1. A high voltage device, comprising:
a substrate;
two heavily doped regions of a second conductivity type in the substrate;
at least two isolation regions in the semiconductor substrate and between the two heavily doped regions;
a heavily doped region of a first conductivity type disposed in the substrate and between the two isolation regions;
a dielectric layer on the heavily doped region of the first conductivity type;
a metal layer separated from the heavily doped region of a first conductivity type by the dielectric layer, wherein a portion of the metal layer overlies a portion of the dielectric layer overlying the heavily doped region of a first conductivity type, and at least a portion of the metal layer directly overlies the dielectric layer, the heavily doped region of the first conductivity type and the at least two isolation regions; and
a diffusion region of the first conductivity type surrounding the heavily doped region of the first conductivity type and disposed between the heavily doped regions of the second conductivity type,
wherein the metal layer is not electrically connected to the doped region of the first conductive type.
2. The high voltage device as claimed in claim 1, wherein the heavily doped region of the first conductivity type cuts turning-on current path below the two isolation regions from one of the two heavily doped regions to another one of the two heavily doped regions when a bias is applied to the high voltage device.
3. The high voltage device as claimed in claim 1, wherein each isolation region is a local oxidation of silicon (LOCOS).
4. The high voltage device as claimed in claim 1, wherein the surface concentration of the heavily doped region of the first conductivity type is about 5*1014 to about 5*1015 atomscm2.
5. The high voltage device as claimed in claim 1, wherein each isolation region is a shallow trench isolation (STI).
6. The high voltage device as claimed in claim 1, wherein surfaces the two heavily doped regions of the second conductivity type and the heavily doped region of the first conductivity type are co-planar with the substrate surface.
7. The high voltage device as claimed in claim 1, wherein each isolation region is a deep trench isolation (DTI) structure.
8. The high voltage device as claimed in claim 1, wherein junction depth of the heavily doped region of the first conductivity type is larger than about 0.2 \u03bcm.
9. The high voltage device as claimed in claim 1, wherein width of the heavily doped region of the second conductivity type is larger than about 0.5 \u03bcm.
10. The high voltage device as claimed in claim 1, further comprising a first diffusion region of the second conductivity type surrounding one of the heavily doped regions of the second conductivity type.
11. The high voltage device as claimed in claim 10, further comprising a second diffusion region surrounding the other heavily doped region of the second conductivity type.
12. The high voltage as claimed in claim 1, wherein the high voltage device with the metal layer as a gate can be applied with an electrical bias higher than about 15V.
13. The high voltage as claimed in claim 1, wherein the high voltage device with the metal layer as a gate can be applied with an electrical bias higher than about 30V.
14. The high voltage as claimed in claim 1, wherein the high voltage device with the metal layer as a gate can be applied with an electrical bias exceeding about 50V.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A female receptacle connector comprising:
an insulator core;
a plurality of pins embedded in the insulator core, wherein each pin contains an electrically conductive material, the plurality of pins comprising a first and a second set of pins, wherein front ends of the first set of pins are configured to mate with electrical contacts of a corresponding connector, wherein the insulator core includes an opening for receiving the electrical contacts of the corresponding connector;
at least one active optical component for receiving andor transmitting optical signals to the corresponding connector, wherein the second set of pins extend to a substrate that is attached to the at least one active optical component; and
a lens device extending from the at least one active optical component to a front of the connector, wherein the lens device carries optical signals to or from an optical device of the corresponding connector,
wherein at least a portion of the second set of pins are communicably coupled with the at least one active optical component and are configured to carry electrical signals corresponding to the optical signals.
2. The connector of claim 1, wherein the front ends of the first set of pins lie on at least two inner surfaces of the opening.
3. The connector of claim 2, wherein the opening has a top inner surface, a bottom inner surface, and two side inner surfaces; wherein the first set of pins comprise at least six pins, and wherein at least two pins are located on the top inner surface of the opening, at least two pins are located on the bottom inner surface of the opening, and at least one pin is located on each side inner surface of the opening.
