1. A motor with a variable magnetic flux, which includes a rotor and a stator located inside the rotor,
wherein the rotor comprises a rotor housing, a rotor core attached to the inner circumference of the rotor housing, and magnets attached to the inner surface of the rotor core,
wherein the stator comprises a stator core base and a plurality of teeth radially formed on the outer peripheral surface of the stator core base at equal intervals, and each of the teeth has ears formed at both sides of an end thereof, and
wherein the magnets are divided into first magnets and second magnets, the second magnets are low in coercive force than the first magnets, and a plurality of the first magnets are located at both sides of the second magnets.
2. The motor according to claim 1, wherein the first magnets are ferrite magnets and the second magnets are alnico magnets.
3. The motor according to claim 1, wherein the rotor core is formed by a plurality of unit rotor cores connected with each other.
4. The motor according to claim 3, wherein laser welding lines are formed at both sides of the unit rotor core.
5. The motor according to claim 3, wherein at least one first combining groove is vertically formed on the outer surface of the unit rotor core.
6. The motor according to claim 3, wherein at least one second combining groove is vertically formed on the inner surface of the unit rotor core.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A microstructure inspecting apparatus for evaluating a characteristic of at least one microstructure having a movable section formed on a substrate, comprising:
a probe, which electrically connects with an inspection electrode formed on the microstructure, for obtaining an electric signal of the microstructure;
a plurality of nozzles, positioned in the vicinity of the movable section of the microstructure, for discharging or sucking a gas;
a gas flow rate control unit for controlling a flow rate of the gas discharged from or sucked into the plurality of nozzles; and
an evaluation unit for detecting a displacement of the movable section of the microstructure by using the electric signal obtained through the probe, wherein the displacement is made by the gas discharged from or sucked into the plurality of nozzles, and evaluating the characteristic of the microstructure based on the detected result.
2. The microstructure inspecting apparatus of claim 1, further comprising:
a probe card, connected to the evaluation unit, including the probe and the plurality of nozzles.
3. The microstructure inspecting apparatus of claim 1, further comprising:
at least one sound wave generating unit for outputting a test sound wave to the movable section of the microstructure.
4. The microstructure inspecting apparatus of claim 1, further comprising:
a conducting unit for electrically connecting the probe with the inspection electrode by using a fritting phenomenon.
5. The microstructure inspecting apparatus of claim 1, wherein the gas flow rate control unit removes foreign substances adhered to the microstructure by controlling the flow rate of the gas discharged from or sucked into the plurality of nozzles.
6. The microstructure inspecting apparatus of claim 2, wherein the probe card further includes a foreign substance detecting unit for detecting foreign substances adhered to the microstructure, and
if the foreign substances are detected by the foreign substance detecting unit, the gas flow rate control unit removes the foreign substances adhered to the microstructure by controlling the flow rate of the gas discharged from or sucked into the plurality of nozzles.
7. The microstructure inspecting apparatus of claim 6, wherein the foreign substance detecting unit determines presence and location of the foreign substances by means of an image analyzing unit.
8. The microstructure inspecting apparatus of claim 1, wherein the microstructure is an acceleration sensor formed on the substrate.
9. The microstructure inspecting apparatus of claim 1, wherein the microstructure is a device formed on a semiconductor wafer.
10. A microstructure inspecting method comprising:
in order to obtain an electric signal of at least one microstructure having a movable section formed on a substrate, contacting a probe with a pad formed on the microstructure;
positioning nozzles for discharging or sucking a gas in the vicinity of the movable section of the microstructure, to displace the movable section of the microstructure;
displacing the movable section of the microstructure by discharging or sucking the gas from the nozzles;
detecting a displacement of the movable section of the microstructure by using the electric signal obtained through the probe, wherein the displacement is made by the gas discharged from or sucked into the nozzles; and
evaluating a characteristic of the microstructure based on the displacement of the movable section detected by the electric signal.