprising an insulating resin and exposing the leads and the tub-suspension leads to a mounting surface of the encapsulater; and
cutting the leads and the tub-suspension leads,
wherein a vertical space defined by only the sides of the leads and the tub-suspension leads is used as a resin flow path to form the encapsulater, and the leads and the tub-suspension leads are cut at a resin portion cured in the vertical space defined by only the sides of the leads and the tub-suspension leads.
10. The method according to claim 9, wherein a gate provided in a mold die is provided outside the vertical space defined by only the sides of the leads and the tub-suspension leads, and a resin passes through the gate and flows through the vertical space to thereby form the encapsulater.
11. The method according to claim 9, wherein air vents defined in the mold die are provided outside the vertical space defined by only the sides of the leads and the tub-suspension leads, and the resin passes through the vertical space and goes through the air vents.
12. A method of manufacturing a semiconductor device, comprising the steps of:
preparing a lead frame having a frame portion, a plurality of leads which protrude inwardly in the frame portion from the inside of the frame portion, and a plurality of tub-suspension leads which protrude inwardly in the frame portion from the inside of the frame portion and support a tub at leading end portions thereof;
fixing a semiconductor chip to one surface of the tub;
electrically connecting electrodes of the semiconductor chip and the leads;
covering the semiconductor chip and the leads with an encapsulater comprising an insulating resin and exposing the leads and the tub-suspension leads to a mounting surface of the encapsulater; and
cutting the leads and the tub-suspension leads,
wherein a vertical space thicker than the thickness of each of the leads and the tub-suspension leads is used as a resin flow path to form the encapsulater, and the leads and the tub-suspension leads are cut at a resin portion cured in the vertical space thicker than the thickness of each of the leads and the tub-suspension leads.
13. The method according to claim 12, wherein a gate provided in a mold die is provided outside the vertical space thicker than the thickness of each of the leads and the tub-suspension leads, and a resin passes through the gate and flows through the vertical space to thereby form the encapsulater.
14. The method according to claim 12, wherein air vents defined in the mold die are provided outside the vertical space thicker than the thickness of each of the leads and the tub-suspension leads, and the resin passes through the vertical space and goes through the air vents.
15. The method according to claim 12, wherein a matrix type lead frame in which unit lead frame patterns are vertically and horizontally arranged in line, is prepared as the lead frame.
16. The method according to claim 12, wherein said lead frame is given solder plating used for its mounting.