1. A package structure comprising:
a chip having conductive bumps; and
a lead frame having holes thereon for accommodating said conductive bumps, said chip bonds to said lead frame via said conductive bumps.
2. The package structure according to claim 1, wherein said lead frame comprises a die attach pad and leads, and said holes are on said leads.
3. The package structure according to claim 1 further comprising a protecting dielectric material.
4. The package structure according to claim 3, wherein said protecting dielectric material comprises a molding compound.
5. A package structure comprising:
a chip having conductive bumps;
a lead frame, said chip bonds to said lead frame via said conductive bumps; and
a positioning film on said lead frame, said positioning film having openings for accommodating said conductive bumps.
6. The package structure according to claim 5, wherein said lead frame comprises a die attach pad and leads, and said openings are superimposed on said leads.
7. The package structure according to claim 5 further comprising a protecting dielectric material.
8. The package structure according to claim 7, wherein said protecting dielectric material comprises a molding compound.
9. A package structure comprising:
a chip having conductive bumps;
a lead frame having holes thereon for accommodating said conductive bumps, said chip bonds to said lead frame via said conductive bumps; and
a positioning film on said lead frame, said positioning film have openings for accommodating said conductive bumps, each said opening is superimposed on each said hole.
10. The package structure according to claim 9, wherein said lead frame comprises a die attach pad and leads, and said openings and said holes are on said leads.
11. The package structure according to claim 9 further comprising a protecting dielectric material.
12. The package structure according to claim 11, wherein said protecting dielectric material comprises a molding compound.
13. A lead frame module of a package structure comprising:
a lead frame comprising leads having holes thereon for accommodating conductive bumps of a chip, said chip bonds to the lead frame via said conductive bumps; and
a positioning film on said lead frame, said positioning film have openings for accommodating said conductive bumps, each said opening is superimposed on each said hole.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An adhesive system comprising a mixture of:
a) a melamine-formaldehyde resin;
b) a phenol-formaldehyde resin; and
c) a cross-linkable polyvinyl acetate emulsion resin, wherein the mixture is cured with an acid.
2. The adhesive system of claim 1, wherein the melamine-formaldehyde resin is present in an amount ranging from about 5 to about 50 wt. %, based on the total weight of the mixture.
3. The adhesive system of claim 1, wherein the phenol-formaldehyde resin is present in an amount ranging from about 10 to about 50 wt. %, based on the total weight of the mixture.
4. The adhesive system of claim 1, wherein the cross-linkable polyvinyl acetate emulsion resin is present in an amount ranging from about 23 to about 72 wt. %, based on the total weight of the mixture.
5. The adhesive system of claim 1, wherein the acid is a 95% solution of formic acid in water.
6. The adhesive system of claim 5, wherein the formic acid is present in an amount ranging from about 1 to about 20 wt. %, based on the total weight of the mixture.
7. The adhesive system of claim 1, wherein the acid is a 70% methane sulfonic acid solution in water.
8. The adhesive system of claim 7, wherein the methane sulfonic acid is present in an amount ranging from about 1 to about 20 wt. %, based on the total weight of the mixture.
9. The adhesive system of claim 1, wherein the acid is a 70% toluene sulfonic acid solution in water.
10. The adhesive system of claim 9, wherein the toluene sulfonic acid is present in an amount ranging from about 1 to about 20 wt. %, based on the total weight of the mixture.
11. The adhesive system of claim 1, wherein the acid is aluminum chloride.
12. The adhesive system of claim 11, wherein the aluminum chloride is present in an amount ranging from about 1 to about 20 wt. %, based on the total weight of the mixture.
13. The adhesive system of claim 1, wherein the mixture has a pH ranging from about 1 to about 5.
14. The adhesive system of claim 1, wherein the mixture has a pH ranging from 3.5 to 4.5.
15. The adhesive system of claim 1, wherein the mixture is cured with heat.