1. A battery, comprising:
at least one battery cell having at least one gas vent pipe defining an open bottom into which gas can pass;
at least one cell can holding the pipe within battery cell structure, a gap being established between at least a portion of a bottom periphery of the pipe and the battery can to reduce the risk of battery damage from inadequate gas venting;
wherein the gap is established to be at least a predetermined fraction of a transverse dimension parameter of the pipe; and
wherein the transverse dimension parameter is a diameter and the fraction is no more than one-third.
2. The battery of claim 1, comprising a flange engaged with a top segment of the pipe and oriented substantially perpendicular to the axis of the pipe, the flange resting on at least part of the cell structure.
3. The battery of claim 2, wherein the flange is made integrally with the pipe.
4. The battery of claim 1, wherein the cell structure includes at least one electrode configured to be concentric with the pipe.
5. The battery of claim 1, wherein the pipe is cylindrical and is coaxial with the can.
6. The battery of claim 1, wherein the pipe is not cylindrical.
7. The battery of claim 1, wherein the transverse dimension parameter is a diameter and the fraction is one quarter.
8. The battery of claim 1, wherein the bottom periphery is scalloped.
9. The battery of claim 1, comprising plural pipes.
10. Apparatus comprising:
a system to be powered; and
a battery electrically connected to the system to power electrical components thereof, the battery comprising:
at least one battery cell having at least one gas vent pipe defining an open bottom into which gas can pass;
at least one cell can holding the pipe within battery cell structure, a gap being established between at least a portion of a bottom periphery of the pipe and the battery can to reduce the risk of battery damage from inadequate gas venting;
wherein the gap is established to be at least a predetermined fraction of a transverse dimension parameter of the pipe; and
wherein the transverse dimension parameter is a diameter and the fraction is less than one.
11. The apparatus of claim 10, comprising a flange engaged with a top segment of the pipe and oriented substantially perpendicular to the axis of the pipe, the flange resting on at least part of the cell structure.
12. The apparatus of claim 11, wherein the flange is made integrally with the pipe.
13. The apparatus of claim 10, wherein the cell structure includes at least one electrode configured to be concentric with the pipe.
14. The apparatus of claim 10, wherein the pipe is cylindrical and is coaxial with the can.
15. The apparatus of claim 10, wherein the pipe is not cylindrical.
16. The apparatus of claim 10, wherein the transverse dimension parameter is a diameter and the fraction is one quarter.
17. The apparatus of claim 10, wherein the bottom periphery is scalloped.
18. The apparatus of claim 10, comprising plural pipes.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A circuit module configured for connective mating with a SFF-8639 compliant receptacle, the circuit module comprising:
a PCB with a tab, the tab having a tab thickness and a first plurality of conductive pads disposed along a first conductive pad plane;
the PCB further having a first plurality of etch traces, the first plurality of etch traces being disposed at a first etch trace plane and individual etch traces of the first plurality of etch traces being connected to individual ones of the first plurality of conductive pads, the first conductive pad plane and the first etch trace plane being substantially coplanar.
2. The circuit module of claim 1 further comprising a second plurality of conductive pads disposed along a second conductive pad plane, the PCB further having a second plurality of etch traces, the second plurality of etch traces being disposed at a second etch trace plane and individual ones of the second plurality of etch traces being connected to individual conductive pads of the second plurality of conductive pads, the second conductive pad plane and the second etch trace plane being substantially coplanar.
3. The circuit module of claim 1 in which the tab meets dimensional requirements for a 8639 blade as specified in the SFF 8639 Specification.
4. The circuit module of claim 1 in which the first conductive pad plane is an extension of a first major surface of the PCB.
5. The circuit module of claim 2 in which the first conductive pad plane is an extension of a first major surface of the PCB and the second conductive pad plane is an extension of a second major surface of the PCB.
6. The circuit module of claim 3 in which the tab has a tab width and the tab width is compliant with a width specified in the SFF 8639 Specification for the 8639 blade.
7. The circuit module of claim 3 in which the tab thickness is compliant with a thickness specified in the SFF 8639 Specification for the 8639 blade.
8. The circuit module of claim 2 in which the tab meets dimensional requirements for a blade as specified in the SFF 8639 Specification.
9. The circuit module of claim 8 in which the tab has a tab width and the tab width is compliant with a width specified in the SFF 8639 Specification for the 8639 blade.
10. The circuit module of claim 8 in which the tab thickness is compliant with a thickness specified in the SFF 8639 Specification for the 8639 blade.
11. The circuit module of claim 2 in which the tab includes a key adjunct having a plurality of key conductive pads, the plurality of key adjunct conductive pads being arranged to meet dimensional requirements of the SFF 8639 Specification for a key set of contacts on a 8639 blade.
12. The circuit module of claim 11 in which the circuit module is compliant with the PCIe protocol standard.
13. The circuit module of claim 2 in which the circuit module is an SSD.
14. The circuit module of claim 11 in which the circuit module is an SSD.
15. The circuit module of claim 10 in which the first conductive pad plane is an extension of a first major surface of the PCB and the second conductive pad plane is an extension of a second major surface of the PCB.