4. The connector of claim 3, wherein the pins located on each side inner surface of the opening are configured to provide ground, at least one of the pins on the top inner or bottom inner surface is configured to carry power, and the remaining pins are configured to carry data signals and an identification signal.
5. The connector of claim 2, wherein the opening has two side inner surfaces, and wherein each side inner surface comprises a retention mechanism for engaging a side of an insert of the corresponding connector.
6. The connector of claim 5, wherein the first set of pins comprise a pin located on each side inner surface of the opening, and wherein the pins located on the side inner surfaces act as the retention mechanism by engaging notches in the sides of the insert of the corresponding connector.
7. The connector of claim 1, wherein the first set of pins extend from a circuit board to a front of the connector, and wherein the second set of pins extend from the circuit board to the substrate that is attached to the at least one active optical component.
8. The connector of claim 1, wherein the lens device includes aligning elements that receive the optical device of the corresponding connector and aligns the optical device with a lens of the lens device.
9. The connector of claim 1, wherein the at least one active optical component includes:
a laser device that receives electrical signals from a first portion of the second set of pins and that converts the received electrical signals to electromagnetic radiation.
10. The connector of claim 9, wherein the laser device includes a laser and electrical components, wherein the electrical components receive the electrical signals from the first portion of the second set of pins and generates input signals to the laser.
11. The connector of claim 9, wherein the at least one active optical component includes:
a photodiode device that receives electromagnetic radiation from the corresponding connector and that converts the received electromagnetic radiation to electrical signals on a second portion of the first set of pins.
12. The connector of claim 1, wherein the second set of pins are attached at a back of the substrate, wherein the at least one active optical component is attached to the back of the substrate, the connector further comprising:
one or more respective lens devices optically coupled to a respective one of the at least one active optical component, wherein the lens devices are at a front of the substrate, and wherein the substrate has one or more respective holes between each of the least one active optical component and the respective lens devices.
13. The connector of claim 12, wherein at least two of the pins of the second set are connected together via a plate at the end of the at least two pins, the at least two pins configured to carry ground, wherein the plate is attached to the substrate over the at least one active optical component.
14. A male plug connector comprising:
an insulator core having an insert portion that extends from a base of the insulator core, wherein the insert portion is configured to fit inside a receptacle portion of a corresponding female connector, the insert portion having a plurality of contact locations; and
at least one optical device for receiving andor transmitting optical signals to the corresponding female connector,
wherein a front end of the at least one optical device is on the base of the insulator core at a location separate from the insert portion.
15. The male plug connector of claim 14, wherein the insert portion has a length from the base to a front end of the insert portion, and wherein the at least one optical device extends from the base less than one quarter of the length of the insert portion in the direction of insertion.
16. The male plug connector of claim 14, further comprising:
a spring that pushes the at least one optical device forward to engage a lens device of the corresponding female connector.
17. The male plug connector of claim 16, wherein the optical device has angled edges for engaging angles edges of the lens device of the corresponding connector.
18. The male plug connector of claim 14, further comprising:
a plurality of contacts embedded in the insulator core at the contact locations, wherein each contact contains an electrically conductive material, and wherein the contacts are configured to mate with electrical contacts in the receptacle portion of the corresponding female connector.
19. The male plug connector of claim 18, wherein the contacts extend to a front edge of the insert portion.
20. The male plug connector of claim 18, wherein the contacts reside in a single row.
21. The male plug connector of claim 18, wherein the insert potion has first and second major opposing surfaces, two side surfaces, and a front surface; and wherein a first portion of the plurality of contacts are located on the first major opposing surface and a second portion of the plurality of contacts are located on another surface of the insert portion.
22. The male plug connector of claim 21, wherein at least two contacts are located on the first major opposing surface, at least two contacts are located on the second major opposing surface, at least one contact is located on a first side surface, and at least one contact is located on a second side surface.