16. A circuit module configured for connective mating with a SFF-8639 compliant receptacle, the circuit module comprising:
a PCB having a tab with a tab thickness and a first plurality of conductive pads disposed along a first conductive pad plane on a first side of the tab, the tab being compliant with dimensional requirements for an 8639 blade as specified in the SFF 8639 Specification;
the PCB further having a first plurality of etch traces, the first plurality of etch traces being disposed on a first side of the PCB at a first PCB side plane and individual ones of the first plurality of etch traces being connected to individual ones of the first plurality of conductive pads, the first conductive pad plane and the first PCB side plane being substantially coplanar; and
a second plurality of conductive pads disposed along a second conductive pad plane on a second side of the tab, the PCB further having a second plurality of etch traces, the second plurality of etch traces being disposed on a second side of the PCB at a second PCB side plane and individual ones of the second plurality of etch traces being connected to individual ones of the second plurality of conductive pads, the second conductive pad plane and the PCB side plane being substantially coplanar.
17. The circuit module of claim 16 in which the tab includes a key adjunct along which is disposed a third plurality of conductive pads connected to circuitry populated upon the PCB.
18. The circuit module of claim 17 in which the key adjunct meets dimensional requirements of the SFF-8639 Specification for a key of the 8639 blade.
19. The circuit module of claim 16 in which the circuit module is an SSD.
20. The circuit module of claim 17 in which the circuit module is an SSD.
21. A circuit module configured for connective mating with a SFF 8639 Specification compliant socket, the circuit module comprising:
a PCB having a first PCB side establishing plane Px and a second PCB side that establishes plane Py;
the PCB being configured with a tab that shares the first PCB side and second PCB side of the PCB, the tab being configured to be compliant with dimensional requirements for a 8639 blade as specified in the SFF 8639 Specification, the tab having on its first PCB side, plural conductive pads comprising a first set of conductive pads and on its second PCB side, plural conductive pads comprising a third set of conductive pads;
a tab key adjunct emergent from the first PCB side of the tab, the tab key adjunct being configured to be compliant with dimensional requirements for a key as specified in the SFF 8639 Specification, the tab key adjunct having plural conductive pads comprising a second set of conductive pads, the constituent conductive pads of each of the first, second, and third sets of conductive pads being compliant with dimensional requirements for contacts of the 8639 blade as specified in the SFF 8639 Specification; and
each of the constituent conductive pads of the first set of conductive pads being connected to one or more respective first side etch traces borne at least in part on the first PCB side so that the one or more respective first side etch traces and the constituent conductive pads of the first set of conductive pads are substantially coincident with the plane Px.
22. The circuit module of claim 21 in which the constituent conductive pads of the third set of conductive pads are connected to one or more second side respective etch traces borne at least in part on the second PCB side so that the one or more second side respective etch traces and the constituent conductive pads of the second set of conductive pads are substantially coincident with the plane Py.
23. The circuit module of claim 22 in which the dimensional requirements for the 8639 blade as specified in the SFF 8639 Specification with which the tab is configured for compliance include a width for the 8639 blade.
24. The circuit module of claim 23 in which the constituent conductive pads of the first set of conductive pads are of the same number and substantially the same size and position as specified in the SFF 8639 Specification for a set of contacts for the 8639 blade.
25. The circuit module of claim 23 in which the constituent conductive pads of the third set of conductive pads being of the same number and substantially the same size and position as specified in the SFF 8639 Specification for a third set of contacts for the 8639 blade.
26. The circuit module of claim 23 in which constituent conductive pads of the second set of conductive pads being of the same number and substantially the same size and position as specified in the SFF 8639 Specification for a second set of contacts associated with a key of the 8639 blade.
27. The circuit module of claim 23 further comprising a connector housing having a front portion and a rear portion, the rear portion of the connector housing having a pair of laterally-opposed guide arms with guide slots through which the PCB is disposed; and
the connector housing having a slot profile from which emerges, the tab along with its tab key adjunct.
28. The circuit module of claim 23 in which the circuit module is an SSD.
29. The circuit module of claim 27 in which the circuit module is an SSD complaint with a PCIe signaling protocol.
30. A circuit module configured for connective mating with a SFF 8639 Specification-compliant receptacle, the circuit module comprising:
a PCB having a first PCB side establishing plane Px and a second PCB side that establishes plane Py, the PCB being configured with a tab that shares the first PCB side and second PCB side of the PCB with the PCB, the tab being configured to be compliant with dimensional requirements for the 8639 blade as specified in the SFF 8639 Specification, the tab having on its first PCB side, plural conductive pads comprising a first set of conductive pads and on its second PCB side, plural conductive pads comprising a second set of conductive pads;
the PCB being populated with integrated circuits that store information;
integrated with the PCB, a connector housing configured for connective fit with a SFF 8639 Specification compliant receptacle;
the connector housing having a front portion and a rear portion;
the rear portion having a pair of laterally-opposed guide arms with guide slots into which are disposed the first and second lateral tabs of the PCB; and
the connector housing having a slot profile from which emerges the tab of the PCB.